Abstract: A wire bonding apparatus connecting a lead of a mounted member with an electrode of a semiconductor die through a wire comprises a capillary through which the wire is inserted, a shape acquisition part which acquires the shape of the lead to which the wire is connected, a calculating part which calculates an extending direction of a wire tail extending from the end of the capillary based on the shape of a lead to which the wire is connected next, and a cutting part which moves the capillary in the extending direction and cuts the wire to form the wire tail after the lead is connected with the electrode through the wire. Thus, in the wire bonding using wedge bonding, joining part tails (183a, 283a, 383a) formed in continuation to a first bonding point can be prevented from coming into contact with each other.

Abstract: An electronic component includes: a first internal electrode provided in an element body; a second internal electrode provided in the element body; a third internal electrode provided in the element body and drawn out to a first side surface; and a fourth internal electrode provided in the element body and drawn out to a second side surface. The third internal electrode and the fourth internal electrode are electrically connected to each other through an external connection conductor formed on at least the first side surface and the second side surface. In a first direction, the first internal electrode faces the third internal electrode without facing the second internal electrode and the fourth internal electrode. In the first direction, the second internal electrode faces the fourth internal electrode without facing the first internal electrode and the third internal electrode.

Abstract: An electronic component includes: a first internal electrode which is provided inside an element body and is drawn on a first main surface corresponding to a mounting surface; a second internal electrode which is provided inside the element body, is provided at a position different from the first internal electrode when viewed from a third direction, and is drawn on the first main surface; a third internal electrode which is provided inside the element body, is provided at a position facing the first internal electrode and the second internal electrode in the third direction, and is drawn on the first main surface; wherein the first internal electrode and the third internal electrode face each other in the third direction to form a first capacitor portion, and wherein the second internal electrode and the third internal electrode face each other in the third direction to form a second capacitor portion.

Abstract: An image forming apparatus includes a main housing, a movable drawer, and a process cartridge attachable to the drawer. The process cartridge includes a drum unit, and a developing unit. The drum unit includes a drum housing, and a photosensitive drum rotatable about a first axis extending in a first direction. The photosensitive drum is positioned at one end portion of the drum housing at one side in a second direction. The developing unit includes a developing casing, a developing roller, and a developing handle for detaching the process cartridge from the drawer toward another side in the second direction. The developing roller is positioned at one end portion of the developing casing at the one side in the second direction. The developing handle is positioned apart from the drum unit toward the another side in the second direction.

Abstract: A wire bonding apparatus connecting a lead of a mounted member with an electrode of a semiconductor die through a wire comprises a capillary through which the wire is inserted, a shape acquisition part which acquires the shape of the lead to which the wire is connected, a calculating part which calculates an extending direction of a wire tail extending from the end of the capillary based on the shape of a lead to which the wire is connected next, and a cutting part which moves the capillary in the extending direction and cuts the wire to form the wire tail after the lead is connected with the electrode through the wire. Thus, in the wire bonding using wedge bonding, joining part tails (183a, 283a, 383a) formed in continuation to a first bonding point can be prevented from coming into contact with each other.

Abstract: A vehicle outer mirror device includes a housing, a mirror main body, a mirror drive unit, and an imaging unit. The housing is attached to a door of a vehicle and includes an opening facing rear of the vehicle. The mirror main body is disposed in the opening of the housing and has a light reflection region reflecting light entering from outside of the housing and a light transmission region capable of transmitting the light to inside of the housing. The mirror drive unit is disposed inside the housing and adjusts an orientation of the mirror main body. The imaging unit is fixed inside the housing, images the rear of the vehicle through the light transmission region, and is disposed in a state in which an imaging optical axis is inclined toward the outside of the vehicle with respect to a reflection optical axis of the light reflection region.

Abstract: A vehicle mirror device includes a main body, a drive unit, and a control unit. The main body includes a mirror member and a case member. The mirror member and the case member are provided to be movable integrally with each other. The drive unit is configured to rotate the main body around a first rotation axis and a second rotation axis. The first rotation axis extends along an up-down direction in a vehicle mounted state, and the second rotation axis extends along a left-right direction in the vehicle mounted state. The control unit is configured to control the drive unit such that the main body rotates in a rotation direction and at rotational speed in accordance with a type of a signal from a vehicle.

Abstract: A wire bonding apparatus connecting a lead of a mounted member with an electrode of a semiconductor die through a wire comprises a capillary through which the wire is inserted, a shape acquisition part which acquires the shape of the lead to which the wire is connected, a calculating part which calculates an extending direction of a wire tail extending from the end of the capillary based on the shape of a lead to which the wire is connected next, and a cutting part which moves the capillary in the extending direction and cuts the wire to form the wire tail after the lead is connected with the electrode through the wire. Thus, in the wire bonding using wedge bonding, joining part tails (183a, 283a, 383a) formed in continuation to a first bonding point can be prevented from coming into contact with each other.

Abstract: A vehicle outer mirror device includes a housing, a mirror main body, a mirror drive unit, and an imaging unit. The housing is attached to a door of a vehicle and includes an opening facing rear of the vehicle. The mirror main body is disposed in the opening of the housing and has a light reflection region reflecting light entering from outside of the housing and a light transmission region capable of transmitting the light to inside of the housing. The mirror drive unit is disposed inside the housing and adjusts an orientation of the mirror main body. The imaging unit is fixed inside the housing, images the rear of the vehicle through the light transmission region, and is disposed in a state in which an imaging optical axis is inclined toward the outside of the vehicle with respect to a reflection optical axis of the light reflection region.

Abstract: Provided is a wire-bonding apparatus (10) including: a capillary (28) through which a wire (30) inserted; and a controller (80). The controller (80) is configured to execute operations including: a disconnection operation, after the second bonding operation, of moving the capillary through which the wire is inserted within a horizontal plane vertical to an axial direction of the capillary while the wire is held in the clamped state, and thereby disconnecting the wire from the second bonding point; a preliminary bonding operation of feeding the wire from the second bonding point to a predetermined preliminary bonding point, and performing preliminary bonding at the preliminary bonding point; and a shaping operation, after the preliminary bonding operation, of shaping the wire projecting from a tip of the capillary into a predetermined flexed shape.

Abstract: A semiconductor device includes a common wire that sequentially connects three or more pads; bonding portions at which a side surface of the wire is bonded to the pads; and looping portions looped from the bonding portions onto the other pads adjacent to the pads, the bonding portions and the looping portions are formed alternately. When the pads are recessed from the surface of semiconductor chips, the common wire is crushed to a thickness greater than the recess depth of the pads to be made into a flat shape. Thus, on the semiconductor device, wire connection is performed with a smaller bonding count while reducing damage to the semiconductor chips, and at the same time bonding is performed efficiently to the electrodes recessed from the surface of the semiconductor chips.

Abstract: Provided is a wire bonding apparatus capable of performing high-speed wedge wire bonding, the apparatus including: a bonding tool having a through hole and a pressing surface for pressing a wire; a clamper for holding the wire; and a control unit. The control unit includes: wire tail extension unit that moves the bonding tool, after wedge bonding of the wire to a first lead, upward and along a second straight line connecting a second pad and a second lead, and causes the wire to extend from the through hole in a direction along the second straight line from the second pad to the second lead; and tail cut unit that, after causing the wire tail to extend, cuts the wire tail by moving the bonding tool in the direction along the second straight line connecting the second pad and the second lead while the clamper is closed.

Abstract: Provided is a wire bonding apparatus capable of performing high-speed wedge wire bonding, the apparatus including: a bonding tool having a through hole and a pressing surface for pressing a wire; a clamper for holding the wire; and a control unit. The control unit includes: wire tail extension unit that moves the bonding tool, after wedge bonding of the wire to a first lead, upward and along a second straight line connecting a second pad and a second lead, and causes the wire to extend from the through hole in a direction along the second straight line from the second pad to the second lead; and tail cut unit that, after causing the wire tail to extend, cuts the wire tail by moving the bonding tool in the direction along the second straight line connecting the second pad and the second lead while the clamper is closed.

Abstract: A semiconductor device includes a common wire that sequentially connects three or more pads; bonding portions at which a side surface of the wire is bonded to the pads; and looping portions looped from the bonding portions onto the other pads adjacent to the pads, the bonding portions and the looping portions are formed alternately. When the pads are recessed from the surface of semiconductor chips, the common wire is crushed to a thickness greater than the recess depth of the pads to be made into a flat shape. Thus, on the semiconductor device, wire connection is performed with a smaller bonding count while reducing damage to the semiconductor chips, and at the same time bonding is performed efficiently to the electrodes recessed from the surface of the semiconductor chips.

Abstract: Provided is a wire-bonding apparatus (10) including: a capillary (28) through which a wire (30) inserted; and a controller (80). The controller (80) is configured to execute operations including: a disconnection operation, after the second bonding operation, of moving the capillary through which the wire is inserted within a horizontal plane vertical to an axial direction of the capillary while the wire is held in the clamped state, and thereby disconnecting the wire from the second bonding point; a preliminary bonding operation of feeding the wire from the second bonding point to a predetermined preliminary bonding point, and performing preliminary bonding at the preliminary bonding point; and a shaping operation, after the preliminary bonding operation, of shaping the wire projecting from a tip of the capillary into a predetermined flexed shape.

Abstract: Provided is a wire bonding apparatus capable of performing high-speed wedge wire bonding, the apparatus including: a bonding tool having a through hole and a pressing surface for pressing a wire; a clamper for holding the wire; and a control unit. The control unit includes: wire tail extension unit that moves the bonding tool, after wedge bonding of the wire to a first lead, upward and along a second straight line connecting a second pad and a second lead, and causes the wire to extend from the through hole in a direction along the second straight line from the second pad to the second lead; and tail cut unit that, after causing the wire tail to extend, cuts the wire tail by moving the bonding tool in the direction along the second straight line connecting the second pad and the second lead while the clamper is closed.

Abstract: A multiple-projection system capable of stably observing high-definition and high quality images and capable of corresponding to the switching of the routes promptly, without irregular color etc. and without performing calibration at each switching of routes, is provided. A multiple-projection system for projecting one image on a screen 5 by two or more projectors 4, comprises a plurality of switchable routes for observing an image projection, a compensation data preservation sections 21a, 21b for storing compensation data to correct output characteristic of respective projectors 4 corresponding to respective routes, and an image processing section 22 for correcting and processing the input image signal based on the compensation data stored in the compensation data preserving section corresponding to the route used.

Abstract: A flexible magnetic disk has a first magnetic layer formed on a first surface of a circular polymeric substrate by coating and drying a magnetic coating material. After the first magnetic layer is formed and dried, a second magnetic layer is formed on a second surface of the polymeric substrate by coating and drying the magnetic coating material. The second magnetic layer formed on the second surface is then calendered to form a magnetic recording surface. The resulting magnetic disk provides for an improved surface vibration during high-speed rotation of the disk, and provides very good head touch.

Abstract: In a magnetic disk pack comprising a protective casing rotatably accommodating a flexible magnetic disk thereinside and having a pair of aligned windows formed at corresponding positions respectively so that a magnetic head can be inserted into one of the windows to be brought into sliding contact with the magnetic disk under rotation thereby recording and reproducing picture information on and from the magnetic disk, an inclined surface making an angle with the free rotation plane of the magnetic disk is provided on an inner part of the marginal edge of at least one of the windows or on a member resiliently supported at that position thereby inducing a positive pressure or a negative pressure between the rotating magnetic disk and the inclined surface depending on the direction of rotation of the magnetic disk. Such a positive pressure or negative pressure is utilized to urge or attract the magnetic disk toward and onto the magnetic head so as to ensure satisfactory head touch.

Abstract: A magnetic disc having excellent running durability is disclosed, which comprises a non-magnetic support and a magnetic layer on the non-magnetic support, the layer being composed mainly of a ferromagnetic metal powder and a binder resin, wherein the ferromagnetic metal powder has a pH value of less than 7.0 and a specific surface area as determined by the BET method of at least 40 m.sup.2 /g, and the glass transition temperature of the magnetic layer is at least 75.degree. C.