Abstract: A media sheet has a substrate with an image-receiving layer disposed thereon. The image-receiving layer has a first pigment having particles with a size of about 50 to about 400 nanometers, a second pigment having plate-like particles, and a third pigment that either having a porous structure with an oil absorption of about 50 to about 300 cubic centimeters of oil per 100 grams, or a porous structure comprising substantially non-porous particles.

Abstract: In one aspect of the present system and method, an electrophotographic media includes a porous base media and a bi-modal pigmented composition disposed on the porous media that provides an increased resistance to blistering during pigment fusing. The bi-modal pigment may include a first pigment and a second pigment, the first pigment including particles having acicular morphology, and the second pigment including substantially spherical particles.

Abstract: The present invention is drawn to a media sheet for color electrophotographic printing. The media sheet can comprise a base stock having a first side and a second opposing side, base coating layers coated directly on the first side and the second side, and receiving layers coated directly on the base coating layers. The base coating layers can include inorganic pigments, a binder, and a charge control agent. The receiving layers can include inorganic pigments, a binder, and a discharge control agent. In one embodiment, the binder of the receiving layers can be hollow particle pigments.

Abstract: A media sheet has a substrate with an image-receiving layer disposed thereon. The image-receiving layer has a first pigment having particles with a size of about 50 to about 400 nanometers, a second pigment having plate-like particles, and a third pigment that either having a porous structure with an oil absorption of about 50 to about 300 cubic centimeters of oil per 100 grams, or a porous structure comprising substantially non-porous particles.

Abstract: In one aspect of the present system and method, an electrophotographic media includes a porous base media and a bi-modal pigmented composition disposed on the porous media that provides an increased resistance to blistering during pigment fusing. The bi-modal pigment may include a first pigment and a second pigment, the first pigment including particles having acicular morphology, and the second pigment including substantially spherical particles.

Abstract: A thermal interface composition is described herein that includes: a) at least two siloxane-based compounds; b) at least one inorganic micro-filler material; and c) at least one thermally conductive filler material. Additionally, a method of forming a thermal interface material is disclosed herein that includes: a) providing at least two siloxane-based compounds; b) providing at least one inorganic micro-filler material; c) providing at least one thermally conductive filler material; and d) combining the at least two siloxane-based compounds, the at least one inorganic micro-filler material and the at least one thermally conductive filler material.

Abstract: The present invention is drawn to a media sheet for color electrophotographic printing. The media sheet can comprise a base stock having a first side and a second opposing side, base coating layers coated directly on the first side and the second side, and receiving layers coated directly on the base coating layers. The base coating layers can include inorganic pigments, a binder, and a charge control agent. The receiving layers can include inorganic pigments, a binder, and a discharge control agent. In one embodiment, the binder of the receiving layers can be hollow particle pigments.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a lewis acid catalyst. Preferably the organic component further comprises a bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a lewis acid catalyst. Preferably the organic component further comprises a bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: A via fill formulation including electrically and/or thermally conductive particulate filler, or non-conductive, electrically conductive polymer and a resin vehicle.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.