Patents by Inventor Yan-Li Fang

Yan-Li Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic assembly
    Patent number: 9241406
    Abstract: An electronic assembly includes a first substrate, at least one first conductive pad and multiple second conductive pads. The first substrate comprises a base layer and at least one conductive circuit layer. The at least one conductive circuit layer is disposed on the base layer. The at least one first conductive pad is disposed on the first substrate. The first conductive pad is electrically insulated from the conductive circuit layer. The first conductive pad includes multiple first holes. The second conductive pads are disposed on the first substrate. The second conductive pads are electrically connected to the conductive circuit layer.
    Type: Grant
    Filed: July 10, 2013
    Date of Patent: January 19, 2016
    Assignee: AU OPTRONICS CORP.
    Inventors: Yan-Li Fang, Po-Fu Huang, Chun-Ming Lin
  • ELECTRONIC ASSEMBLY
    Publication number: 20140104794
    Abstract: An electronic assembly includes a first substrate, at least one first conductive pad and multiple second conductive pads. The first substrate comprises a base layer and at least one conductive circuit layer. The at least one conductive circuit layer is disposed on the base layer. The at least one first conductive pad is disposed on the first substrate. The first conductive pad is electrically insulated from the conductive circuit layer. The first conductive pad includes multiple first holes. The second conductive pads are disposed on the first substrate. The second conductive pads are electrically connected to the conductive circuit layer.
    Type: Application
    Filed: July 10, 2013
    Publication date: April 17, 2014
    Inventors: Yan-Li Fang, Po-Fu Huang, Chun-Ming Lin