Patents by Inventor Yasuaki HATAYAMA

Yasuaki HATAYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240166552
    Abstract: A spherical inorganic oxide powder wherein a volume-based cumulative 50% diameter D50 is 4-55 ?m; and in a cross-section of a cured body containing an epoxy resin and the spherical inorganic oxide powder at a mass ratio of 2:1, when a total of 5000 particles with a maximum diameter of 51 ?m or larger are observed in a field of view at 100× magnification using a scanning electron microscope, a total number of air bubbles having a maximum diameter of 1 ?m or larger and smaller than 10 ?m is 40 or fewer and a total number of air bubbles having a maximum diameter of 10 ?m or larger is 30 or fewer.
    Type: Application
    Filed: March 23, 2022
    Publication date: May 23, 2024
    Applicant: DENKA COMPANY LIMITED
    Inventors: Yasuaki HATAYAMA, Takashi FUKUDA
  • Publication number: 20230312356
    Abstract: An amorphous silica powder that is suitable for obtaining a solid sealant that exhibits superior fluidity and filling properties, and a resin composition obtained by using the amorphous silica powder as a filler. An amorphous silica powder is prepared so as to have a modal diameter within the range of 1 to 10 ?m in the particle diameter frequency distribution and have a frequency of particles having particle diameters of 0.50 to 1.83 ?m of less than 3.0% in the particle diameter frequency distribution.
    Type: Application
    Filed: August 17, 2021
    Publication date: October 5, 2023
    Applicant: DENKA COMPANY LIMITED
    Inventors: Yasuaki HATAYAMA, Takashi FUKUDA, Atsuya SUGIMOTO
  • Publication number: 20230312868
    Abstract: An amorphous silica powder that is suitable for obtaining a liquid sealant that exhibits superior filling properties and preservation properties, and a resin composition obtained by using the amorphous silica powder as a filler. More specifically, an amorphous silica powder is prepared so as to have a modal diameter within the range of 1 to 10 ?m and a frequency of particles having particle diameters of less than 0.50 ?m of 1.0% or more in the particle diameter frequency distribution and have a specific surface area of 1 to 12 m2/g.
    Type: Application
    Filed: August 17, 2021
    Publication date: October 5, 2023
    Applicant: DENKA COMPANY LIMITED
    Inventors: Yasuaki HATAYAMA, Takashi FUKUDA, Atsuya SUGIMOTO