Patents by Inventor Wunnava Venkata Subbarao

Wunnava Venkata Subbarao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4093971
    Abstract: A cooling system for integrated circuit packaging of the conventional dual-in-line (DIP) type, including a cold bar which engages the DIPs and is thermally and mechanically connected at both ends to a cooling frame in which a serpentine tubing carries coolant throughout spaced-apart sections thereof. Clamping means clamp the DIPs tight against the cold bar so that heat generated by the DIPs is carried away through the cold bar into the frame sections where the coolant circulates. The cold bar is disposed so that discrete components may be disposed on the island in a manner to save lateral space, and a multiplicity of these DIPs, cold bars, etc. are mounted on the cooling frame to form a DIP island cooling frame and may include, for example, driver buffer logic, random access memories, as well as I/O logic. Each DIP island can be connected to a cooling frame having other types of integrated circuits and housed in the same console or housed along with similar DIP islands in a similar console, as desired.
    Type: Grant
    Filed: December 10, 1976
    Date of Patent: June 6, 1978
    Assignee: Burroughs Corporation
    Inventors: Bing-Lun Chu, Wunnava Venkata Subbarao, Jack Peale, Kent McCune, Marvin Elroy Steiner