Patents by Inventor Xuyen Pham

Xuyen Pham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10643882
    Abstract: A ceramic ring for supporting a wafer, comprising: a body; and an annular recess provided in the center of the body, the annular recess having a bottom surface and a buffer portion extending upwards from the bottom surface to the surface of the body. The ceramic ring can ensure reliability in positioning the wafer, and can prevent the edge side of the wafer from generating particles by contacting the ceramic ring.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: May 5, 2020
    Assignee: PIOTECH CO., LTD.
    Inventors: Xuyen Pham, Zhi Chai, Shicai Fang
  • Patent number: 10497591
    Abstract: Disclosed is a load lock chamber which includes a chamber body including: at least one pair of cavities, defined in a layer structure of the chamber body to carry one or more wafer substrates; at least one internal conduit, defined between and coupled with the paired cavities, such that the paired cavities are communicated with each other and capable of conducting gas refilling and exhaustion; and a plurality of wafer supports for carrying the wafer substrates, the plurality of wafer supports being securely received in the paired cavities and able to calibrate with a machine arm frontend finger, wherein the wafer support includes grooves defined thereon for calibrating the machine arm frontend finger.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: December 3, 2019
    Assignee: PIOTECH CO., LTD.
    Inventors: Ren Zhou, Xuyen Pham, Brian Lu, Sean Chang, Shicai Fang, Jie Lian, Enguo Men
  • Patent number: 10410909
    Abstract: The invention discloses a support structure for a wafer pedestal; particularly the wafer pedestal has a wafer carrying surface defining holes for accommodation of the support structure. The support structure includes a first surface and extends therebetween. The first surface includes a rising portion for supporting wafer. A center of the first surface and a center of the second surface define an axis that is not parallel to the normal of the first surface. That is, the first surface extends oblique relatively to the second surface such that the support structure according to the invention can be received in the pedestal in an oblique way relative to the wafer carrying surface of the pedestal.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: September 10, 2019
    Assignee: PIOTECH CO., LTD.
    Inventors: Ren Zhou, Xuyen Pham, Shichai Fang
  • Publication number: 20190096736
    Abstract: The invention discloses a support structure for a wafer pedestal; particularly the wafer pedestal has a wafer carrying surface defining holes for accommodation of the support structure. The support structure includes a first surface and extends therebetween. The first surface includes a rising portion for supporting wafer. A center of the first surface and a center of the second surface define an axis that is not parallel to the normal of the first surface. That is, the first surface extends oblique relatively to the second surface such that the support structure according to the invention can be received in the pedestal in an oblique way relative to the wafer carrying surface of the pedestal.
    Type: Application
    Filed: September 17, 2018
    Publication date: March 28, 2019
    Inventors: Ren Zhou, Xuyen Pham, Shichai Fang
  • Publication number: 20180053682
    Abstract: A ceramic ring for supporting a wafer, comprising: a body; and an annular recess provided in the center of the body, the annular recess having a bottom surface and a buffer portion extending upwards from the bottom surface to the surface of the body. The ceramic ring can ensure reliability in positioning the wafer, and can prevent the edge side of the wafer from generating particles by contacting the ceramic ring.
    Type: Application
    Filed: August 18, 2017
    Publication date: February 22, 2018
    Inventors: XUYEN PHAM, ZHI CHAI, SHICAI FANG
  • Publication number: 20170271187
    Abstract: Disclosed is a load lock chamber which includes a chamber body including: at least one pair of cavities, defined in a layer structure of the chamber body to carry one or more wafer substrates; at least one internal conduit, defined between and coupled with the paired cavities, such that the paired cavities are communicated with each other and capable of conducting gas refilling and exhaustion; and a plurality of wafer supports for carrying the wafer substrates, the plurality of wafer supports being securely received in the paired cavities and able to calibrate with a machine arm frontend finger, wherein the wafer support includes grooves defined thereon for calibrating the machine arm frontend finger.
    Type: Application
    Filed: September 16, 2016
    Publication date: September 21, 2017
    Inventors: Ren ZHOU, Xuyen Pham, Brian Lu, Sean Chang, Shicai Fang, Jie Lian, Enguo Men
  • Patent number: 8783305
    Abstract: The invention provides methods, systems and apparatus for the metered transport of fine powders into receptacles. According to one exemplary embodiment, an apparatus is provided which comprises a hopper having an opening. The hopper is adapted to receive a bed of fine powder. At least one chamber, which is moveable to allow the chamber to be placed in close proximity to the opening, is also provided. An element having a proximal end and a distal end is positioned within the hopper such that the distal end is near the opening. A vibrator motor is provided to vibrate the element when within the fine powder.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: July 22, 2014
    Assignee: Novartis AG
    Inventors: Kyle A Naydo, Derrick J Parks, Patrick Reich, Gordon Stout, Xuyen Pham, Michael J Rocchio
  • Publication number: 20120152975
    Abstract: The invention provides methods, systems and apparatus for the metered transport of fine powders into receptacles. According to one exemplary embodiment, an apparatus is provided which comprises a hopper having an opening. The hopper is adapted to receive a bed of fine powder. At least one chamber, which is moveable to allow the chamber to be placed in close proximity to the opening, is also provided. An element having a proximal end and a distal end is positioned within the hopper such that the distal end is near the opening. A vibrator motor is provided to vibrate the element when within the fine powder.
    Type: Application
    Filed: November 21, 2011
    Publication date: June 21, 2012
    Inventors: Kyle A. Naydo, Derrick J. Parks, Patrick Reich, Gordon STOUT, Michael J. Rocchio, Xuyen Pham
  • Publication number: 20070256632
    Abstract: An apparatus for holding a rotatable wafer having a wafer side and a wafer edge includes one or more clamps proximally positioned around a wafer perimeter, each of said clamps including a clamp edge adapted to engage said wafer edge.
    Type: Application
    Filed: April 21, 2006
    Publication date: November 8, 2007
    Inventor: Xuyen Pham
  • Publication number: 20070246079
    Abstract: A method and system to clean and rinse and dry wafer comprises a precision control of an outward-moving inner boundary condition and a steady state edge boundary condition. The edge boundary condition can confine the liquid within the substrate by an edge liquid flow step, to create an outer liquid boundary, to confine the liquid within the wafer, and to compensate for liquid lost through process conditions such as wafer spinning. The outward-moving inner boundary condition can control or distribute the liquid within the substrate by an inner liquid boundary condition that moves outward to the edge of the wafer, to create an outward-moving inner liquid boundary, to uniformly distribute liquid within the wafer, and to uniformly drying the wafer.
    Type: Application
    Filed: April 21, 2006
    Publication date: October 25, 2007
    Inventor: Xuyen Pham
  • Publication number: 20070084079
    Abstract: A shower head processes a wafer with a plate having a plurality of nozzles positioned thereon, each of the nozzles assigned to one of a plurality of processing zones for the wafer; and a manifold assembly coupled to each of the nozzles to control one or more of the nozzles as a group in each processing zone.
    Type: Application
    Filed: December 14, 2006
    Publication date: April 19, 2007
    Inventor: Xuyen Pham
  • Publication number: 20060157095
    Abstract: Systems and methods are disclosed to process first and second sides of a wafer. The system includes a platform adapted to receive and rotate said wafer; and first and second heads coupled to the platform to access said first and second sides of said wafer.
    Type: Application
    Filed: January 19, 2005
    Publication date: July 20, 2006
    Inventor: Xuyen Pham
  • Publication number: 20060150432
    Abstract: A shower head processes a wafer with a plate having a plurality of nozzles positioned thereon, each of the nozzles assigned to one of a plurality of processing zones for the wafer; and a manifold assembly coupled to each of the nozzles to control one or more of the nozzles as a group in each processing zone.
    Type: Application
    Filed: January 11, 2005
    Publication date: July 13, 2006
    Inventor: Xuyen Pham
  • Patent number: 7054719
    Abstract: A method of mixing two or more chemicals such as for a CMP system. The method includes delivering a first chemical to a first inlet port of a point of use mixer at a first flow rate, delivering a second chemical to a second inlet port of the point of use mixer at a second flow rate, controlling the flow of the first and second chemicals into the mixer upon demand for a mixture of the first and second chemicals and balancing the flow of the first and second chemicals into the mixer. The mixture can also be output such as to a CMP process. A system for mixing two or more chemicals is also described.
    Type: Grant
    Filed: April 19, 2004
    Date of Patent: May 30, 2006
    Assignee: Lam Research Corporation
    Inventors: Xuyen Pham, Tuan Nguyen, Vien Quach, Ren Zhou
  • Patent number: 7040954
    Abstract: Apparatus and methods control CMP to uniformly polish a series of wafers. Average motor current I(avg) drawn by, and related average work W(avg) performed by, motors during CMP on the wafers reliably indicate quality of a roughness polishing characteristic of a polishing surface of a polishing pad. A conditioner controller controls a rate at which the quality of the polishing surface is restored by conditioning in relation to a rate of change of the quality of the polishing surface due to the CMP. Motor current is measured and averaged over many CMP-processed wafers. The method defines a baseline range of values of average work and controls conditioning according to whether average work is within the baseline range. When the polishing surface moves at constant velocity relative to each of the wafers that are being polished, a control signal based on average motor current represents the quality of the polishing characteristic.
    Type: Grant
    Filed: September 28, 2004
    Date of Patent: May 9, 2006
    Assignee: Lam Research Corporation
    Inventors: Simon McClatchie, Peter Norton, Xuyen Pham, Ren Zhou
  • Patent number: 7040970
    Abstract: An apparatus and method for evenly distributing a polishing fluid onto a polishing pad during a chemical mechanical planarization process, wherein the polishing fluid is dispersed by way of a spray being emitted from a spray nozzle. The pattern of polishing fluid applied to the polishing pad can be modified by adjustment of geometric parameters of the spray nozzle. The apparatus is configured with actuating mechanisms for translating and rotating the spray nozzle relative to the polishing pad in order to adjust a pattern of distribution of the polishing fluid. The method of dispersing polishing fluid onto the polishing pad produces an even distribution of polishing fluid across a width of the polishing pad.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: May 9, 2006
    Assignee: Lam Research Corporation
    Inventors: Simon McClatchie, Sabir Majumder, Ren Zhou, Xuyen Pham, Tuan A. Nguyen
  • Patent number: 7018276
    Abstract: An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.
    Type: Grant
    Filed: June 25, 2004
    Date of Patent: March 28, 2006
    Assignee: Lam Research Corporation
    Inventors: Anthony de la Llera, Xuyen Pham, Cangshan Xu, David Wei, Tony Luong
  • Publication number: 20060014478
    Abstract: An apparatus and method for evenly distributing a polishing fluid onto a polishing pad during a chemical mechanical planarization process, wherein the polishing fluid is dispersed by way of a spray being emitted from a spray nozzle. The pattern of polishing fluid applied to the polishing pad can be modified by adjustment of geometric parameters of the spray nozzle. The apparatus is configured with actuating mechanisms for translating and rotating the spray nozzle relative to the polishing pad in order to adjust a pattern of distribution of the polishing fluid. The method of dispersing polishing fluid onto the polishing pad produces an even distribution of polishing fluid across a width of the polishing pad.
    Type: Application
    Filed: July 15, 2004
    Publication date: January 19, 2006
    Inventors: Simon McClatchie, Sabir Majumder, Ren Zhou, Xuyen Pham, Tuan Nguyen
  • Patent number: 6953750
    Abstract: A linear chemical mechanical planarization (CMP) system includes a belt pad, a slurry bar having a plurality of nozzles, and a heating module for heating slurry. The heating module has a plurality of heating elements, each of which is coupled in flow communication with one of the plurality of nozzles of the slurry bar. The system also may include a control system for controlling the heating elements of the heating module and first and second temperature sensors coupled to the control system. The first temperature sensors measure the temperature of slurry heated by each of the heating elements, and the second temperature sensors measure the temperature of the surface of the belt pad. A method for dispensing slurry in a linear CMP system, and methods for controlling the temperature of the surface of the belt pad and the temperature of slurry in a linear CMP system also are described.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: October 11, 2005
    Assignee: Lam Research Corporation
    Inventors: Patrick P. H. Wu, Xuyen Pham, Tuan A. Nguyen, Ren Zhou
  • Patent number: RE42942
    Abstract: The invention provides methods, systems and apparatus for the metered transport of fine powders into receptacles. According to one exemplary embodiment, an apparatus is provided which comprises a hopper having an opening. The hopper is adapted to receive a bed of fine powder. At least one chamber, which is moveable to allow the chamber to be placed in close proximity to the opening, is also provided. An element having a proximal end and a distal end is positioned within the hopper such that the distal end is near the opening. A vibrator motor is provided to vibrate the element when within the fine powder.
    Type: Grant
    Filed: February 6, 2003
    Date of Patent: November 22, 2011
    Assignee: Novartis AG
    Inventors: Gordon Stout, Xuyen Pham, Michael J. Rocchio, Kyle A. Naydo, Derrick J. Parks, Patrick Reich