Patents by Inventor Yasuhiro Uemura

Yasuhiro Uemura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10889519
    Abstract: Provided is method of producing a glass roll, the method including: a conveying step of conveying a glass film (G) along a longitudinal direction thereof; a cutting step of irradiating the glass film (G) with a laser beam (L) from a laser irradiation apparatus (19) while conveying the glass film (G) by the conveying step, to thereby separate the glass film (G) into a non-product portion (Gc) and a product portion (Gd); and a take-up step of taking up the product portion (Gd) into a roll shape, to thereby form a glass roll (R). The cutting step includes winding a thread-like peeled material (Ge) generated from an end portion of the product portion (Gd) in a width direction around a rod-shaped collecting member (20a), to thereby collect the thread-like peeled material (Ge).
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: January 12, 2021
    Assignee: NIPPON ELECTRIC GLASS CO., LTD.
    Inventors: Naohiro Ikai, Kaoru Mitsugi, Shuji Akiyama, Hiroki Mori, Koichi Mori, Yasuhiro Uemura
  • Publication number: 20190375666
    Abstract: Provided is a method of manufacturing a glass film, including: a conveying step of conveying an elongated glass film (G) along a longitudinal direction thereof; and a cutting step of irradiating the glass film (G) with a laser beam (L) from a laser irradiation apparatus (19) while conveying the glass film (G) through the conveying step, to thereby separate the glass film (G). The cutting step includes generating a thread-like peeled material (Ge) in a helical shape from an end portion of the separated glass film (G) in a width direction. The thread-like peeled material (Ge) has a width (W) of 180 ?m or more and 300 ?m or less. In addition, the thread-like peeled material (Ge) has a helical diameter (D) of 80 mm or more and 200 mm or less.
    Type: Application
    Filed: January 29, 2018
    Publication date: December 12, 2019
    Inventors: Hiroki MORI, Koichi MORI, Shuji AKIYAMA, Yasuhiro UEMURA, Naoyuki MATSUMOTO
  • Publication number: 20190152826
    Abstract: Provided is method of producing a glass roll, the method including: a conveying step of conveying a glass film (G) along a longitudinal direction thereof; a cutting step of irradiating the glass film (G) with a laser beam (L) from a laser irradiation apparatus (19) while conveying the glass film (G) by the conveying step, to thereby separate the glass film (G) into a non-product portion (Gc) and a product portion (Gd); and a take-up step of taking up the product portion (Gd) into a roll shape, to thereby form a glass roll (R). The cutting step includes winding a thread-like peeled material (Ge) generated from an end portion of the product portion (Gd) in a width direction around a rod-shaped collecting member (20a), to thereby collect the thread-like peeled material (Ge).
    Type: Application
    Filed: April 21, 2017
    Publication date: May 23, 2019
    Inventors: Naohiro IKAI, Kaoru MITSUGI, Shuji AKIYAMA, Hiroki MORI, Koichi MORI, Yasuhiro UEMURA
  • Patent number: 7580443
    Abstract: In a clock generating circuit, while a PLL (Phase-Locked Loop) circuit and a modulator are employed, when a frequency dividing ratio of a feedback-purpose frequency divider in the PLL circuit is changed in accordance with modulation data produced based upon a modulation profile of the modulator to perform a frequency modulation so as to spread a spectrum, a turning point of the modulation profile is moved so as to disperse a degree of frequency, so that the spread spectrum is re-spread. Also, a clock generating circuit is constituted by a PLL circuit and a modulator, a multiple modulation profile generating circuit is provided in the modulator, and a turning point of a modulation profile is moved so as to disperse a degree of frequency, so that a spread spectrum is re-spread.
    Type: Grant
    Filed: January 13, 2006
    Date of Patent: August 25, 2009
    Assignee: Renesas Technology Corp.
    Inventors: Yasuhiro Uemura, Takashi Nakamura, Akio Katsushima, Makoto Funatsu
  • Patent number: 7120686
    Abstract: A maintenance information providing server (Web server) 20 that transmits maintenance information to a portable terminal carried by a vendor or a customer is appended to the network management system (NMS) 21 supervising the network 2, server 20 on receipt of malfunction information from the NMS 21, notifying the malfunction to one or more pre-registered portable terminals (23, 13, 33) of a communication service purveyor, vendor or the customer.
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: October 10, 2006
    Assignee: NEC Corporation
    Inventors: Susumu Sasabe, Shin-Ichiro Hayano, Toshibumi Kawano, Yasuhiro Uemura, Hiroyuki Hayashi, Shingo Fukui
  • Publication number: 20060176933
    Abstract: In a clock generating circuit, while a PLL (Phase-Locked Loop) circuit and a modulator are employed, when a frequency dividing ratio of a feedback-purpose frequency divider in the PLL circuit is changed in accordance with modulation data produced based upon a modulation profile of the modulator to perform a frequency modulation so as to spread a spectrum, a turning point of the modulation profile is moved so as to disperse a degree of frequency, so that the spread spectrum is re-spread. Also, a clock generating circuit is constituted by a PLL circuit and a modulator, a multiple modulation profile generating circuit is provided in the modulator, and a turning point of a modulation profile is moved so as to disperse a degree of frequency, so that a spread spectrum is re-spread.
    Type: Application
    Filed: January 13, 2006
    Publication date: August 10, 2006
    Inventors: Yasuhiro Uemura, Takashi Nakamura, Akio Katsushima, Makoto Funatsu
  • Patent number: 6829574
    Abstract: Disclosed herein is an improved logic module used for logic emulation along with an enhanced logic emulation board subject to logic verification. The logic module has a plurality of programmable LSIs capable of programming logic and a plurality of switching LSIs capable of programming connections, the LSIs being mounted on one or both sides of a board. Peripheral portions of the board carry connectors for electrical connection to the outside. There are two types of data lines: those directly coupling the connectors to the programmable LSIs, and those linking the connectors to the programmable LSIs via the switching LSIs. The programmable and switching LSIs constitute a crossbar connection arrangement. The logic emulation board has connectors for connection to a logic emulation module, and lands for supporting LSIs targeted for development. Pins of the connectors and the lands are interconnected on a one-to-one basis.
    Type: Grant
    Filed: June 9, 1999
    Date of Patent: December 7, 2004
    Assignee: Renesas Technology Corp.
    Inventors: Hiroshi Ito, Akira Yamagiwa, Nobuaki Ejima, Ryoichi Kurihara, Masakazu Sakaue, Yasuhiro Uemura
  • Publication number: 20030046329
    Abstract: A maintenance information providing server (Web server) 20 that transmits maintenance information to a portable terminal carried by a vendor or a customer is appended to the network management system (NMS) 21 supervising the network 2, server 20 on receipt of malfunction information from the NMS 21, notifying the malfunction to one or more pre-registered portable terminals (23, 13, 33) of a communication service purveyor, vendor or the customer.
    Type: Application
    Filed: July 17, 2001
    Publication date: March 6, 2003
    Applicant: NEC Corporation
    Inventors: Susumu Sasabe, Shin-Ichiro Hayano, Toshibumi Kawano, Yasuhiro Uemura, Hiroyuki Hayashi, Shingo Fukui
  • Patent number: 6266242
    Abstract: The present invention provides an information processing apparatus that may be designed in small and thin size and a small and thin CPU module that has a high heat releasing effect and is suitable therefor. The CPU module includes a processor, a connector to be electrically connected to the outside, a system control circuit for controlling transfer of a signal between the processor and the connector, and a printed board on which the processor, the connector and the system control circuit are mounted. The CPU module further provides a heat release plate one side of which is pasted with the printed board and the other side of which is substantially planar. The printed board has a cavity formed therein so that the processor may be fitted in the cavity in a bare-chip state. One side of the bare chip is jointed with the heat release plate.
    Type: Grant
    Filed: April 25, 2000
    Date of Patent: July 24, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Maruyama, Akira Yamagiwa, Ryoichi Kurihara, Masakazu Sakaue, Yasuhiro Uemura, Mikihiro Tanaka
  • Patent number: 6069793
    Abstract: The present invention provides an information processing apparatus that may be designed in small and thin size and a small and thin CPU module that has a nigh heat releasing effect and is suitable therefor. The CPU module includes a processor, a connector to be electrically connected to the outside, a system control circuit for controlling transfer of a signal between the processor and the connector, and a printed board on which the processor, the connector and the system control circuit are mounted. The CPU module further provides a heat release plate one side of which is pasted with the printed board and the other side of which is substantially planar. The printed board has a cavity formed therein so that the processor may be fitted in the cavity in a bare-chip state. One side of the bare chip is jointed with the heat release plate.
    Type: Grant
    Filed: January 21, 1998
    Date of Patent: May 30, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Maruyama, Akira Yamagiwa, Ryoichi Kurihara, Masakazu Sakaue, Yasuhiro Uemura, Mikihiro Tanaka
  • Patent number: 5722160
    Abstract: A packaging method of an electronic component for packaging the electronic component to a packaging substrate comprises the steps of: forming a predetermined quantity of solder bumps at connection portions of the electronic component; forming through-holes and pads on the packaging substrate in such a manner as to correspond to the solder bumps; applying a solder paste to pad portions of the through-holes and the pads formed on the surface of the packaging substrate in such a manner as to attain a specific quantity of solder components with the predetermined quantity of the solder bump; and heating the electronic component and the packaging substrate to a predetermined temperature such that button-shaped connection bumps having a predetermined height are formed between the pads and the packaging substrate so as to connect the electronic component and the packaging substrate and to keep a predetermined gap between the electronic component and the packaging substrate, and cylindrical-post connection bumps are f
    Type: Grant
    Filed: October 25, 1995
    Date of Patent: March 3, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Yasuhiro Uemura, Masakazu Sakaue
  • Patent number: 4701817
    Abstract: An apparatus suitable for digital data transfer with a tape cassette is designed to require no movement of a magnetic transducer head to establish data transfer contact between the head and a tape cassette. The tape cassette is inserted in the apparatus in the direction of a notional line intersecting at right angles the axes of rotation of the pair of hubs of the tape cassette. Upon full insertion in the apparatus the tape cassette has its apertured front side held opposite the transducer head. A cassette shift mechanism subsequently transports the loaded tape cassette in a direction normal to the notional line, into data transfer contact with the transducer head. A tape transport shift mechanism also operates to move a pair of motor driven spindles into driving engagement with the respective hubs of the tape cassette. The insertion of the tape cassette automatically triggers the operation of both cassette shift mechanism and tape transport shift mechanism.
    Type: Grant
    Filed: October 5, 1984
    Date of Patent: October 20, 1987
    Assignee: Teac Corp. & Nippon Landex Ltd.
    Inventor: Yasuhiro Uemura