Patents by Inventor Ya-Huei Tsai

Ya-Huei Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250048648
    Abstract: A semiconductor device includes a substrate having a logic region and a magnetoresistive random access memory (MRAM) region, a magnetic tunneling junction (MTJ) on the MRAM region, a metal interconnection on the MTJ, and a blocking layer on the metal interconnection. Preferably, the blocking layer includes metal and the blocking layer includes a grid line pattern according to a top view.
    Type: Application
    Filed: October 16, 2024
    Publication date: February 6, 2025
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Jia-Rong Wu, I-Fan Chang, Rai-Min Huang, Ya-Huei Tsai, Yu-Ping Wang
  • Publication number: 20250040149
    Abstract: A layout pattern for magnetoresistive random access memory (MRAM) includes a substrate having a first active region, a second active region, and a word line connecting region between the first active region and the second active region, a first gate pattern extending along a first direction from the first active region to the second active region, a second gate pattern extending along the first direction from the first active region to the second active region, a first magnetic tunneling junction (MTJ) between the first gate pattern and the second pattern and within the word line connecting region, and a second MTJ between the first gate pattern and the second gate pattern in the first active region. Preferably, top surfaces of the first MTJ and the second MTJ are coplanar.
    Type: Application
    Filed: October 16, 2024
    Publication date: January 30, 2025
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Ya-Huei Tsai, Rai-Min Huang, Yu-Ping Wang, Hung-Yueh Chen
  • Publication number: 20250029161
    Abstract: A method for customizing an appearance of a merchandise which is suitable for being performed by a computing device in order to customize a customized choice result selected by a user includes a designed image and a merchandise information. The method includes receiving the designed image, receiving the merchandise information, overlappingly displaying the designed image on a virtual merchandise image corresponding to the merchandise information, receiving at least one edit operation for at least one designed element in the designed image, and editing for the designed element in the designed image according to the edit operation and then generating a customizing virtual image. Thereby, the method can be used for customizing an appearance of a merchandise and directly customize the designed image that has been arranged. In addition, a computing device and a non-transitory computer-readable recording medium for customizing the appearance of the merchandise are also provided.
    Type: Application
    Filed: June 3, 2024
    Publication date: January 23, 2025
    Applicant: EVOLUTIVE LABS CO., LTD.
    Inventors: TZI-HUEI LAI, YA-HSUAN CHANG, XIN-YING YOU, WEN-YAO TSAI, JUN-QI WANG, CHI-EN WU, YU-TING LIANG, YEONG-JYI LEI
  • Patent number: 12150315
    Abstract: A layout pattern for magnetoresistive random access memory (MRAM) includes a substrate having a first active region, a second active region, and a word line connecting region between the first active region and the second active region, a first gate pattern extending along a first direction from the first active region to the second active region, a second gate pattern extending along the first direction from the first active region to the second active region, a first magnetic tunneling junction (MTJ) between the first gate pattern and the second pattern and within the word line connecting region, and a second MTJ between the first gate pattern and the second gate pattern in the first active region. Preferably, top surfaces of the first MTJ and the second MTJ are coplanar.
    Type: Grant
    Filed: December 25, 2023
    Date of Patent: November 19, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ya-Huei Tsai, Rai-Min Huang, Yu-Ping Wang, Hung-Yueh Chen
  • Patent number: 12150313
    Abstract: A semiconductor device includes a substrate having a logic region and a magnetoresistive random access memory (MRAM) region, a MTJ on the MRAM region, a metal interconnection on the MTJ, and a blocking layer on the metal interconnection. Preferably, the blocking layer includes a stripe pattern according to a top view and the blocking layer could include metal or a dielectric layer.
    Type: Grant
    Filed: November 2, 2023
    Date of Patent: November 19, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Jia-Rong Wu, I-Fan Chang, Rai-Min Huang, Ya-Huei Tsai, Yu-Ping Wang
  • Patent number: 12052932
    Abstract: The present invention provides a semiconductor device, the semiconductor device includes a metal interconnection on a substrate, in which a top view of the metal interconnection comprises a quadrilateral; and a magnetic tunneling junction (MTJ) on the metal interconnection, in which a top view of the MTJ comprises a circular shape.
    Type: Grant
    Filed: April 11, 2023
    Date of Patent: July 30, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Jia-Rong Wu, Rai-Min Huang, I-Fan Chang, Ya-Huei Tsai, Yu-Ping Wang
  • Patent number: 12052933
    Abstract: The present invention provides a semiconductor device, the semiconductor device includes a metal interconnection on a substrate, in which a top view of the metal interconnection comprises a quadrilateral; and a magnetic tunneling junction (MTJ) on the metal interconnection, in which a top view of the MTJ comprises a circular shape, an area of the MTJ is smaller than an area of the metal interconnection.
    Type: Grant
    Filed: April 11, 2023
    Date of Patent: July 30, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Jia-Rong Wu, Rai-Min Huang, I-Fan Chang, Ya-Huei Tsai, Yu-Ping Wang
  • Publication number: 20240130141
    Abstract: A layout pattern for magnetoresistive random access memory (MRAM) includes a substrate having a first active region, a second active region, and a word line connecting region between the first active region and the second active region, a first gate pattern extending along a first direction from the first active region to the second active region, a second gate pattern extending along the first direction from the first active region to the second active region, a first magnetic tunneling junction (MTJ) between the first gate pattern and the second pattern and within the word line connecting region, and a second MTJ between the first gate pattern and the second gate pattern in the first active region. Preferably, top surfaces of the first MTJ and the second MTJ are coplanar.
    Type: Application
    Filed: December 25, 2023
    Publication date: April 18, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Ya-Huei Tsai, Rai-Min Huang, Yu-Ping Wang, Hung-Yueh Chen
  • Publication number: 20240074209
    Abstract: A semiconductor device includes a substrate having a logic region and a magnetoresistive random access memory (MRAM) region, a MTJ on the MRAM region, a metal interconnection on the MTJ, and a blocking layer on the metal interconnection. Preferably, the blocking layer includes a stripe pattern according to a top view and the blocking layer could include metal or a dielectric layer.
    Type: Application
    Filed: November 2, 2023
    Publication date: February 29, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Jia-Rong Wu, I-Fan Chang, Rai-Min Huang, Ya-Huei Tsai, Yu-Ping Wang
  • Patent number: 11895848
    Abstract: A layout pattern for magnetoresistive random access memory (MRAM) includes a substrate having a first active region, a second active region, and a word line connecting region between the first active region and the second active region, a first gate pattern extending along a first direction from the first active region to the second active region, a second gate pattern extending along the first direction from the first active region to the second active region, a first magnetic tunneling junction (MTJ) between the first gate pattern and the second pattern and within the word line connecting region, and a second MTJ between the first gate pattern and the second gate pattern in the first active region. Preferably, top surfaces of the first MTJ and the second MTJ are coplanar.
    Type: Grant
    Filed: May 22, 2022
    Date of Patent: February 6, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ya-Huei Tsai, Rai-Min Huang, Yu-Ping Wang, Hung-Yueh Chen
  • Patent number: 11849592
    Abstract: A semiconductor device includes a substrate having a logic region and a magnetoresistive random access memory (MRAM) region, a MTJ on the MRAM region, a metal interconnection on the MTJ, and a blocking layer on the metal interconnection. Preferably, the blocking layer includes a stripe pattern according to a top view and the blocking layer could include metal or a dielectric layer.
    Type: Grant
    Filed: August 15, 2022
    Date of Patent: December 19, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Jia-Rong Wu, I-Fan Chang, Rai-Min Huang, Ya-Huei Tsai, Yu-Ping Wang
  • Publication number: 20230247914
    Abstract: The present invention provides a semiconductor device, the semiconductor device includes a metal interconnection on a substrate, in which a top view of the metal interconnection comprises a quadrilateral; and a magnetic tunneling junction (MTJ) on the metal interconnection, in which a top view of the MTJ comprises a circular shape.
    Type: Application
    Filed: April 11, 2023
    Publication date: August 3, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Jia-Rong Wu, Rai-Min Huang, I-Fan Chang, Ya-Huei Tsai, Yu-Ping Wang
  • Publication number: 20230247915
    Abstract: The present invention provides a semiconductor device, the semiconductor device includes a metal interconnection on a substrate, in which a top view of the metal interconnection comprises a quadrilateral; and a magnetic tunneling junction (MTJ) on the metal interconnection, in which a top view of the MTJ comprises a circular shape, an area of the MTJ is smaller than an area of the metal interconnection.
    Type: Application
    Filed: April 11, 2023
    Publication date: August 3, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Jia-Rong Wu, Rai-Min Huang, I-Fan Chang, Ya-Huei Tsai, Yu-Ping Wang
  • Patent number: 11665978
    Abstract: A method for fabricating a semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a first patterned mask on the first IMD layer, in which the first patterned mask includes a first slot extending along a first direction; forming a second patterned mask on the first patterned mask, in which the second patterned mask includes a second slot extending along a second direction and the first slot intersects the second slot to form a third slot; and forming a first metal interconnection in the third slot.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: May 30, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Jia-Rong Wu, Rai-Min Huang, I-Fan Chang, Ya-Huei Tsai, Yu-Ping Wang
  • Publication number: 20230157182
    Abstract: A method for fabricating semiconductor device includes the steps of: forming a magnetic tunneling junction (MTJ) stack on a substrate; forming a top electrode on the MTJ stack; performing a first patterning process to remove the MTJ stack along a first direction; and performing a second patterning process to remove the MTJ stack along a second direction to form MTJs on the substrate.
    Type: Application
    Filed: January 17, 2023
    Publication date: May 18, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Jia-Rong Wu, Rai-Min Huang, Ya-Huei Tsai, I-Fan Chang, Yu-Ping Wang
  • Publication number: 20220392954
    Abstract: A semiconductor device includes a substrate having a logic region and a magnetoresistive random access memory (MRAM) region, a MTJ on the MRAM region, a metal interconnection on the MTJ, and a blocking layer on the metal interconnection. Preferably, the blocking layer includes a stripe pattern according to a top view and the blocking layer could include metal or a dielectric layer.
    Type: Application
    Filed: August 15, 2022
    Publication date: December 8, 2022
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Jia-Rong Wu, I-Fan Chang, Rai-Min Huang, Ya-Huei Tsai, Yu-Ping Wang
  • Patent number: 11456331
    Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a logic region and a magnetoresistive random access memory (MRAM) region, forming a magnetic tunneling junction (MTJ) on the MRAM region, forming a metal interconnection on the MTJ, forming a dielectric layer on the metal interconnection, patterning the dielectric layer to form openings, and forming the blocking layer on the patterned dielectric layer and the metal interconnection and into the openings.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: September 27, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Jia-Rong Wu, I-Fan Chang, Rai-Min Huang, Ya-Huei Tsai, Yu-Ping Wang
  • Publication number: 20220285437
    Abstract: A layout pattern for magnetoresistive random access memory (MRAM) includes a substrate having a first active region, a second active region, and a word line connecting region between the first active region and the second active region, a first gate pattern extending along a first direction from the first active region to the second active region, a second gate pattern extending along the first direction from the first active region to the second active region, a first magnetic tunneling junction (MTJ) between the first gate pattern and the second pattern and within the word line connecting region, and a second MTJ between the first gate pattern and the second gate pattern in the first active region. Preferably, top surfaces of the first MTJ and the second MTJ are coplanar.
    Type: Application
    Filed: May 22, 2022
    Publication date: September 8, 2022
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Ya-Huei Tsai, Rai-Min Huang, Yu-Ping Wang, Hung-Yueh Chen
  • Patent number: 11374055
    Abstract: A layout pattern for magnetoresistive random access memory (MRAM) includes a substrate having a first active region, a second active region, and a word line connecting region between the first active region and the second active region and a gate pattern extending from the first active region to the second active region, in which the gate pattern includes a H-shape according to a top view. Preferably, the gate pattern includes a first gate pattern extending along a first direction from the first active region to the second active region, a second gate pattern extending along the first direction from the first active region to the second active region, and a third gate pattern connecting the first gate pattern and the second gate pattern along a second direction.
    Type: Grant
    Filed: February 16, 2020
    Date of Patent: June 28, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ya-Huei Tsai, Rai-Min Huang, Yu-Ping Wang, Hung-Yueh Chen
  • Publication number: 20210391531
    Abstract: A method for fabricating a semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a first patterned mask on the first IMD layer, in which the first patterned mask includes a first slot extending along a first direction; forming a second patterned mask on the first patterned mask, in which the second patterned mask includes a second slot extending along a second direction and the first slot intersects the second slot to form a third slot; and forming a first metal interconnection in the third slot.
    Type: Application
    Filed: July 15, 2020
    Publication date: December 16, 2021
    Inventors: Jia-Rong Wu, Rai-Min Huang, I-Fan Chang, Ya-Huei Tsai, Yu-Ping Wang