Abstract: A controller of a power conversion apparatus according to an embodiment causes a chopper and an inverter to generate an alternating-current (AC) voltage including first and second parts of an AC voltage waveform and causes the inverter to output the AC voltage. The chopper generates the first part having an absolute value higher than a voltage of a DC power supply, and the inverter generates the second part having an absolute value lower than the voltage of the DC power supply. The controller is configured to alternately turn on the first and second switching elements in a period during which the controller controls the chopper to generate the first part of the AC voltage waveform.

Abstract: A controller of a power conversion apparatus according to an embodiment causes a chopper and an inverter to generate an alternating-current (AC) voltage including first and second parts of an AC voltage waveform and causes the inverter to output the AC voltage. The chopper generates the first part having an absolute value higher than a voltage of a DC power supply, and the inverter generates the second part having an absolute value lower than the voltage of the DC power supply. The controller is configured to alternately turn on the first and second switching elements in a period during which the controller controls the chopper to generate the first part of the AC voltage waveform.

Abstract: A power module includes a power module body portion and a wiring board. The power module body portion includes P-side semiconductor elements and N-side semiconductor elements, and a P-side terminal connection portion, a U-phase terminal connection portion, and an N-side terminal connection portion which establish electrical connection with the wiring board on an upper surface of the power module body portion and into which a current flows from the wiring board and from which a current flows to the wiring board.

Abstract: A power module includes a power module body portion. The power module body portion includes a P-side conductive plate, a first N-side conductive plate, and a second N-side conductive plate that are disposed with a distance thereamong in the power module body portion, P-side semiconductor elements that are disposed on a front surface of the P-side conductive plate, N-side semiconductor elements that are disposed on a front surface of the first N-side conductive plate and that are electrically connected to the P-side semiconductor elements, and a capacitor that is disposed between the P-side semiconductor elements and the N-side semiconductor elements so as to be connected to the P-side conductive plate and the second N-side conductive plate in the power module body portion and that suppresses a surge voltage.

Abstract: A power module includes a power module body portion and a wiring board. The power module body portion includes P-side semiconductor elements and N-side semiconductor elements, and a P-side terminal connection portion, a U-phase terminal connection portion, and an N-side terminal connection portion which establish electrical connection with the wiring board on an upper surface of the power module body portion and into which a current flows from the wiring board and from which a current flows to the wiring board.

Abstract: The present power converter includes a power conversion semiconductor device, an electrode connection conductor which electrically connects multiple electrodes having the same potential, and also has a generally flat upper surface for electrically connecting to an exterior portion, and a sealing material provided so as to cover the power conversion semiconductor device, and also to expose the generally flat upper surface of the electrode connection conductor.

Abstract: A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.

Abstract: The present invention provides a power module in which a first semiconductor device disposed on a first substrate and a second semiconductor device disposed on a second substrate are disposed at symmetrical positions with a third substrate interposed therebetween.

Abstract: A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.

Abstract: This power converter includes a power-conversion semiconductor element, an electrode conductor having a substantially flat upper end surface, and a sealant. The sealant allows the substantially flat upper end surface of the electrode conductor to be exposed at an upper surface of the sealant, and provides electrical connection with an external device at the upper end surface of the exposed electrode conductor.

Abstract: The present power converter includes a power conversion semiconductor device, an electrode connection conductor which electrically connects multiple electrodes having the same potential, and also has a generally flat upper surface for electrically connecting to an exterior portion, and a sealing material provided so as to cover the power conversion semiconductor device, and also to expose the generally flat upper surface of the electrode connection conductor.

Abstract: A power converter includes a plurality of semiconductor modules each including a semiconductor device that generates heat and a cooler that includes a first cooling element, on which the semiconductor device is directly mounted through a connecting member, and a second cooling element having a higher heat capacity than the first cooling element, and an insulating casing receiving the semiconductor modules to electrically isolate the semiconductor devices from each other.

Abstract: The present invention provides a power module in which a first semiconductor device disposed on a first substrate and a second semiconductor device disposed on a second substrate are disposed at symmetrical positions with a third substrate interposed therebetween.