Abstract: A flatness sensing device includes a pressure sensing unit and a controller. The pressure sensing unit includes a plate portion, and a pressure sensor fixed and exposed at an edge of the plate portion. A sensing surface of the pressure sensor is flush with the bottom surface of the plate portion. The pressure sensor senses a pressure or lack of pressure of an object to be tested when it touches the object to be tested. The controller receives the pressure value output from the pressure sensor and determines a flatness of the object to be tested, the controller can issue an alarm on finding non-flatness and cause the degree of flatness to be displayed to a user.

Abstract: A cutting device configured to cut a workpiece includes a base and a cover plate. The cover plate includes a base plate, a pressing member, and an elastic member. A surface of the base plate facing the base defines a receiving groove configured to receive the pressing member. The pressing member defines a number of first cutter slots to allow cutters to pass through to cut the workpiece located between the base and the cover plate. The elastic member includes a connecting portion and an elastic portion. The connecting portion is fixedly coupled to the pressing member and partially extends beyond an edge of the pressing portion. One end of the elastic portion abuts against the base plate, and a second end of the elastic portion is coupled to the connecting portion.

Abstract: A telescopic mechanism includes a mounting base, a telescopic block received within the mounting base, and a pushing rod received within the mounting base. The telescopic block is vertically arranged in the mounting base, and the pushing rod is horizontally arranged in the mounting base. The telescopic block defines a guiding channel. The pushing rod passes through the guiding channel. The pushing rod is driven through the guiding channel to cause the telescopic block to extend or retract relative to the mounting base.

Abstract: A method for checking the proper dispensation of glue onto a circuit board in manufacture includes the use of fluorescent materials in such glue, activating a light source to illuminate a circuit board when the circuit board is placed on an electronic device, and controlling an image capturing device to capture an image of the circuit board. The image captured by the capturing device is compared with a standard stored image of the circuit board, and a determination is made as to whether the circuit board passes test according to the comparison.

Abstract: A flatness sensing device includes a pressure sensing unit and a controller. The pressure sensing unit includes a plate portion, and a pressure sensor fixed and exposed at an edge of the plate portion. A sensing surface of the pressure sensor is flush with the bottom surface of the plate portion. The pressure sensor senses a pressure or lack of pressure of an object to be tested when it touches the object to be tested. The controller receives the pressure value output from the pressure sensor and determines a flatness of the object to be tested, the controller can issue an alarm on finding non-flatness and cause the degree of flatness to be displayed to a user.

Abstract: A stub plucking device includes a transfer mechanism, a grasping mechanism, and a sensing mechanism. The grasping mechanism is driven by the transfer mechanism to move toward or away from a reel. The grasping mechanism includes a connector mounting a movable clasp, a fixed clasp, and a grasping driving member. The grasping driving member drives the movable clasp to move toward the fixed clasp to grasp an end stub of the reel. The sensing mechanism senses whether a contact force between the fixed clasp and the reel has reached a predetermined force. When the sensing mechanism senses that the contact force between the fixed clasp and the reel has reached the predetermined force, the transfer mechanism drives the grasping mechanism to move a predetermined distance away from the reel.

Abstract: An unpowered stop mechanism includes a mounting seat, a driving member, and a stop assembly. The stop assembly is located on the mounting seat and oppositely positioned to the driving member. The stop assembly includes a guide member, a stop member, and a hinge arm. The stop member is received within a guide slot defined in the guide member. The hinge arm is pivotably coupled to the guide member. The hinge arm protrudes from the guide member and is oppositely positioned to the driving member. The driving member drives the hinge arm to drive the stop member to retract within the guide slot. Then the driving member is moved to be spaced from the hinge arm, the stop member is driven by a resilient member received within the guide slot to protrude out of the guide slot.

Abstract: A telescopic mechanism includes a mounting base, a telescopic block received within the mounting base, and a pushing rod received within the mounting base. The telescopic block is vertically arranged in the mounting base, and the pushing rod is horizontally arranged in the mounting base. The telescopic block defines a guiding channel. The pushing rod passes through the guiding channel. The pushing rod is driven through the guiding channel to cause the telescopic block to extend or retract relative to the mounting base.

Abstract: An unpowered stop mechanism includes a mounting seat, a driving member, and a stop assembly. The stop assembly is located on the mounting seat and oppositely positioned to the driving member. The stop assembly includes a guide member, a stop member, and a hinge arm. The stop member is received within a guide slot defined in the guide member. The hinge arm is pivotably coupled to the guide member. The hinge arm protrudes from the guide member and is oppositely positioned to the driving member. The driving member drives the hinge arm to drive the stop member to retract within the guide slot. Then the driving member is moved to be spaced from the hinge arm, the stop member is driven by a resilient member received within the guide slot to protrude out of the guide slot.

Abstract: A clamping device which uses its own weight to apply pressure during a soldering operation to a solderable part or component for attachment to a circuit board is provided. The clamping device includes a base plate and at least one press block which is configured to be arranged on the base plate and is free to move up or down by gravity relative to the base plate. When the gravitational orientation of the clamping device is correct, the press block moves down relative to the base plate and so presses on the solderable part during soldering.

Abstract: A package box includes a substrate board and a plurality of projections. The projections are formed on the substrate board. The substrate board includes a first surface and a second surface. The first surface is opposite to the second surface. Each of the projections is formed when the first surface of the substrate board protrudes toward the second surface of the substrate board.

Abstract: A fixture to enable correct positioning of components in surface mount technology (SMT) field includes a tray, a positioning mechanism, at least one first upper magnet, at least one second upper magnet, and at least one lower magnet. The tray has at least one positioning hole. The positioning mechanism includes a base member, at least one sliding assembly, and at least one positioning post. The sliding assembly is slidably mounted to the base member. The positioning post is mounted to the base member, and disposed in the positioning hole of the tray. The first upper magnet and the second upper magnet are attached to the tray. The lower magnet is attached to the sliding assembly. The tray and the positioning mechanism are repulsive when the lower magnet aligns with the first upper magnet but are attracted when the lower magnet aligns with the second upper magnet.

Abstract: A method for checking the proper dispensation of glue onto a circuit board in manufacture includes the use of fluorescent materials in such glue, activating a light source to illuminate a circuit board when the circuit board is placed on an electronic device, and controlling an image capturing device to capture an image of the circuit board. The image captured by the capturing device is compared with a standard stored image of the circuit board, and a determination is made as to whether the circuit board passes test according to the comparison.

Abstract: A gripper mechanism configured to clamp an object includes at least one pair of clamping arms, a connecting element hinging at least one pair of clamping arms, a power cylinder driving the connecting element to move, and a limiting element with a through slot. The clamping arms pass through the through slot and connect to the limiting element. The power cylinder can drive the connecting element to move opposite or to move closer, thus (respectively) closing the clamping arms together or causing them to open.

Abstract: A clamping device which uses its own weight to apply pressure during a soldering operation to a solderable part or component for attachment to a circuit board is provided. The clamping device includes a base plate and at least one press block which is configured to be arranged on the base plate and is free to move up or down by gravity relative to the base plate. When the gravitational orientation of the clamping device is correct, the press block moves down relative to the base plate and so presses on the solderable part during soldering.

Abstract: A gripper mechanism configured to clamp an object includes at least one pair of clamping arms, a connecting element hinging at least one pair of clamping arms, a power cylinder driving the connecting element to move, and a limiting element with a through slot. The clamping arms pass through the through slot and connect to the limiting element. The power cylinder can drive the connecting element to move opposite or to move closer, thus (respectively) closing the clamping arms together or causing them to open.

Abstract: A package box includes a substrate board and a plurality of projections. The projections are formed on the substrate board. The substrate board includes a first surface and a second surface. The first surface is opposite to the second surface. Each of the projections is formed when the first surface of the substrate board protrudes toward the second surface of the substrate board.

Abstract: A repair apparatus for a circuit board assembly includes a cooling device for a surface of the circuit board assembly opposite to the surface to be repaired. The cooling device defines a chamber for receiving the circuit board assembly. The circuit board assembly is disposed within the chamber to define a heat exchange space between the circuit board assembly and the bottom of the chamber. A method for repairing a circuit board assembly is also provided.

Abstract: A cooling device for cooling electronic components includes a base plate, a power source, and a cooling module. The cooling module includes a cooling sheet and a thermal conductive base. The cooling sheet includes a hot surface and a cooling surface. The thermal conductive base is located above the cooling surface of the cooling sheet, and configured to support electronic components on a printed circuit board and transfer heat between the electronic components and the cooling surface. When the cooling sheet is powered on, the cooling surface is in a constant state of low temperature. Due to the heat transfer between the cooling surface and the thermal conductive base, heat from the electronic components can be transferred from the thermal conductive base to the cooling surface continuously.