Patents by Inventor Yasuhiro Mizuno
Yasuhiro Mizuno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11949196Abstract: A braided part connection structure includes a braided part having a tubular shape covering an insulated wire along a longitudinal direction of the braided part connection structure and a shield member having a tubular shape and electrically connected and fixed to the braided part. The shield member includes a braided part joining portion having a plurality of openings arranged at intervals along a circumferential direction of the shield member in a portion of the shield member in the longitudinal direction, and a welding portion defined by two openings adjacent to each other of the plurality of openings. The braided part covers the braided part joining portion and is welded to the welding portion.Type: GrantFiled: December 17, 2021Date of Patent: April 2, 2024Assignee: Yazaki CorporationInventors: Kazuma Watanabe, Hideki Mizuno, Yasuhiro Yamaguchi
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Publication number: 20230016310Abstract: An attachment structure includes expansion valves used in a vehicle, and a housing to which the expansion valves are attached. The housing includes a flow path through which heat medium circulating in a heat pump cycle of an air conditioner of the vehicle flows, and the flow path is opened and closed by the expansion valves.Type: ApplicationFiled: September 28, 2022Publication date: January 19, 2023Inventors: Yuki SUGIYAMA, Masakazu MORIMOTO, Yasuhiro MIZUNO, Masaki UCHIYAMA
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Publication number: 20220194167Abstract: A plurality of components of a refrigeration cycle are connected to a connection module. The connection module includes a body having a refrigerant flow path that constitutes a part of a refrigerant flow path in the refrigeration cycle. The refrigerant flow path includes a high-temperature-side flow path and a low-temperature-side flow path. The high-temperature-side flow path has a connection port to which a high-temperature-side component of the plurality of components, through which a high-pressure refrigerant of the refrigeration cycle flows, is connectable. The low-temperature-side flow path has a connection port to which a low-temperature-side component of the plurality of components, through which a refrigerant having a lower temperature than the high-pressure refrigerant flows, is connectable.Type: ApplicationFiled: March 10, 2022Publication date: June 23, 2022Inventors: Masakazu MORIMOTO, Yasuhiro MIZUNO, Masaki UCHIYAMA, Yuki SUGIYAMA
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Publication number: 20220136745Abstract: A condensing portion is formed such that a first refrigerant flow path through which a gas-phase refrigerant flowing into a refrigerant inlet flows and a first heat-medium flow path through which a heat medium flows overlap each other in a stacking direction of plates. A gas-liquid separator separates the refrigerant into gas-phase refrigerant and liquid-phase refrigerant and discharges the liquid-phase refrigerant. A subcooling portion is disposed on one side in the stacking direction with respect to the condensing portion, is formed such that a second refrigerant flow path through which the liquid-phase refrigerant discharged from the gas-liquid separator flows toward a refrigerant outlet and a second heat-medium flow path through which the heat medium flows overlap each other in the stacking direction.Type: ApplicationFiled: January 13, 2022Publication date: May 5, 2022Applicant: DENSO CORPORATIONInventors: Syogo KAWAGUCHI, Isao TAMADA, Yasuhiro MIZUNO
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Patent number: 11231210Abstract: A stack type heat exchanger includes a plurality of first plates and a plurality of second plates. At least one of the respective first plates and the respective second plates has a protrusion protruding from a main body of the first plate or the second plate toward a first flow path, the protrusion being located at a peripheral portion of a tank space in the first flow path. The first plate and the second plate are joined to each other through the protrusion. The protrusion has a top portion and a side wall portion. A part of the side wall portion adjacent to the tank space has a thick structure portion, an entire thickness of the thick structure portion being thick in a direction perpendicular to the stacking direction.Type: GrantFiled: March 23, 2017Date of Patent: January 25, 2022Assignee: DENSO CORPORATIONInventors: Yasuhiro Mizuno, Isao Tamada, Hiroshi Mieda, Ryohei Sugimura
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Patent number: 10553834Abstract: A method for manufacturing a vapor deposition mask includes providing a substrate including a plastic film. An electrostatic protection film is placed on a surface of the plastic film. The substrate combined with the electrostatic protection film is fixed on a frame and tension applied. The plastic film is etched to form at least one opening in the plastic film and the electrostatic protection film is removed, leaving a vapor deposition mask. The manufacturing method prevents movement during manufacture and moisture and scratches during vapor deposition, and particles (debris) or otherwise during etching are non-existent.Type: GrantFiled: July 19, 2018Date of Patent: February 4, 2020Assignee: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Ying-Chieh Chen, Yasuhiro Mizuno
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Publication number: 20190355938Abstract: A method for manufacturing a vapor deposition mask includes providing a substrate including a plastic film. An electrostatic protection film is placed on a surface of the plastic film. The substrate combined with the electrostatic protection film is fixed on a frame and tension applied. The plastic film is etched to form at least one opening in the plastic film and the electrostatic protection film is removed, leaving a vapor deposition mask. The manufacturing method prevents movement during manufacture and moisture and scratches during vapor deposition, and particles (debris) or otherwise during etching are non-existent.Type: ApplicationFiled: July 19, 2018Publication date: November 21, 2019Inventors: YING-CHIEH CHEN, YASUHIRO MIZUNO
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Patent number: 10462931Abstract: A heat exchanger has a tube and an inner fin. A heat medium exchanging heat with a heat exchange target flows in the tube, and the tube has a flat shape in cross section perpendicular to a flow direction of the heat medium. The inner fin has first fins and second fins. The second fins are formed parallel to the flow direction in at least one of an upstream end portion located on an upstream side of an area, in which the first fins are formed, in the flow direction or a downstream end portion located on a downstream side of the area in the flow direction. Fin pitches between the first fins are all identical with each other. At least one of fin pitches between the second fins is different from other fin pitches between the second fins.Type: GrantFiled: August 18, 2015Date of Patent: October 29, 2019Assignee: DENSO CORPORATIONInventors: Yuki Suzuki, Tomohiro Shimazu, Yasuhiro Mizuno
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Publication number: 20190226731Abstract: A stack type heat exchanger includes a plurality of first plates and a plurality of second plates. At least one of the respective first plates and the respective second plates has a protrusion protruding from a main body of the first plate or the second plate toward a first flow path, the protrusion being located at a peripheral portion of a tank space in the first flow path. The first plate and the second plate are joined to each other through the protrusion. The protrusion has a top portion and a side wall portion. A part of the side wall portion adjacent to the tank space has a thick structure portion, an entire thickness of the thick structure portion being thick in a direction perpendicular to the stacking direction.Type: ApplicationFiled: March 23, 2017Publication date: July 25, 2019Applicant: DENSO CORPORATIONInventors: Yasuhiro MIZUNO, Isao TAMADA, Hiroshi MIEDA, Ryohei SUGIMURA
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Patent number: 10253729Abstract: A cooling module has a heat generating body, a heat exchanger made of metal, and an insulating plate. The heat generating body has a heat dissipating surface. The heat exchanger has cooling surface facing the heat dissipating surface. The insulating plate has a first surface and a second surface. The insulating plate is interposed between the heat dissipating surface and the cooling surface on a condition that the insulating plate faces the heat dissipating surface and that the second surface faces the cooling surface. The insulating plate and the cooling surface are joined to be one body by a joining material. The heat dissipating surface and the insulating plate are in close contact with each other through an elastic member. The heat dissipating surface and the cooling surface are thermally connected to each other through the joining material, the insulating plate, and the elastic member.Type: GrantFiled: November 13, 2015Date of Patent: April 9, 2019Assignee: DENSO CORPORATIONInventors: Shingo Oono, Tomohiro Shimazu, Yasuhiro Mizuno, Ryohei Tomita
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Patent number: 10164651Abstract: An A/D converter includes a capacitor DAC, a resistor DAC, a first capacitive element, and a comparator. The capacitor DAC is configured to convert high-order M bits, where M and N are integers equal to or greater than 2, and the resistor DAC is configured to convert low-order N bits. The first capacitive element is provided between the capacitor DAC and the resistor DAC, and the comparator is configured to compare an input signal voltage with a voltage output from the capacitor DAC. The resistor DAC generates and outputs a voltage by adding or subtracting a wait based on redundant bits in addition to N-bit resolution.Type: GrantFiled: March 14, 2018Date of Patent: December 25, 2018Assignee: SOCIONEXT INC.Inventors: Kenta Aruga, Yasuhiro Mizuno, Masato Yoshioka
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Patent number: 10147668Abstract: A stacked cooler includes flow pipes that are stacked, each of the flow pipes having a flat shape and including a medium passage in which a heat medium flows, a heat exchange object that is disposed between each adjacent two of the flow pipes and is clamped between their flat planes, a protruding pipe part that is connected to at least one of the flow pipes and protrudes in a stacking direction of the flow pipes, and a load restraining part that restrains a load applied to a connection portion of the at least one of the flow pipes to the protruding pipe part as compared with a load applied to the other portion of the at least one of the flow pipes.Type: GrantFiled: January 10, 2018Date of Patent: December 4, 2018Assignee: DENSO CORPORATIONInventors: Yasuhiro Mizuno, Isao Tamada, Tomohiro Shimazu, Hiroshi Hamada, Yuusuke Takagi, Eiji Nakagawa
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Patent number: 10107553Abstract: A heat exchanger includes a flow passage pipe that has a flat shape having a predetermined thickness, a heat medium flowing in the flow passage pipe, the heat medium exchanging heat with a heat exchange target, and an inner fin located inside the flow passage pipe. The inner fin includes a wavy fin that partitions a main passage into multiple partitioned passages, and a guide wall connected to the wavy fin. An x-direction is a lengthwise direction of the flow passage pipe, a z-direction is a thickness direction of the flow passage pipe, and a y-direction is a direction perpendicular to both the x-direction and the z-direction. The wavy fin includes a first convex portion convex to a first side in the y-direction, and a second convex portion convex to a second side in the y-direction. The wavy fin has an opening portion through which two partitioned passages adjacent to each other communicate with each other. The guide wall protrudes from the wavy fin into the partitioned passage.Type: GrantFiled: April 11, 2016Date of Patent: October 23, 2018Assignee: DENSO CORPORATIONInventors: Yuusuke Takagi, Yasuhiro Mizuno
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Publication number: 20180205388Abstract: An A/D converter includes a capacitor DAC, a resistor DAC, a first capacitive element, and a comparator. The capacitor DAC is configured to convert high-order M bits, where M and N are integers equal to or greater than 2, and the resistor DAC is configured to convert low-order N bits. The first capacitive element is provided between the capacitor DAC and the resistor DAC, and the comparator is configured to compare an input signal voltage with a voltage output from the capacitor DAC. The resistor DAC generates and outputs a voltage by adding or subtracting a wait based on redundant bits in addition to N-bit resolution.Type: ApplicationFiled: March 14, 2018Publication date: July 19, 2018Inventors: Kenta Aruga, Yasuhiro Mizuno, Masato Yoshioka
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Publication number: 20180130721Abstract: A stacked cooler includes flow pipes that are stacked, each of the flow pipes having a flat shape and including a medium passage in which a heat medium flows, a heat exchange object that is disposed between each adjacent two of the flow pipes and is clamped between their flat planes, a protruding pipe part that is connected to at least one of the flow pipes and protrudes in a stacking direction of the flow pipes, and a load restraining part that restrains a load applied to a connection portion of the at least one of the flow pipes to the protruding pipe part as compared with a load applied to the other portion of the at least one of the flow pipes.Type: ApplicationFiled: January 10, 2018Publication date: May 10, 2018Inventors: Yasuhiro MIZUNO, Isao TAMADA, Tomohiro SHIMAZU, Hiroshi HAMADA, Yuusuke TAKAGI, Eiji NAKAGAWA
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Publication number: 20180119269Abstract: A mask for depositing a precise OLED layer as pixels on a substrate includes a frame, a main film, and a supporter. The frame defines a first opening extending through the frame. The main film is fixed on the frame and covers the first opening. The main film defines a plurality of second openings. The main body includes a plastic film. Each second opening extends through the plastic film and air communicates with the first opening. The supporter is fixed on the frame and in the first opening. The frame and the supporter cooperatively support the main film to reduce shadow effect.Type: ApplicationFiled: October 23, 2017Publication date: May 3, 2018Inventor: YASUHIRO MIZUNO
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Publication number: 20180112933Abstract: A heat exchanger includes a flow passage pipe that has a flat shape having a predetermined thickness, a heat medium flowing in the flow passage pipe, the heat medium exchanging heat with a heat exchange target, and an inner fin located inside the flow passage pipe. The inner fin includes a wavy fin that partitions a main passage into multiple partitioned passages, and a guide wall connected to the wavy fin. An x-direction is a lengthwise direction of the flow passage pipe, a z-direction is a thickness direction of the flow passage pipe, and a y-direction is a direction perpendicular to both the x-direction and the z-direction. The wavy fin includes a first convex portion convex to a first side in the y-direction, and a second convex portion convex to a second side in the y-direction. The wavy fin has an opening portion through which two partitioned passages adjacent to each other communicate with each other. The guide wall protrudes from the wavy fin into the partitioned passage.Type: ApplicationFiled: April 11, 2016Publication date: April 26, 2018Inventors: Yuusuke TAKAGI, Yasuhiro MIZUNO
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Patent number: 9933668Abstract: Display device, including: substrates, color filters having first and second color filters, drain and gate signal lines (of light blocking material), wherein, an overlapping portion adjacent the first and second color filter overlap, is formed on a region with one of the drain or gate signal lines, a first color filter edge is a first taper and a second color filter edge is a second taper, in the overlapping portion, the first taper is closer to the drain or gate signal line than the second taper in the overlapping portion, the first taper angle is 45° or more and 90° or less corresponding to a surface of the drain or gate signal line, the second taper angle is 45° or more and 90° or less corresponding to a surface of the first taper and, the first taper angle is larger than the second taper angle.Type: GrantFiled: December 30, 2015Date of Patent: April 3, 2018Assignees: Japan Display Inc., Panasonic Liquid Crystal Co. Lt.Inventors: Yasuhiro Mizuno, Junji Tanno, Shinsuke Hayahara, Masato Sakurai, Yasukazu Kimura, Jun Fujiyoshi
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Patent number: 9818673Abstract: A cooler includes a cooling pipe having a cooling surface in contact with a heat-exchanged component, and a refrigerant passage. A pair of outer passages are formed between a pair of opposed inner wall surfaces which are located at both ends of an inner wall surface of the cooling pipe in a perpendicular direction and which constitute the refrigerant passage, and a pair of partition walls that are located at both ends of an inner fin in the perpendicular direction. At least one flow-regulating rib is formed in the refrigerant passage to project into the refrigerant passage at a position inward of the pair of outer passages in the perpendicular direction and at a position outward of an inflow hole and a discharge hole in the perpendicular direction as well as at a position outward of the inner fin in an arrangement direction and at a position inward of the inflow hole and the discharge hole in the arrangement direction.Type: GrantFiled: August 25, 2014Date of Patent: November 14, 2017Assignee: DENSO CORPORATIONInventors: Yasuhiro Mizuno, Tomohiro Shimazu, Yuki Suzuki
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Publication number: 20170314515Abstract: A cooling module has a heat generating body, a heat exchanger made of metal, and an insulating plate. The heat generating body has a heat dissipating surface. The heat exchanger has cooling surface facing the heat dissipating surface. The insulating plate has a first surface and a second surface. The insulating plate is interposed between the heat dissipating surface and the cooling surface on a condition that the insulating plate faces the heat dissipating surface and that the second surface faces the cooling surface. The insulating plate and the cooling surface are joined to be one body by a joining material. The heat dissipating surface and the insulating plate are in close contact with each other through an elastic member. The heat dissipating surface and the cooling surface are thermally connected to each other through the joining material, the insulating plate, and the elastic member.Type: ApplicationFiled: November 13, 2015Publication date: November 2, 2017Inventors: Shingo OONO, Tomohiro SHIMAZU, Yasuhiro MIZUNO, Ryohei TOMITA