Patents by Inventor Xuejun Bai

Xuejun Bai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10811196
    Abstract: Deformable electrodes, deformable supercapacitors comprising the deformable electrodes, and electric circuits comprising the supercapacitors are provided. Methods of using the supercapacitors to convert mechanical energy to electrical energy are also provided. The supercapacitors include a liquid electrolyte disposed between two electrodes, at least one of which is reversibly deformable when it is compressed. The liquid electrolyte is infused into the deformable electrode and the supercapacitors are characterized in that the deformation of the deformable electrodes causes the interfacial area between the electrolyte and the deformable electrode to decrease when the electrode is deformed.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: October 20, 2020
    Assignee: Northwestern University
    Inventors: Harold H. Kung, Xuejun Bai, Yue Y. Yu, Mayfair C. Kung
  • Publication number: 20190237268
    Abstract: Deformable electrodes, deformable supercapacitors comprising the deformable electrodes, and electric circuits comprising the supercapacitors are provided. Methods of using the supercapacitors to convert mechanical energy to electrical energy are also provided. The supercapacitors include a liquid electrolyte disposed between two electrodes, at least one of which is reversibly deformable when it is compressed. The liquid electrolyte is infused into the deformable electrode and the supercapacitors are characterized in that the deformation of the deformable electrodes causes the interfacial area between the electrolyte and the deformable electrode to decrease when the electrode is deformed.
    Type: Application
    Filed: December 6, 2018
    Publication date: August 1, 2019
    Inventors: Harold H. Kung, Xuejun Bai, Yue Y. Yu, Mayfair C. Kung