Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: A method and an inspection system may be provided. The inspection system may include (a) a hybrid sensor that may include a monochromatic portion that is arranged to obtain a monochromatic image of a first area of an object; a multiple-color portion that is arranged to obtain a multi-colored image of a second area of the object; wherein the monochromatic portion comprises monochromatic sensing elements that sense radiation of a same frequency band; wherein the multiple-color portion comprises color sensing elements of different types, wherein different types of color sensing elements are associated with different frequency bands; (b) a storage element arranged to store the monochromatic image and the multiple-color image; and (c) a defect detection module arranged to detect defects by processing at least one of the monochromatic image and the multiple-color image.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: A method and an edge inspection system, the edge inspection system includes: an illumination unit; a support module for supporting an inspected object and for moving the inspected object in relation to the illumination unit; wherein the inspected object comprises a top surface, a bottom surface and at least one edge facet; an illumination unit that has an illumination axis, wherein the illumination unit is arranged to illuminate an inspected edge area of the inspected object by directing a light beam along the illumination axis; wherein the illumination axis is tilted in relation to a plane of the inspected object by a tilt angle that differs from ninety degrees; wherein the plane of the inspected object is defined by at least one of the top surface and the bottom surface; and a camera that has a collection axis, wherein the camera is arranged to detect light from the inspected edge area.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: A method and a system for determining a depth of a space, the system includes: a scanner for scanning, by a single broadband light beam, the structural element and the area of the surface of the object, wherein the area at least partially surrounds the structural element; a sensor for detecting interference patterns generated when the single broadband light beam concurrently illuminates a portion of the area and at least a portion of the structural element; and an analyzer for analyzing the interference patterns to determine the height difference between the area and the structural element.

Abstract: A system and method for fabricating an electro-optical hybrid module (100). The electro-optical hybrid module (100) may comprise an electro-optical component, an electronic component (110), a planar light wave circuit (PLC) embedded with at least an optical waveguide (120). The electro-optical component may transmit or receive energy through a micro-folding mirror (160) while the electronic component may amplify and transfer an electric signal to the electro-optical component. The planar light wave circuit may typically provide an opto-electronic signal communication path via the plurality of optical waveguides that may be embedded in the planar light wave circuit.

Abstract: A system and method for fabricating an electro-optical hybrid module (100). The electro-optical hybrid module (100) may comprise an electro-optical component, an electronic component (110), a planar light wave circuit (PLC) embedded with at least an optical waveguide (120). The electro-optical component may transmit or receive energy through a micro-folding mirror (160) while the electronic component may amplify and transfer an electric signal to the electro-optical component. The planar light wave circuit may typically provide an opto-electronic signal communication path via the plurality of optical waveguides that may be embedded in the planar light wave circuit.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: In some embodiments of the present invention, an electrical field is applied across a waveguide substrate so as to induce ion exchange process that affects the cross section of the waveguide. Shaped electrical field may, according to the invention, may control the size and shape of the waveguide along it.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.