Patents by Inventor Yao-Hui Hu

Yao-Hui Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer laser-making method and die fabricated using the same
    Patent number: 8728915
    Abstract: A wafer laser-marking method is provided. First, a wafer having a first surface (an active surface) and a second surface (a back surface) opposite to each other is provided. Next, the wafer is thinned. Then, the thinned wafer is fixed on a non-UV tape such that the second surface of the wafer is attached to the tape. Finally, the laser marking step is performed, such that a laser light penetrates the non-UV tape and marks a pattern on the second surface of the wafer. According to the laser-marking method of the embodiment, the pattern is formed by the non-UV residuals left on the second surface of the wafer, and the components of the glue residuals at least include elements of silicon and carbon.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: May 20, 2014
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Pin Tsai, Cheng-I Huang, Yao-Hui Hu
  • WAFER LASER-MARKING METHOD AND DIE FABRICATED USING THE SAME
    Publication number: 20110316122
    Abstract: A wafer laser-marking method is provided. First, a wafer having a first surface (an active surface) and a second surface (a back surface) opposite to each other is provided. Next, the wafer is thinned. Then, the thinned wafer is fixed on a non-UV tape such that the second surface of the wafer is attached to the tape. Finally, the laser marking step is performed, such that a laser light penetrates the non-UV tape and marks a pattern on the second surface of the wafer. According to the laser-marking method of the embodiment, the pattern is formed by the non-UV residuals left on the second surface of the wafer, and the components of the glue residuals at least include elements of silicon and carbon.
    Type: Application
    Filed: September 6, 2011
    Publication date: December 29, 2011
    Inventors: Yu-Pin TSAI, Cheng-I Huang, Yao-Hui Hu
  • WAFER LASER-MARKING METHOD AND DIE FABRICATED USING THE SAME
    Publication number: 20100001416
    Abstract: A wafer laser-marking method is provided. First, a wafer having a first surface (an active surface) and a second surface (a back surface) opposite to each other is provided. Next, the wafer is thinned. Then, the thinned wafer is fixed on a tape such that the second surface of the wafer is attached to the tape. Finally, the laser marking step is performed, such that a laser light penetrates the tape and marks a pattern on the second surface of the wafer. There are glue residuals remained in the laser-marking pattern of the die manufactured according to the laser-marking method of the invention, and the components of the glue residuals at least include elements of silicon, carbon and oxygen.
    Type: Application
    Filed: June 10, 2009
    Publication date: January 7, 2010
    Inventors: Yu-Pin Tsai, Cheng-Yi Huang, Yao-Hui Hu