Abstract: A connector is a configuration assembled into a wire harness for automobile vehicle to dispute electric power, and the connector includes a plurality of busbars and a housing to accommodate these busbars. The housing includes a busbar holding portion at one side thereof, and a terminal accommodation room at the other side thereof to accommodate a terminal that is electrically connected to the busbar. The busbar holding portion includes a pair of clamping plates that clamp the busbar from both sides in a thickness direction thereof. The housing includes a plurality of heat dissipation plates standing vertically from the clamping plates respectively. Also, the heat dissipation plate that is standing from the clamping plate of the busbar holding portion in the upper segment to the busbar holding portion in the lower segment is spaced apart from the clamping plate of the busbar retention plate in the lower segment.

Abstract: Provided is a polishing composition that can effectively improve a polishing removal rate. According to the present invention, a polishing composition for polishing a polishing target material is provided. The polishing composition contains water, an oxidant, and a polishing removal accelerator, and does not contain abrasive. At least one metal salt selected from the group consisting of an alkali metal salt and an alkaline earth metal salt is contained as the polishing removal accelerator.

Abstract: Provided is a polishing composition containing an abrasive, permanganate, an aluminum salt, and water. In the polishing composition, a relation of a content W1 [% by weight] of the abrasive, a concentration C1 [mM] of the permanganate, and a concentration C2 [mM] of the aluminum salt satisfies at least one condition of the following conditions [A], [B], and [C]: satisfying both of 500?(C1/W1) and 0.04?(C2/C1);??[A] satisfying both of 200?(C1/?(W1)) and 8?C2; and??[B] satisfying both of 500?(C1/W1) and 8?C2.

Abstract: A connector includes a busbar including a base portion in a strip plate shape and a plurality of tab terminals extending from a predetermined position in a longitudinal direction of the base portion; and a housing including a busbar accommodation room in which the busbar is accommodated, wherein the busbar accommodation room includes a pair of plate portions for sandwiching and holding the base portion, the pair of plate portions are provided with a first protrusion and a second protrusion respectively, the first/second protrusion protruding toward each other and being contactable with the busbar, the first protrusion and the second protrusion are provided at shifted positions in an extending direction of the tab terminal, and the tab terminal is accommodated in the busbar accommodation room in a tilted state of being apart from the one side as advancing in the direction in which the tab terminal extends.

Abstract: Provided are a polishing method and a polishing composition that are applied to polishing of silicon carbide and allows reduction of rise in pH of the polishing composition and increase in pad temperature during polishing Provided is a method of polishing an object to be polished having a surface formed of silicon carbide. The method includes steps of preparing a polishing composition, and supplying the polishing composition to the object to be polished and polishing the object to be polished. The polishing composition contains permanganate, a metal salt A, and water. The metal salt A is a salt of a metal cation having a pKa of less than 7.0 in form of a hydrated metal ion, and an anion.

Abstract: Provided is a polishing composition containing an abrasive, permanganate, an aluminum salt, and water. In the polishing composition, a relation of a content W1 [% by weight] of the abrasive, a concentration C1 [mM] of the permanganate, and a concentration C2 [mM] of the aluminum salt satisfies at least one condition of the following conditions [A], [B], and [C]: satisfying both of 500?(C1/W1) and 0.04?(C2/C1);??[A] satisfying both of 200?(C1/?(W1)) and 8?C2; and??[B] satisfying both of 500?(C1/W1) and 8?C2.

Abstract: Provided is a polishing composition that can reduce increase in temperature of a polishing pad during polishing. The polishing composition provided by the present invention contains water, oxidant A selected from compounds other than peroxide, a first metal salt selected from alkaline-earth metal salts, and a second metal salt selected from salts each of which has a cation of a metal belonging to groups 3 to 16 in the periodic table, and an anion.

Abstract: Provided is a polishing composition containing an abrasive, permanganate, an aluminum salt, and water. In the polishing composition, a relation of a content W1 [% by weight] of the abrasive, a concentration C1 [mM] of the permanganate, and a concentration C2 [mM] of the aluminum salt satisfies at least one condition of the following conditions [A], [B], and [C]: satisfying both of 500?(C1/W1) and 0.04?(C2/C1);??[A] satisfying both of 200?(C1/?(W1)) and 8?C2; and??[B] satisfying both of 500?(C1/W1) and 8?C2.

Abstract: Provided are a polishing method and a polishing composition that are applied to polishing of silicon carbide and allows reduction of rise in pH of the polishing composition and increase in pad temperature during polishing Provided is a method of polishing an object to be polished having a surface formed of silicon carbide. The method includes steps of preparing a polishing composition, and supplying the polishing composition to the object to be polished and polishing the object to be polished. The polishing composition contains permanganate, a metal salt A, and water. The metal salt A is a salt of a metal cation having a pKa of less than 7.0 in form of a hydrated metal ion, and an anion.

Abstract: Provided is a polishing composition that can reduce the friction force against an object to be polished while maintaining a favorable polishing removal rate. The polishing composition provided by the present invention contains water, an abrasive, and a composite metal oxide as an oxidant. The polishing composition further contains an anionic polymer. In some preferred embodiments, the polishing composition contains a permanganate as the composite metal oxide. The polishing composition is suitable for polishing a material having a Vickers hardness of 1500 Hv or higher.

Abstract: The present invention provides a polishing composition with which polishing rates can be effectively improved and which is for polishing works to be polished. The polishing composition comprises water, abrasive grains, an oxidant, and a polishing accelerator. The polishing accelerator comprises at least one metal salt selected from the group consisting of alkali metal salts and alkaline-earth metal salts.

Abstract: Provided is a polishing composition that can effectively improve a polishing removal rate. According to the present invention, a polishing composition for polishing a polishing target material is provided. The polishing composition contains water, an oxidant, and a polishing removal accelerator, and does not contain abrasive. At least one metal salt selected from the group consisting of an alkali metal salt and an alkaline earth metal salt is contained as the polishing removal accelerator.

Abstract: Provided is a polishing composition that can effectively improve a polishing removal rate. According to the present invention, a polishing composition for polishing a polishing target material is provided. The polishing composition contains water, an oxidant, and a polishing removal accelerator, and does not contain abrasive. At least one metal salt selected from the group consisting of an alkali metal salt and an alkaline earth metal salt is contained as the polishing removal accelerator.

Abstract: The present invention provides a polishing composition with which polishing rates can be effectively improved and which is for polishing works to be polished. The polishing composition comprises water, abrasive grains, an oxidant, and a polishing accelerator. The polishing accelerator comprises at least one metal salt selected from the group consisting of alkali metal salts and alkaline-earth metal salts.

Abstract: Provided is a polishing composition that can effectively improve a polishing removal rate. According to the present invention, a polishing composition for polishing a polishing target material is provided. The polishing composition contains water, an oxidant, and a polishing removal accelerator, and does not contain abrasive. At least one metal salt selected from the group consisting of an alkali metal salt and an alkaline earth metal salt is contained as the polishing removal accelerator.

Abstract: To prevent an increase of the number of kinds of components required for offset arrangement, an increase in risk of assembly error and extra time and effort for parts management, in a connector including mutually facing terminal members with contacting portions being offset in the insertion direction. Mutually facing terminal members 20 are formed on components identical in shape. The mutually facing terminal members 20 are secured to a connector housing 12 while being offset in an insertion direction of a double-sided card edge 102 inserted into a receptacle compartment 14 of the connector housing 12.

Abstract: To prevent an increase of the number of kinds of components required for offset arrangement, an increase in risk of assembly error and extra time and effort for parts management, in a connector including mutually facing terminal members with contacting portions being offset in the insertion direction. Mutually facing terminal members 20 are formed on components identical in shape. The mutually facing terminal members 20 are secured to a connector housing 12 while being offset in an insertion direction of a double-sided card edge 102 inserted into a receptacle compartment 14 of the connector housing 12.

Abstract: By using a G protein-coupled receptor protein comprising an amino acid sequence, which is the same or substantially the same as the amino acid sequence represented by SEQ ID NO: 1, or a salt thereof, and an ionizable metal element or a salt thereof, an agonist for or an antagonist to the above receptor protein or a salt thereof can be efficiently screened.

Abstract: The GPR40 receptor function regulator of the present invention, which comprises a compound having an aromatic ring and a group capable of releasing cation is useful as an insulin secretagogue or an agent for the prophylaxis or treatment of diabetes and the like.

Abstract: The present invention provides a method of screening a compound or its salt that alters binding properties of a protein comprising the same or substantially the same amino acid sequence as the amino acid sequence represented by SEQ ID NO: 1, or a salt thereof, and a ligand capable of specifically binding to the protein or its salt, which comprises using (a) the protein, its partial peptide, or a salt thereof and (b) the ligand; a screening kit therefor, and so on. The screening method and kit of the present invention are useful for screening an agent for the prevention/treatment of, e.g., digestive tract disorders, cancer, immune disorders, type II diabetes mellitus or obesity, etc.