Patents by Inventor Yasuaki Konomi

Yasuaki Konomi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11186715
    Abstract: Provided are a polyphenylene ether resin composition having excellent fluidity and heat resistance, and a vehicle lighting fixture bezel formed of this resin composition and having light weight, excellent external appearance, and low water absorbency. The resin composition contains: (A) 42-57 mass % of a polyphenylene ether resin having a reduced viscosity of 0.39-0.43 dL/g (in chloroform solvent at 30° C.); (B) 11-26 mass % of a polyphenylene ether resin having a reduced viscosity of 0.31-0.34 dL/g (in chloroform solvent at 30° C.); (C) 9-15 mass % of a block copolymer including a vinyl aromatic hydrocarbon polymer block (c1) and a hydrogenated conjugated diene polymer block (c2); and (D) 15-23 mass % of a homopolymer of a vinyl aromatic hydrocarbon. The (C) block copolymer includes 62-70 mass % of vinyl aromatic hydrocarbon-derived monomer units, has a weight-average molecular weight Mw of 50,000-70,000, and has a molecular weight distribution Mw/Mn (Mn is number-average molecular weight) of 1.00-1.30.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: November 30, 2021
    Assignees: ASAHI KASEI KABUSHIKI KAISHA, KOITO MANUFACTURING CO., LTD.
    Inventors: Yasuaki Konomi, Masahiko Niino, Hidetaka Anma, Kazuhito Osada, Takashi Furui
  • Publication number: 20210061995
    Abstract: Provided are a polyphenylene ether resin composition having excellent fluidity and heat resistance, and a vehicle lighting fixture bezel formed of this resin composition and having light weight, excellent external appearance, and low water absorbency. The resin composition contains: (A) 42-57 mass % of a polyphenylene ether resin having a reduced viscosity of 0.39-0.43 dL/g (in chloroform solvent at 30° C.); (B) 11-26 mass % of a polyphenylene ether resin having a reduced viscosity of 0.31-0.34 dL/g (in chloroform solvent at 30° C.); (C) 9-15 mass % of a block copolymer including a vinyl aromatic hydrocarbon polymer block (c1) and a hydrogenated conjugated diene polymer block (c2); and (D) 15-23 mass % of a homopolymer of a vinyl aromatic hydrocarbon. The (C) block copolymer includes 62-70 mass % of vinyl aromatic hydrocarbon-derived monomer units, has a weight-average molecular weight Mw of 50,000-70,000, and has a molecular weight distribution Mw/Mn (Mn is number-average molecular weight) of 1.00-1.30.
    Type: Application
    Filed: September 3, 2020
    Publication date: March 4, 2021
    Applicants: ASAHI KASEI KABUSHIKI KAISHA, KOITO MANUFACTURING CO.,LTD.
    Inventors: Yasuaki KONOMI, Masahiko NIINO, Hidetaka ANMA, Kazuhito OSADA, Takashi FURUI
  • Publication number: 20180265702
    Abstract: A laminated molded article includes a molded product formed from a resin composition and a metal thin-film layer. The composition contains a polyphenylene ether resin (A) and an amorphous ?-olefin copolymer (B). The resin (A) includes 95 to 99.95 mass % of a polyphenylene ether (i) and 0.05 to 5 mass % of a compound (ii) being at least one compound selected from the group consisting of: an organophosphorus compound having, in molecules thereof, a chemical structure represented by formula (I) or (II) (R in formula (II) is a trivalent saturated hydrocarbon group having a carbon number of 1 to 8 or a trivalent aromatic hydrocarbon group having a carbon number of 6 to 12); and a phosphonic acid, phosphonic acid ester, phosphinic acid, phosphinic acid ester, monocarboxylic acid, sulfonic acid, sulfinic acid, or carbonate other than the organophosphorus compound, relative to 100 mass %, in total, of components (i) and (ii).
    Type: Application
    Filed: September 28, 2017
    Publication date: September 20, 2018
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventor: Yasuaki KONOMI
  • Publication number: 20180094136
    Abstract: A laminated molded article includes a molded product formed from a resin composition and a metal thin-film layer. The composition contains a polyphenylene ether resin (A) and an amorphous ?-olefin copolymer (B). The resin (A) includes 95 to 99.95 mass % of a polyphenylene ether (i) and 0.05 to 5 mass % of a compound (ii) being at least one compound selected from the group consisting of: an organophosphorus compound having, in molecules thereof, a chemical structure represented by formula (I) or (II) (R in formula (II) is a trivalent saturated hydrocarbon group having a carbon number of 1 to 8 or a trivalent aromatic hydrocarbon group having a carbon number of 6 to 12); and a phosphonic acid, phosphonic acid ester, phosphinic acid, phosphinic acid ester, monocarboxylic acid, sulfonic acid, sulfinic acid, or carbonate other than the organophosphorus compound, relative to 100 mass %, in total, of components (i) and (ii).
    Type: Application
    Filed: September 28, 2017
    Publication date: April 5, 2018
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventor: Yasuaki KONOMI
  • Patent number: 8653176
    Abstract: Disclosed is a thermally conductive material having excellent heat conductivity and insulating properties and having flame retardancy while retaining flexibility and toughness. More specifically, there is provided a thermally conductive material comprising: a hydrogenated copolymer (1) and/or a modified hydrogenated copolymer (2) in which each has a specific structure and is contained in a specific amount; and zinc oxide (3) comprising a core part and acicular crystal parts extending from the core part in four axial directions. The thermally conductive material optionally further comprises a paraffin oil (4), a flame retardant (5), or a filler (6) having a thermal conductivity of 10 to 400 W/m·K (the zinc oxide (3) is excluded).
    Type: Grant
    Filed: December 26, 2006
    Date of Patent: February 18, 2014
    Assignee: Asahi Kasei E-Materials Corporation
    Inventors: Motonori Nakamichi, Yasuaki Konomi, Takeshi Yasui, Katsumi Suzuki
  • Publication number: 20140011012
    Abstract: A resin composition includes 1 to 20% by mass of (A) a copolymer containing a conjugated diene unit and a vinyl aromatic compound unit, 1 to 20% by mass of (B) a softening agent for rubber, and 70 to 95% by mass of (C) metal hydroxide, in which (A) the copolymer containing the conjugated diene unit and the vinyl aromatic compound unit includes a plurality of polymer blocks of the vinyl aromatic compound unit.
    Type: Application
    Filed: September 4, 2013
    Publication date: January 9, 2014
    Applicant: ASAHI KASEI E-MATERIALS CORPORATION
    Inventors: Kazuya NODA, Takeshi YASUI, Yasuaki KONOMI, Akira MIYAMOTO
  • Publication number: 20110091708
    Abstract: A resin composition includes 1 to 20% by mass of (A) a copolymer containing a conjugated diene unit and a vinyl aromatic compound unit, 1 to 20% by mass of (B) a softening agent for rubber, and 70 to 95% by mass of (C) metal hydroxide, in which (A) the copolymer containing the conjugated diene unit and the vinyl aromatic compound unit includes a plurality of polymer blocks of the vinyl aromatic compound unit.
    Type: Application
    Filed: April 30, 2009
    Publication date: April 21, 2011
    Applicant: ASAHI KASEI E-MATERIALS CORPORATION
    Inventors: Kazuya Noda, Takeshi Yasui, Yasuaki Konomi, Akira Miyamoto
  • Publication number: 20100012884
    Abstract: Disclosed is a thermally conductive material having excellent heat conductivity and insulating properties and having flame retardancy while retaining flexibility and toughness. More specifically, there is provided a thermally conductive material comprising: a hydrogenated copolymer (1) and/or a modified hydrogenated copolymer (2) in which each has a specific structure and is contained in a specific amount; and zinc oxide (3) comprising a core part and acicular crystal parts extending from the core part in four axial directions. The thermally conductive material optionally further comprises a paraffin oil (4), a flame retardant (5), or a filler (6) having a thermal conductivity of 10 to 400 W/m·K (the zinc oxide (3) is excluded).
    Type: Application
    Filed: December 26, 2006
    Publication date: January 21, 2010
    Inventors: Motonori Nakamichi, Yasuaki Konomi, Takeshi Yasui, Katsumi Suzuki