Patents by Inventor Xuxia LIU

Xuxia LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220163741
    Abstract: An optical module includes a shell, a circuit board, at least one of a light-transmitting chip or a light-receiving chip, a lens assembly and a claw assembly. The lens assembly includes a lens base and a connecting part. The lens base covers the at least one of the light-transmitting chip or the light-receiving chip, and is configured to change a propagation direction of an optical signal incident into the lens assembly. The connecting part includes at least one positioning slot disposed on a surface of the connecting part facing away from the lens base. The claw assembly includes a claw and a through hole. The claw includes at least one positioning protrusion disposed on a surface of the claw facing the connecting part. The through hole is configured to be connected to an optical fiber outside the optical module.
    Type: Application
    Filed: February 14, 2022
    Publication date: May 26, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Wei CUI, Baofeng SI, Xuxia LIU, Hongchao PAN, Qian SHAO, Sigeng YANG, Peng HE, Chengshuang LUO, Fenglai WANG
  • Publication number: 20220099902
    Abstract: An optical module includes a shell, a circuit board, at least one of a light-transmitting chip or a light-receiving chip, a lens assembly, an optical fiber ferrule assembly and a fixing plate. The circuit board is disposed in the shell. The light-transmitting chip and/or the light-receiving chip is disposed on the circuit board. The lens assembly is disposed on the circuit board, covers the light-transmitting chip and/or the light-receiving chip, and is configured to change a propagation direction of an optical signal incident into the lens assembly. The optical fiber ferrule assembly is connected to the lens assembly, and is configured to transmit an optical signal incident into the optical fiber ferrule assembly. The fixing plate is configured to fix the optical fiber ferrule assembly to the lens assembly.
    Type: Application
    Filed: December 10, 2021
    Publication date: March 31, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Wei CUI, Xuxia LIU, Baofeng SI, Xiaolei MA, Sigeng YANG
  • Publication number: 20220019031
    Abstract: An optical module includes a shell, a circuit board, a light-emitting chip, a lens assembly, an optical fiber ferrule assembly and a fastener. The fastener fixes the optical fiber ferrule assembly to the lens assembly. The fastener includes a fastening body, a first clamping portion and a second clamping portion. The first clamping portion is disposed at one end of the fastening body, and is clamped with the optical fiber ferrule assembly. The second clamping portion is disposed at the other end of the fastening body, and is clamped with the lens assembly.
    Type: Application
    Filed: September 30, 2021
    Publication date: January 20, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Fenglai WANG, Wei CUI, Xuejian LI, Yan ZHONG, Hongchao PAN, Sigeng YANG, Xuxia LIU
  • Publication number: 20220003944
    Abstract: An optical module includes a lens assembly and an optical fiber holder. The lens assembly includes a lens base, a first positioning column and a second positioning column. The optical fiber holder includes a first positioning hole and a second positioning hole. The first positioning hole is disposed on a second assembly surface and corresponds to a position of the first positioning column; the first positioning hole has an opening on the second assembly surface and an opening on a first side surface connected with the second assembly surface, and the two openings are connected. The second positioning hole is disposed on the second assembly surface and corresponds to a position of the second positioning column; the second positioning hole has an opening on the second assembly surface and has an opening on a second side surface connected with the second assembly surface, and the two openings are connected.
    Type: Application
    Filed: September 16, 2021
    Publication date: January 6, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Sigeng YANG, Shenzhen FU, Xuxia LIU
  • Patent number: 11209608
    Abstract: An optical module includes a circuit board, a lens assembly, a first lens array and a second lens array. The circuit board includes a first driving chip, a first photoelectric chip, a second photoelectric chip and a second driving chip. The lens assembly houses the first photoelectric chip and the second photoelectric chip and includes an upper surface having a first groove and a second groove. The first lens array and the second lens array are on a side surface of the second groove. A bottom surface of the first groove includes a reflecting surface. The first photoelectric chip and the second photoelectric chip are configured such that light coming from or to the first photoelectric chip, or from or to second photoelectric chip, is reflected by the reflecting surface and passes through the first lens array or the second lens array.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: December 28, 2021
    Assignee: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Xuxia Liu, Yan Zhong
  • Patent number: 11025030
    Abstract: An optical module includes a circuit board, an optical fiber, an optical fiber monitoring chip, a laser chip, a laser driving chip and a lens assembly. A bottom surface of the lens assembly is covered above the laser chip and the optical monitoring chip. A groove is on a top surface of the lens assembly. A bottom of the groove protrudes to form a first interface and a second interface. The laser chip is configured to emit light. The first interface is configured to reflect the emitted light to obtain first reflected light. The second interface is configured to reflect a portion of the first reflected light to obtain a second reflected light and refract another portion of the first reflected light to obtain a first refracted light. The second reflected light is transmitted to the optical monitoring chip. The first refracted light is transmitted to the optical fiber.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: June 1, 2021
    Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Xuxia Liu, Yan Zhong
  • Patent number: 10942319
    Abstract: The present application provides an optical module, including a laser, a laser driving chip, and a lens component disposed above the laser and the laser driving chip, where an inner cavity wall of the lens component that faces towards the laser and the laser driving chip is provided with a transmitting lens; a surface of the transmitting lens and the inner cavity wall around the transmitting lens are coated with a reflective film; and there is no reflective film coated on a part or entire of a region, of the inner cavity wall of the lens unit, which is irradiated by a secondarily reflected laser light.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: March 9, 2021
    Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Xuxia Liu, Shijian Ben
  • Publication number: 20200285004
    Abstract: The present application provides an optical module, including a laser, a laser driving chip, and a lens component disposed above the laser and the laser driving chip, where an inner cavity wall of the lens component that faces towards the laser and the laser driving chip is provided with a transmitting lens; a surface of the transmitting lens and the inner cavity wall around the transmitting lens are coated with a reflective film; and there is no reflective film coated on a part or entire of a region, of the inner cavity wall of the lens unit, which is irradiated by a secondarily reflected laser light.
    Type: Application
    Filed: August 19, 2019
    Publication date: September 10, 2020
    Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Xuxia LIU, Shijian BEN
  • Publication number: 20200183107
    Abstract: An optical module includes a housing, a circuit board, a connecting finger and a reflector. The circuit board is provided inside the housing. The connecting finger is provided on the circuit board. The reflector is provided between the circuit board and the housing, and is located between the connecting finger and an optical port of the optical module. The reflector is configured to reflect electromagnetic waves radiated onto a surface of the reflector.
    Type: Application
    Filed: January 17, 2020
    Publication date: June 11, 2020
    Applicants: Hisense Broadband Multimedia Technologies Co., Ltd., HISENSE USA CORP., Hisense International Co., Ltd.
    Inventors: Wei Zhao, Xuxia Liu, Lin Yu
  • Patent number: 10678003
    Abstract: The disclosure provides an optical module that includes a circuit board, a first chip, a second chip, and a lens assembly, wherein the first chip and the second chip are arranged respectively on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip; the lens assembly includes a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the distance between the axis of the first optic fiber insertion port, and the axis of the second optic fiber insertion port is less than the distance between the first chip and the second chip; and the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: June 9, 2020
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORPORATION, HISENSE INTERNATIONAL CO., LTD.
    Inventors: Xuxia Liu, Yongliang Huang, Qian Shao
  • Patent number: 10578816
    Abstract: An optical module includes a housing, a circuit board, a connecting finger and a reflector. The circuit board is provided inside the housing. The connecting finger is provided on the circuit board. The reflector is provided between the circuit board and the housing, and is located between the connecting finger and an optical port of the optical module. The reflector is configured to reflect electromagnetic waves radiated onto a surface of the reflector.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: March 3, 2020
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORP, HISENSE INTERNATIONAL CO., LTD.
    Inventors: Wei Zhao, Xuxia Liu, Lin Yu
  • Publication number: 20200021081
    Abstract: An optical module includes a circuit board, an optical fiber, an optical fiber monitoring chip, a laser chip, a laser driving chip and a lens assembly. A bottom surface of the lens assembly is covered above the laser chip and the optical monitoring chip. A groove is on a top surface of the lens assembly. A bottom of the groove protrudes to form a first interface and a second interface. The laser chip is configured to emit light. The first interface is configured to reflect the emitted light to obtain first reflected light. The second interface is configured to reflect a portion of the first reflected light to obtain a second reflected light and refract another portion of the first reflected light to obtain a first refracted light. The second reflected light is transmitted to the optical monitoring chip. The first refracted light is transmitted to the optical fiber.
    Type: Application
    Filed: August 13, 2019
    Publication date: January 16, 2020
    Inventors: Xuxia LIU, Yan ZHONG
  • Publication number: 20190317297
    Abstract: An optical module includes a circuit board, a lens assembly, a first lens array and a second lens array. The circuit board includes a first driving chip, a first photoelectric chip, a second photoelectric chip and a second driving chip. The lens assembly houses the first photoelectric chip and the second photoelectric chip and includes an upper surface having a first groove and a second groove. The first lens array and the second lens array are on a side surface of the second groove. A bottom surface of the first groove includes a reflecting surface. The first photoelectric chip and the second photoelectric chip are configured such that light coming from or to the first photoelectric chip, or from or to second photoelectric chip, is reflected by the reflecting surface and passes through the first lens array or the second lens array.
    Type: Application
    Filed: March 15, 2019
    Publication date: October 17, 2019
    Inventors: Xuxia LIU, Yan ZHONG
  • Patent number: 10185103
    Abstract: The disclosure provides an optical module that includes a circuit board, a first chip, a second chip, and a lens assembly, wherein the first chip and the second chip are arranged respectively on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip; the lens assembly includes a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the distance between the axis of the first optic fiber insertion port, and the axis of the second optic fiber insertion port is less than the distance between the first chip and the second chip; and the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.
    Type: Grant
    Filed: October 10, 2016
    Date of Patent: January 22, 2019
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORPORATION, HISENSE INTERNATIONAL CO., LTD.
    Inventors: Xuxia Liu, Yongliang Huang, Qian Shao
  • Publication number: 20180372967
    Abstract: The disclosure provides an optical module that includes a circuit board, a first chip, a second chip, and a lens assembly, wherein the first chip and the second chip are arranged respectively on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip; the lens assembly includes a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the distance between the axis of the first optic fiber insertion port, and the axis of the second optic fiber insertion port is less than the distance between the first chip and the second chip; and the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.
    Type: Application
    Filed: August 31, 2018
    Publication date: December 27, 2018
    Inventors: Xuxia LIU, Yongliang HUANG, Qian SHAO
  • Publication number: 20180321452
    Abstract: An optical module includes a housing, a circuit board, a connecting finger and a reflector. The circuit board is provided inside the housing. The connecting finger is provided on the circuit board. The reflector is provided between the circuit board and the housing, and is located between the connecting finger and an optical port of the optical module. The reflector is configured to reflect electromagnetic waves radiated onto a surface of the reflector.
    Type: Application
    Filed: July 3, 2018
    Publication date: November 8, 2018
    Inventors: Wei ZHAO, Xuxia LIU, Lin YU
  • Patent number: 10042132
    Abstract: Some embodiments of the present disclosure disclose an optical module. The optical module comprises a housing; a circuit board is provided inside the housing, and a connecting finger pluggable in an optical module cage is provided on the circuit board. At least one reflector, which is located between the connecting finger and an optical port of the optical module and can reflect electromagnetic waves radiated onto a surface of the reflector, is provided between the circuit board and the housing.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: August 7, 2018
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD, HISENSE USA CORP., HISENSE INTERNATIONAL CO., LTD.
    Inventors: Wei Zhao, Xuxia Liu, Lin Yu
  • Publication number: 20170254969
    Abstract: The disclosure provides an optical module that includes a circuit board, a first chip, a second chip, and a lens assembly, wherein the first chip and the second chip are arranged respectively on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip; the lens assembly includes a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the distance between the axis of the first optic fiber insertion port, and the axis of the second optic fiber insertion port is less than the distance between the first chip and the second chip; and the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.
    Type: Application
    Filed: October 10, 2016
    Publication date: September 7, 2017
    Inventors: Xuxia LIU, Yongliang HUANG, Qian SHAO
  • Publication number: 20170160498
    Abstract: Some embodiments of the present disclosure disclose an optical module. The optical module comprises a housing; a circuit board is provided inside the housing, and a connecting finger pluggable in an optical module cage is provided on the circuit board. At least one reflector, which is located between the connecting finger and an optical port of the optical module and can reflect electromagnetic waves radiated onto a surface of the reflector, is provided between the circuit board and the housing.
    Type: Application
    Filed: August 5, 2016
    Publication date: June 8, 2017
    Inventors: Wei ZHAO, Xuxia LIU, Lin YU