Abstract: A large-scale and efficient industrialization of olefin polymerization by metallocene catalysts is realized by, in olefin polymerization by metallocene-based catalysts, increasing catalytic activity and polymerization efficiency to sufficiently bring out the performances of the metallocene catalysts and maintain a stable polymerization reaction. The amount of a halogen-containing compound is controlled so that the gram-atomic amount ratio to a transition metal of a halogen atom in a halogen-containing compound in solvents and materials other than a halogen atom in a catalyst component is 0.8 or less, in manufacturing plants of commercial level in an olefin polymerization by a metallocene catalyst.

Abstract: For implementing a method of mounting electronic components, and an apparatus therefor, which has a much reduced tact time, the nozzles 3a, 3b, 3c, 3d, 3e and 3f are kept in holes 5 provided in a straight line row in nozzle stocker 4 in the order of use sequence. When the type of electronic components to be mounted on a circuit board changes, transfer head 1 has to go to a place above the nozzle stocker 4 to replace the nozzle. In the invented mounting method, and mounting apparatus, the transfer head 1 is required to move only to a place above the next nozzle 3b after returning the used nozzle 3a to a hole 5. Thus the stroke L of transfer head 1 needed for the nozzle exchange is significantly reduced, and the nozzle may be replaced within a short time.

Abstract: A large-scale and efficient industrialization of olefin polymerization by metallocene catalysts is realized by, in olefin polymerization by metallocene-based catalysts, increasing catalytic activity and polymerization efficiency to sufficiently bring out the performances of the metallocene catalysts and maintain a stable polymerization reaction. The amount of a halogen-containing compound is controlled so that the gram-atomic amount ratio to a transition metal of a halogen atom in a halogen-containing compound in solvents and materials other than a halogen atom in a catalyst component is 0.8 or less, in manufacturing plants of commercial level in an olefin polymerization by a metallocene catalyst.

Abstract: A component mounter has two or more feeder carriages and two or more mounting heads corresponding to the feeder carriages. The mounting heads pick up components from each feeder carriage. A transfer device is able to pass components requiring transfer between the mounting heads. The transfer of components enables the mounter to be used efficiently by transferring components to a different mounting head when the operation of one of the mounting heads stops.

Abstract: For implementing a method of mounting electronic components, and an apparatus therefor, which has a much reduced tact time, the nozzles 3a, 3b, 3c, 3d, 3e and 3f are kept in holes 5 provided in a straight line row in nozzle stocker 4 in the order of use sequence. When the type of electronic components to be mounted on a circuit board changes, transfer head 1 has to go to a place above the nozzle stocker 4 to replace the nozzle. In the invented mounting method, and mounting apparatus, the transfer head 1 is required to move only to a place above the next nozzle 3b after returning the used nozzle 3a to a hole 5. Thus the stroke L of transfer head 1 needed for the nozzle exchange is significantly reduced, and the nozzle may be replaced within a short time.

Abstract: For implementing a method of mounting electronic components, and an apparatus therefor, which has a much reduced tact time, the nozzles 3a, 3b, 3c, 3d, 3e and 3f are kept in holes 5 provided in a straight line row in nozzle stocker 4 in the order of use sequence. When the type of electronic components to be mounted on a circuit board changes, transfer head 1 has to go to a place above the nozzle stocker 4 to replace the nozzle. In the invented mounting method, and mounting apparatus, the transfer head 1 is required to move only to a place above the next nozzle 3b after returning the used nozzle 3a to a hole 5. Thus the stroke L of transfer head 1 needed for the nozzle exchange is significantly reduced, and the nozzle may be replaced within a short time.

Abstract: A component mounting method for picking up components with a mounting head having multiple suction nozzles, and mounting these components on a mounting target after recognition. Components picked up integrally move against a component recognizer disposed on a movement route of the head for scanning and recognizing each component. During scanning, the slowest speed in scanning speeds required for recognizing each component is used. This eliminates a approaching time needed for switching speed during scanning of each component, thus reducing the total recognition time to improve mounting efficiency.

Abstract: Trays within a tray feeder provided with electronic components requiring a higher accuracy of mounting position such as QFPs, etc. are collectively placed at one side of a recognition device equipped with a line sensor. A transfer head picks up an electronic component in the tray and discerns a position of the electronic component by moving over the line sensor in one and the same fixed direction at all the time. This scanning direction is the same as a direction of calibration of a nozzle of the transfer head. Accordingly, a detecting error in the position of electronic component caused by the scanning direction is eliminated and the electronic component can be mounted with a high positional accuracy on a substrate.

Abstract: A pipe made of a polyethylene resin which is a linear polyethylene having the following physical properties (1) to (4): (1) a melt flow rate of 0.02 to 0.2 g/10 min, (2) a flow ratio of 50 or more, (3) a density of 0.945 to 0.960 g/cm3, and (4) a relaxation parameter H, represented by the following equation (I), of 2.

Abstract: The cycle time for mounting electronic components supplied from a tray can be shortened. An electronic component feeder (16) for mounting electronic components has a plurality of height levels (L1, L2, and L3) and can move tables (19, 20, 21) horizontally at the respective levels (L1, L2, and L3). A plurality of conveyers (22, 23, 24) are provided for the respective tables to move them to a pickup stage (A) from a standby stage (B). Transfer head (13) includes nozzles (14a, 14b, 14c) for attracting electronic components by suction, and an upward-downward moving mechanism which moves the nozzles in accordance with the height level of each tray on the pickup stage (A). Since the trays are arranged at the different height levels at the pickup stage position, the conveyers can be moved independently and the transfer heads can individually move the nozzles between the position at which each nozzle picks up electronic components and another position at which the nozzle does not interfere with the pickup operation.

Abstract: An electronic components mounting machine comprising an actuator(7), whereby electronic components are mounted on a substrate, a camera(5) whereby coordinates of recognition marks formed on the substrate at four places at least, are detected, a controller(6) whereby actuator(7) is controlled, a mounting data table(9) wherein information on mounting coordinates and mounting angles of electronic components to be mounted is stored, and a correction data table(10) wherein information on correction values to be applied to the mounting coordinates and mounting angles in reference to the substrate, on which the electronic components are mounted, is stored, and characterized in that the correction data table(10) stores information on correction values for each respective cell, which is formed by dividing the substrate into a plurality of small sections according to a specified rule in reference to the coordinates of recognition marks detected by the camera(5), thus enabling to mount each respective electronic compone

Abstract: An apparatus and method for improving the productivity and accuracy of mounting electronic components on a substrate. The mounting apparatus includes a line-sensor for image recognition, a carriage head 20 having plural nozzles 21a, 21b and 21c aligned along a predetermined axis. The carriage head 20 is transferred along the direction of the aligned nozzles and above the line-sensor 33 of a recognition member 30. The line-sensor 33 takes images in sequence of the electronic components (chip) vacuum chucked by each nozzle 21a, 21b and 21c in order to recognize positions of the chips 12. Then, based on the recognition results, position deviations of the chips 12 with regard to X, Y and .theta. directions are compensated, and the chips 12 are mounted onto specified coordinate spots of substrate 3. The recognition member 30 includes an adjusting means of rotation angle for crossing the longitudinal direction of line-sensor 33 with the transferring direction of nozzles 21a, 21b and 21c at right angles.

Abstract: A mounting apparatus mounts electronic parts on a substrate. The mounting apparatus includes an electronic part feeder having a moving table which moves along a moving path. The moving table moves a part cassette accommodating electronic parts to a pick up station. A transferring and mounting unit having a transferring and mounting head is also provided to move between the pick up station and the mounting station to retrieve the electronic part from a part pick up port of the part cassette at the pick up station. The transferring and mounting head has a nozzle for picking up an electronic part. The transferring and mounting head rotates the nozzle along a circular path. The moving path and the circular path intersect at two points at the pick up station. The pick up port of the part cassette is positioned at one of the intersecting points.

Abstract: In an of electronic components mounting apparatus pick-and-place heads are rotated for indexing along a rotary head to pick up electronic components of an electronic components feeding device and the components are mounted on a circuit board, which is positioned on an X-Y table. A moving base is moved in lateral direction, and the components placed on feeders are supplied to the pick-and-place heads. The moving base is divided into a feeding area and retreat areas, and accommodating areas for accommodating tables are provided near the retreat areas to move the tables reciprocatively between the retreat areas and the feeding areas. The tables hindering this movement are accommodated in the accommodating areas. Therefore, only a desired table is positioned in the feeding area. By moving this table at high speed, the electronic components can be supplied to the pick-and-place heads. When there is no more electronic component on a feeder, the feeder can be exchanged in the accommodating area.

Abstract: An apparatus for supplying an electronic component to a mounting head of an electronic component mounting machine in such a manner that a lead guard interconnecting the front ends of leads of the electronic component is separated from a body of the electronic component before the electronic component is picked up by the mounting head. The apparatus includes a lower mold movable between a receiving position in which an electronic component having a lead guard is received on a die on the lower mold, a punching position in which the lead guard is separated from the body of the electronic component by a punch cooperating with the die and a picking-up position in which the electronic component devoid of the lead guard is picked up from the die. The electronic component supplied from a chute to a component rest is delivered by a transfer unit to the die while at rest in the receiving position. The transfer unit may include a vacuum nozzle for releasably holding the electronic component.