Patents by Inventor Yan-Hong Liu
Yan-Hong Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230360977Abstract: A method includes: transferring a wafer from a factory interface through a load lock chamber to a buffer chamber; transferring the wafer from the buffer chamber to a process chamber; etching the wafer in the process chamber, to remove a material of the wafer; and after the wafer is etched, performing reflectance measurements to the wafer in the factory interface, the load lock chamber, the buffer chamber, or combination thereof, to identify if the material of the wafer is removed entirely according to a reflectance of the wafer.Type: ApplicationFiled: July 20, 2023Publication date: November 9, 2023Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yan-Hong LIU, Daniel M.Y. YANG, Che-Fu CHEN
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Patent number: 11756840Abstract: A system includes a factory interface, an etching tool, and at least one measuring device. The factory interface is configured to carry a wafer. The etching tool is coupled to the factory interface and configured to process the wafer transferred from the factory interface. The at least one measuring device is equipped in the factory interface, the etching tool, or the combination thereof. The at least one measuring device is configured to perform real-time measurements of reflectance from the wafer that is carried in the factory interface or the etching tool.Type: GrantFiled: June 18, 2019Date of Patent: September 12, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yan-Hong Liu, Daniel M. Y. Yang, Che-Fu Chen
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Patent number: 11664260Abstract: In an embodiment, a system includes: an orientation sensor configured to detect an orientation fiducial on a bevel of a wafer; a pedestal configured to rotate the wafer to allow the orientation sensor to detect the orientation fiducial and place the orientation fiducial at a predetermined orientation position; and a defect sensor configured to detect a wafer defect along a surface of the wafer while rotated by the pedestal.Type: GrantFiled: April 9, 2021Date of Patent: May 30, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yan-Hong Liu, Daniel M. Y. Yang, Che-Fu Chen
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Patent number: 11664265Abstract: In an embodiment, a robotic arm includes: a base; at least one link secured to the base; a gripper secured to the at least one link, wherein: the gripper comprises a finger, the gripper is configured to secure a wafer while the at least one link is in motion, and the gripper is configured to release the wafer while the at least one link is stopped, a sensor disposed on the finger, the sensor configured to collect sensor data characterizing the robotic arm's interaction with a semiconductor processing chamber while the wafer is secured using the finger.Type: GrantFiled: April 9, 2021Date of Patent: May 30, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yan-Hong Liu, Ming-Feng Chen, Che-fu Chen, Hung-Wen Chen
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Publication number: 20230151494Abstract: In an etch process chamber, oscillators are positioned a predetermined distance away from an outer wall and coupled to a microwave generator. An inner wall of the process chamber on which particulates such as polymers adhere from the etch process is vibrated via operations of the oscillators. A gas flows into the cavity defined by the inner wall to collect the displaced particulates, which is then pumped out of the cavity to clean the process chamber. A controller identifies the polymer recipe used during the etch process and selects an oscillation program from memory. A microwave generator, controlled by the controller, is directed to generate microwaves at preselected frequencies determined from the program. The microwave frequencies are communicated to the oscillators, which then vibrate the inner wall at such received frequencies.Type: ApplicationFiled: February 24, 2022Publication date: May 18, 2023Inventors: Po-Hsun Tseng, Yan-Hong Liu
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Publication number: 20230078610Abstract: The present disclosure describes an apparatus. The apparatus includes a chuck for placing an object thereon, a gas passage extending along a periphery of an outer sidewall of the chuck and separating the chuck into an inner portion and a sidewall portion, and a plurality of gas holes through the sidewall portion and configured to connect a gas external to the chuck to the gas passage.Type: ApplicationFiled: November 1, 2022Publication date: March 16, 2023Applicant: Taiwan semiconductor Manufacturing Co., Ltd.Inventors: Ian HSIEH, Che-fu CHEN, Yan-Hong LIU
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Patent number: 11600517Abstract: In an embodiment, a system includes: a gas distributor assembly configured to dispense gas into a chamber; and a chuck assembly configured to secure a wafer within the chamber, wherein at least one of the gas distributor assembly and the chuck assembly includes: a first portion comprising a convex protrusion, and a second portion comprising a concave opening, wherein the convex protrusion is configured to engage the concave opening.Type: GrantFiled: August 15, 2019Date of Patent: March 7, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Bo-Ru Chen, Yan-Hong Liu, Che-Fu Chen
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Patent number: 11521884Abstract: The present disclosure describes an apparatus. The apparatus includes a chuck for placing an object thereon, a gas passage extending along a periphery of an outer sidewall of the chuck and separating the chuck into an inner portion and a sidewall portion, and a plurality of gas holes through the sidewall portion and configured to connect a gas external to the chuck to the gas passage.Type: GrantFiled: June 19, 2019Date of Patent: December 6, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ian Hsieh, Che-fu Chen, Yan-Hong Liu
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Publication number: 20220367237Abstract: The present disclosure describes a method that prevents pre-mature dc-chucking in processing modules. The method includes placing a wafer onto a chuck equipped with lift pins. One or more of the lift pins include a pressure sensor configured to measure a pressure exerted by the wafer. The method further includes measuring a first pressure applied to the one or more lift pins by the wafer, lowering the lift pins to place the wafer on the chuck, and processing the wafer. The method also includes removing the wafer from the chuck by pressing the one or more lift pins against the wafer to measure a second pressure exerted by the wafer. If the measured second pressure is equal to the first pressure, the method raises the wafer using the lift pins above the chuck.Type: ApplicationFiled: July 26, 2022Publication date: November 17, 2022Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yan-Hong LIU, Che-fu Chen
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Publication number: 20220359262Abstract: In an embodiment, a system includes: a gas distributor assembly configured to dispense gas into a chamber; and a chuck assembly configured to secure a wafer within the chamber, wherein at least one of the gas distributor assembly and the chuck assembly includes: a first portion comprising a convex protrusion, and a second portion comprising a concave opening, wherein the convex protrusion is configured to engage the concave opening.Type: ApplicationFiled: July 22, 2022Publication date: November 10, 2022Inventors: Bo-Ru CHEN, Yan-Hong LIU, Che-Fu CHEN
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Patent number: 11456203Abstract: The present disclosure describes a method that prevents pre-mature de-chucking in processing modules. The method includes placing a wafer onto a chuck equipped with lift pins. One or more of the lift pins include a pressure sensor configured to measure a pressure exerted by the wafer. The method further includes measuring a first pressure applied to the one or more lift pins by the wafer, lowering the lift pins to place the wafer on the chuck, and processing the wafer. The method also includes removing the wafer from the chuck by pressing the one or more lift pins against the wafer to measure a second pressure exerted by the wafer. If the measured second pressure is equal to the first pressure, the method raises the wafer using the lift pins above the chuck.Type: GrantFiled: June 19, 2019Date of Patent: September 27, 2022Assignee: Taiwan Semiconductor Manufacturing Co., LtdInventors: Yan-Hong Liu, Che-Fu Chen
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Patent number: 11315815Abstract: A wafer container includes at least one shelf and a frame. The shelf is capable of holding at least one wafer, and has at least one opening therein. The opening is at least partially exposed by the wafer when the wafer is hold by the shelf. The frame carries the shelf and allows access to the shelf.Type: GrantFiled: January 5, 2016Date of Patent: April 26, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Po-Hsun Tseng, Yan-Hong Liu, Wen-Han Tan, Hung-Wen Chen
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Publication number: 20220122850Abstract: A method of fabricating a semiconductor device is provided. The method includes forming a first metal layer over a semiconductor substrate, and forming a first layer over the first metal layer. The first layer and first metal layer are etched to expose a sidewall of the first layer and a sidewall of the first metal layer, wherein the etching disburses a portion of the first metal layer to create an accumulation of material on at least one of the sidewall of the first layer or the sidewall of the first metal layer. At least some of the accumulation is etched away using an etchant comprising fluorine.Type: ApplicationFiled: December 27, 2021Publication date: April 21, 2022Inventors: Yan-Hong LIU, Yeh-Chien LIN, Jin-Huai CHANG
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Patent number: 11211232Abstract: The present disclosure describes a chuck-based device and a method for cleaning a semiconductor manufacturing system. The semiconductor manufacturing system can include a chamber with the chuck-based device configured to clean the chamber, a loading port coupled to the chamber and configured to hold one or more wafer storage devices, and a control device configured to control a translational displacement and a rotation of the chuck-based device. The chuck-based device can include a based stage, one or more supporting rods disposed at the base stage and configured to be vertically extendable or retractable, and a padding film disposed on the one or more supporting rods.Type: GrantFiled: April 30, 2019Date of Patent: December 28, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ian Hsieh, Che-fu Chen, Yan-Hong Liu
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Patent number: 11211257Abstract: A method of fabricating a semiconductor device is provided. The method includes forming a first metal layer over a semiconductor substrate, and forming a first layer over the first metal layer. The first layer and first metal layer are etched to expose a sidewall of the first layer and a sidewall of the first metal layer, wherein the etching disburses a portion of the first metal layer to create an accumulation of material on at least one of the sidewall of the first layer or the sidewall of the first metal layer. At least some of the accumulation is etched away using an etchant comprising fluorine.Type: GrantFiled: July 1, 2019Date of Patent: December 28, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Yan-Hong Liu, Yeh-Chien Lin, Jin-Huai Chang
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Patent number: 11177183Abstract: A system includes a factory interface, a deposition tool, and at least one measuring device. The factory interface is configured to carry a wafer. The deposition tool is coupled to the factory interface and configured to process the wafer transferred from the factory interface. The at least one measuring device is equipped in the factory interface, the deposition tool, or the combination thereof. The at least one measuring device is configured to perform real-time measurements of a thickness of a material on the wafer that is carried in the factory interface or the deposition tool.Type: GrantFiled: July 8, 2019Date of Patent: November 16, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yan-Hong Liu, Chien-Chih Wu, Che-Fu Chen
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Patent number: 11139149Abstract: Disclosed is a gas injector for a semiconductor processing system comprising a tube, and at least one nozzle head mounted on a downstream end of the tube wherein the at least one nozzle allows a fluid communication to discharge a gas from a upstream end of the tube through the at least one nozzle of the gas injector to ambient atmosphere surrounding the downstream end of the tube, wherein the at least one nozzle comprises: a body, and at least one adaptor comprising a plurality of flow regulation components to alter a flow direction of the gas at the downstream end, wherein the plurality of flow regulation components are each constructed and arranged such that a film buildup on inner surfaces of the gas injector is reduced.Type: GrantFiled: August 17, 2018Date of Patent: October 5, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yan-Hong Liu, Ming-Feng Chen, Li-Shi Liu, Che-Fu Chen
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Patent number: 11101163Abstract: In an embodiment, a system includes: an airlock; a first semiconductor processing chamber, a second semiconductor processing chamber; and a transfer module configured to move a sensor into and out of the first semiconductor processing chamber and the second semiconductor processing chamber, wherein the sensor is configured to: collect sensor data characterizing the first semiconductor processing chamber when within the first semiconductor processing chamber; and collect sensor data characterizing the second semiconductor processing chamber when within the second semiconductor processing chamber, wherein the transfer module, the first semiconductor processing chamber, and the second semiconductor processing chamber are within a controlled internal atmosphere on a first side of the airlock and separated by the airlock from an uncontrolled external atmosphere on a second side of the airlock.Type: GrantFiled: November 13, 2018Date of Patent: August 24, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yan-Hong Liu, Hung-Wen Chen, Che-Fu Chen
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Publication number: 20210233797Abstract: In an embodiment, a robotic arm includes: a base; at least one link secured to the base; a gripper secured to the at least one link, wherein: the gripper comprises a finger, the gripper is configured to secure a wafer while the at least one link is in motion, and the gripper is configured to release the wafer while the at least one link is stopped, a sensor disposed on the finger, the sensor configured to collect sensor data characterizing the robotic arm's interaction with a semiconductor processing chamber while the wafer is secured using the finger.Type: ApplicationFiled: April 9, 2021Publication date: July 29, 2021Inventors: Yan-Hong Liu, Ming-Feng Chen, Che-fu Chen, Hung-Wen Chen
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Publication number: 20210225680Abstract: In an embodiment, a system includes: an orientation sensor configured to detect an orientation fiducial on a bevel of a wafer; a pedestal configured to rotate the wafer to allow the orientation sensor to detect the orientation fiducial and place the orientation fiducial at a predetermined orientation position; and a defect sensor configured to detect a wafer defect along a surface of the wafer while rotated by the pedestal.Type: ApplicationFiled: April 9, 2021Publication date: July 22, 2021Inventors: Yan-Hong LIU, Daniel M.Y. Yang, Che-Fu Chen