Patents by Inventor Yasuhito NAKAMURA
Yasuhito NAKAMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12098791Abstract: A joint member includes a joint main body configured to include a flow path portion formed and an opening portion communicating with the flow path portion, and a tube member configured to include an end portion inserted into the opening portion of the joint main body and joined to the joint main body by brazing. The joint main body includes a step portion on which the end portion of the tube member inserted into the opening portion abuts. The tube member includes an annular recessed portion recessed from an outer peripheral surface of the tube member and formed on a flexible tube side with respect to an end surface on a joint main body side.Type: GrantFiled: November 2, 2020Date of Patent: September 24, 2024Assignee: NEC Platforms, Ltd.Inventor: Yasuhito Nakamura
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Publication number: 20240280391Abstract: An information processing device includes: one or more memories storing instructions; and one or more processors configured to execute the instructions to: acquire a calorific value of a first module, a first temperature that is a temperature of a heat generation member of the first module, and a second temperature that is a temperature of the heat generation member of a second module, wherein the first module and the second module are included in a plurality of modules mounted on an information processing device, and wherein the each module includes an electronic circuit board and a cooling member, and wherein a heat medium discharged from the cooling member of the first module is supplied to the second module; and estimate a flow rate of the heat medium supplied to the first module based on the calorific value of the first module, the first temperature, and the second temperature.Type: ApplicationFiled: March 17, 2022Publication date: August 22, 2024Applicant: NEC Platforms, Ltd.Inventor: Yasuhito NAKAMURA
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Publication number: 20240276674Abstract: A cooling component includes a heat receiving plate that receives heat from the cooling target object; a plurality of heat dissipating plates disposed at predetermined intervals on the heat receiving plate; a refrigerant supplying path for supplying a refrigerant to the plurality of heat dissipating plates; a refrigerant discharging path to which the refrigerant is supplied from the plurality of heat dissipating plates; and a refrigerant passing member in which a plurality of through-holes through which the refrigerant passes are formed, wherein the refrigerant supplied by the refrigerant supplying path passes through some of the through-holes, while the refrigerant that passes through the remainder of the plurality of through-holes is discharged by the refrigerant discharging path, and some of the plurality of through-holes and the remainder of the plurality of through-holes are adjacent to each other.Type: ApplicationFiled: April 20, 2022Publication date: August 15, 2024Applicant: NEC Platforms, Ltd.Inventor: Yasuhito NAKAMURA
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Patent number: 12007182Abstract: A flow rate abnormality detection device includes: a number determination unit that determines a number of devices to be cooled; a threshold value setting unit that sets a threshold value based on the number of devices to be cooled; and an abnormality determination unit that determines that there is an abnormality when a total flow rate of refrigerant supplied to the devices to be cooled is less than the threshold value.Type: GrantFiled: March 2, 2018Date of Patent: June 11, 2024Assignee: NEC Platforms, Ltd.Inventor: Yasuhito Nakamura
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Publication number: 20240102591Abstract: A joint member includes a joint main body configured to include a flow path portion formed and an opening portion communicating with the flow path portion, and a tube member configured to include an end portion inserted into the opening portion of the joint main body and joined to the joint main body by brazing. The joint main body includes a step portion on which the end portion of the tube member inserted into the opening portion abuts. The tube member includes an annular recessed portion recessed from an outer peripheral surface of the tube member and formed on a flexible tube side with respect to an end surface on a joint main body side.Type: ApplicationFiled: November 2, 2020Publication date: March 28, 2024Applicant: NEC Platforms, Ltd.Inventor: Yasuhito NAKAMURA
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Publication number: 20240107708Abstract: A cooling system includes a first module, a second module provided at a different position in a depth direction of a housing with respect to the first module, a third module provided at a different position in a width direction of the housing with respect to the first module and the second module, an upstream side tube configured to supply a cooling medium to a cooling member of the first module, a downstream side tube configured to supply the cooling medium passed through the cooling member of the first module to a cooling member of the second module, and a branch tube configured to branch from the downstream side tube and supply the cooling medium to a cooling member of the third module.Type: ApplicationFiled: October 30, 2020Publication date: March 28, 2024Applicant: NEC Platforms, Ltd.Inventor: Yasuhito NAKAMURA
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Patent number: 11683909Abstract: A cold plate has, on a surface thereof, an attachment surface for contacting a cooling object, and has, in the interior thereof, an accommodating portion that accommodates a cooling medium. The cold plate is provided with a first opening that communicates with the accommodating portion, a body-side connection pipe is connected to the first opening, a tube-side connection pipe, which has a bendable tube connected to one end thereof, is connected to the body-side connection pipe. The body-side connection pipe and the tube-side connection pipe are connected so as to be able to rotate about the pipe axis.Type: GrantFiled: November 28, 2019Date of Patent: June 20, 2023Assignee: NEC Platforms, Ltd.Inventor: Yasuhito Nakamura
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Patent number: 11470741Abstract: A cooling system including a cooling unit that cools a heat-generating component; a supply connection tube that is connected to the cooling unit and that supplies a cooling medium to the cooling unit; and a discharge connection tube that is connected to the cooling unit and that discharges the cooling medium from the cooling unit, wherein the supply connection tube and the discharge connection tube have different lengths.Type: GrantFiled: July 24, 2018Date of Patent: October 11, 2022Assignee: NEC Platforms, Ltd.Inventor: Yasuhito Nakamura
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Publication number: 20220039289Abstract: A cold plate has, on a surface thereof, an attachment surface for contacting a cooling object, and has, in the interior thereof, an accommodating portion that accommodates a cooling medium. The cold plate is provided with a first opening that communicates with the accommodating portion, a body-side connection pipe is connected to the first opening, a tube-side connection pipe, which has a bendable tube connected to one end thereof, is connected to the body-side connection pipe. The body-side connection pipe and the tube-side connection pipe are connected so as to be able to rotate about the pipe axis.Type: ApplicationFiled: November 28, 2019Publication date: February 3, 2022Applicant: NEC Platforms, Ltd.Inventor: Yasuhito NAKAMURA
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Patent number: 11231756Abstract: A serving rack cooling device. The device includes a rack; an enclosure provided inside the rack; a module provided inside the enclosure; a main pipe provided in the rack; a branching tube connected to the main pipe; a cooling unit that cools a heat-generating component mounted on the module; a first connection tube that connects the branching tube with the cooling unit; and a plurality of module connection portions that are provided inside the enclosure and to which the module is connected. The enclosure can slide in a state in which the module is connected to the module connection portion, and the cooling unit and the branching tube are connected by the first connection tube.Type: GrantFiled: July 30, 2018Date of Patent: January 25, 2022Assignee: NEC Platforms, Ltd.Inventor: Yasuhito Nakamura
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Publication number: 20210195796Abstract: A cooling system including a cooling unit that cools a heat-generating component; a supply connection tube that is connected to the cooling unit and that supplies a cooling medium to the cooling unit; and a discharge connection tube that is connected to the cooling unit and that discharges the cooling medium from the cooling unit, wherein the supply connection tube and the discharge connection tube have different lengths.Type: ApplicationFiled: July 24, 2018Publication date: June 24, 2021Applicant: NEC Platforms, Ltd.Inventor: Yasuhito NAKAMURA
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Patent number: 10788270Abstract: A refrigerant relay device 1300 is provided with a casing 1310, a first refrigerant inflow opening 1360, a first refrigerant outflow opening 1350, and refrigerant inflow piping 1370. The casing retains liquid-phase refrigerant and gas-phase refrigerant. The liquid-phase refrigerant is made to flow into the casing through the first refrigerant inflow opening. The gas-phase refrigerant is made to flow out to the outside of the casing through the first refrigerant outflow opening. In the refrigerant inflow piping, one end is connected to the first refrigerant inflow opening and an opening 1371 is formed at the other end. The liquid-phase refrigerant flowing into the first refrigerant inflow opening is made to flow into the casing through the refrigerant inflow piping from the opening. The opening is positioned so as to face the bottom part 1311 of the casing.Type: GrantFiled: October 14, 2016Date of Patent: September 29, 2020Assignee: NEC Platforms, Ltd.Inventors: Yasuhito Nakamura, Shunsuke Fujii
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Publication number: 20200249732Abstract: A device including a rack; an enclosure provided inside the rack; a module provided inside the enclosure; a main pipe provided in the rack; a branching tube connected to the main pipe; a cooling unit that cools a heat-generating component mounted on the module; a first connection tube that connects the branching tube with the cooling unit; and a plurality of module connection portions that are provided inside the enclosure and to which the module is connected; wherein the enclosure can slide in a state in which the module is connected to the module connection portion, and the cooling unit and the branching tube are connected by the first connection tube.Type: ApplicationFiled: July 30, 2018Publication date: August 6, 2020Applicant: NEC Platforms, Ltd.Inventor: Yasuhito NAKAMURA
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Publication number: 20200064088Abstract: A flow rate abnormality detection device includes: a number determination unit that determines a number of devices to be cooled; a threshold value setting unit that sets a threshold value based on the number of devices to be cooled; and an abnormality determination unit that determines that there is an abnormality when a total flow rate of refrigerant supplied to the devices to be cooled is less than the threshold value.Type: ApplicationFiled: March 2, 2018Publication date: February 27, 2020Applicant: NEC Platforms, Ltd.Inventor: Yasuhito NAKAMURA
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Patent number: 10408545Abstract: A cooling system includes a heat absorbing device which has a first pipe port and absorbs heat discharged from equipment by using refrigerant; a radiator which has a second pipe port placed higher than the first pipe port and cools the refrigerant; a first flexible pipe whose one end is connected with the first pipe port and whose another end is connected with the second pipe port and through which the refrigerant flows and which can bend freely; and a loading table having a surface which becomes higher in a vertical direction as approaching from one end of the surface to another end, and on which the first flexible pipe is placed so as to become higher in the vertical direction as approaching from a side of the first flexible pipe, which is connected with the first pipe port, to a side of the first flexible pipe which is connected with the second pipe port.Type: GrantFiled: December 2, 2014Date of Patent: September 10, 2019Assignee: NEC PLATFORMS, LTD.Inventors: Yasuhito Nakamura, Shunsuke Fujii
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Publication number: 20180320982Abstract: [Problem] To minimize any increase in space for installation. [Solution] A cooling device 120 according to the present invention is provided with: an evaporator 127 positioned on a rear-surface door provided in a casing 121 in such a manner as to allow opening and closing; a refrigerant relay 112 provided above the casing 121 to connect with the evaporator; and a bendable flexible tube 123, one end of which being connected to the evaporator 127 and the other end of which being connected to a side of the refrigerant relay 112 that is different from the side in which the evaporator 127 is positioned. At least a part of the flexible tube 123 is positioned below the refrigerant relay 112 so as to cross the refrigerant relay 112.Type: ApplicationFiled: October 14, 2016Publication date: November 8, 2018Applicant: NEC Platforms, Ltd.Inventors: Yasuhito NAKAMURA, Shunsuke FUJII
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Publication number: 20180313612Abstract: [Problem] To provide a cooling device able to efficiently cool heat from a heat generating body. [Solution] A refrigerant relay device 1300 is provided with a casing 1310, a first refrigerant inflow opening 1360, a first refrigerant outflow opening 1350, and refrigerant inflow piping 1370. The casing 1310 retains liquid-phase refrigerant and gas-phase refrigerant. The liquid-phase refrigerant is made to flow into the casing 1310 through the first refrigerant inflow opening 1360. The gas-phase refrigerant is made to flow out to the outside of the casing 1310 through the first refrigerant outflow opening 1350. In the refrigerant inflow piping 1370, one end is connected to the first refrigerant inflow opening 1360 and an opening 1371 is formed at the other end. The liquid-phase refrigerant flowing into the first refrigerant inflow opening 1360 is made to flow into the casing 1310 through the refrigerant inflow piping 1370 from the opening 1371.Type: ApplicationFiled: October 14, 2016Publication date: November 1, 2018Applicant: NEC Platforms, Ltd.Inventors: Yasuhito NAKAMURA, Shunsuke FUJII
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Publication number: 20160313069Abstract: A cooling system includes a heat absorbing device which has a first pipe port and absorbs heat discharged from equipment by using refrigerant; a radiator which has a second pipe port placed higher than the first pipe port and cools the refrigerant; a first flexible pipe whose one end is connected with the first pipe port and whose another end is connected with the second pipe port and through which the refrigerant flows and which can bend freely; and a loading table having a surface which becomes higher in a vertical direction as approaching from one end of the surface to another end, and on which the first flexible pipe is placed so as to become higher in the vertical direction as approaching from a side of the first flexible pipe, which is connected with the first pipe port, to a side of the first flexible pipe which is connected with the second pipe port.Type: ApplicationFiled: December 2, 2014Publication date: October 27, 2016Inventors: Yasuhito NAKAMURA, Shunsuke FUJII
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Publication number: 20160290691Abstract: It is difficult to avoid a decrease in cooling capacity without causing an increase in power consumption if a cooling device including a piping structure grows in size, therefore, a piping structure according to an exemplary aspect of the present invention includes a tubular part including a first flow passage through which a refrigerant flowing and a shell region surrounding the first flow passage; an introduction part composing a part of the shell region and including a second flow passage connected to the first flow passage; and a connection located at an end, between ends of the introduction part, on the side opposite to an end on a side where the second flow passage being connected to the first flow passage.Type: ApplicationFiled: November 10, 2014Publication date: October 6, 2016Inventors: Masaki CHIBA, Minoru YOSHIKAWA, Akira SHOUJIGUCHI, Kenichi INABA, Arihiro MATSUNAGA, Masanori SATO, Tadao HOSAKA, Yasuhito NAKAMURA