Patents by Inventor Wu Chih-Hung

Wu Chih-Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for making semiconductor electrodes
    Publication number: 20110017604
    Abstract: Disclosed is a method for making semiconductor electrodes. In the method, there is provided a wafer. The wafer includes first metal layers. A second metal layer is provided on the wafer so that the first metal layers are shielded with the second metal layer. Photo-resist is provided on the second metal layer so that the first metal layers are not shielded with the photo-resist. An electroplating device is used to provide third metal layers on the second metal layer so that each of the first metal layers is shielded with a related one of the third metal layers. The wafer is divided from the photo-resist, thus forming semiconductor electrodes.
    Type: Application
    Filed: April 23, 2008
    Publication date: January 27, 2011
    Applicant: ATOMIC ENERGY COUNCIL - INSTITUTE OF NUCLEAR ENERGY RESEARCH
    Inventors: Wu Chih-Hung, Chao Chih-Kang, Kao Chi-Joe, Lu Zih-Sian, Liu Keng-Shen, Chen Ying-Ru
  • Method for making semiconductor electrodes
    Publication number: 20100323515
    Abstract: Disclosed is a method for making semiconductor electrodes. In the method, there is provided a wafer. The wafer includes at least one conductive unit, a plurality of first connective units connected to the conductive unit, a plurality of first metal layers connected to the first connective units and a plurality of second connective units connected to the first metal layers. Photo-resist is provided on the first and second connective units. A second metal layer is provided on each of the first metal layers via using an electroplating device. The wafer is cut from the photo-resist, thus forming semiconductor electrodes.
    Type: Application
    Filed: April 23, 2008
    Publication date: December 23, 2010
    Applicant: ATOMIC ENERGY COUNCIL- INSTITUTE OF NUCLEAR ENERGY RESEARCH
    Inventors: Wu Chih-Hung, Liu Keng-Shen, Chang Chun-Ling, Chen Ying-Ru
  • Pre-cut wafer structure with heat stress effect suppressed
    Publication number: 20080280146
    Abstract: A wafer is cut before a heat treatment. By the cutting, cutting lines are not bended after the heat treatment. A cutting accuracy is therefore improved and a good light-shining efficiency is obtained.
    Type: Application
    Filed: May 11, 2007
    Publication date: November 13, 2008
    Applicant: ATOMIC ENERGY COUNCIL - INSTITUTE OF NUCLEAR ENERGY RESEARCH
    Inventors: Wu Chih-Hung, Chang Kai-Sheng, Chu Kuan-Yu