Patents by Inventor Yan-Zung Wang

Yan-Zung Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240264224
    Abstract: A ground-signal-ground (GSG) device structure is provided in the present invention, including two signal pads aligned in a first direction and two ground pads respectively at two sides of each signal pad in a second direction, and two transmission lines between the two signal pads and are connected respectively with said two signal pads, and said two transmission lines extend toward each other in the first direction and connect to a device, wherein the two signal pads and the two transmission lines are only in the level of 7th metal layer or above in back-end-of-line (BEOL) metal layers.
    Type: Application
    Filed: March 1, 2023
    Publication date: August 8, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Ching-Wen Hung, Jinn-Horng Lai, Yan-Zung Wang, Peng-Hsiu Chen, Su-Ming Hsieh
  • Publication number: 20240243073
    Abstract: A radio-frequency (RF) device includes a main device on a substrate, a first port extending along a first direction adjacent to a first side of the main device, a second port extending along the first direction adjacent to a second side of the main device, a first shield structure adjacent to a third side of the main device, a second shield structure adjacent to a fourth side of the main device, a first connecting structure extending along a second direction to connect the first port and the main device, and a second connecting structure extending along the second direction to connect the second port and the main device.
    Type: Application
    Filed: March 2, 2023
    Publication date: July 18, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Ching-Wen Hung, Jinn-Horng Lai, Yan-Zung Wang, Peng-Hsiu Chen, Su-Ming Hsieh