Abstract: The present invention provides a method for uniformly dispersing dispersoids in a dispersion medium. The method of the present invention for dispersing dispersoids includes applying an electric field to a mixture of a dispersion medium and dispersoids. In this dispersion method, a dispersion apparatus containing a container 3 for placing a mixture 2 of a dispersion medium and dispersoids, and an electric field application means 4 for applying an electric field to the mixture 2, which has a pair of opposing electrodes 5a and 5b, can be used.

Abstract: The present invention provides a composite material sheet wherein a filler is oriented in a given direction in an organic resin matrix by an electric field. The composite material sheet of the present invention 10 contains filler 1 and organic resin 3, and is characterized in that the filler 1 is dendritically aggregated in the organic resin matrix and oriented in the thickness direction. As a result, properties such as dielectric property, conductivity, thermal conductivity and the like can be strikingly improved as compared to conventional composite materials obtained by simply dispersing a filler.

Abstract: A flowable insulating resin 1 is placed in a sheet-like molding die space and conductive magnetic particles 2 are dispersed in the insulating resin 1. A first magnetic field G1 is acted in the sheet thickness direction on the position where a conductive path is to be formed in the die space, and conductive magnetic particles 2a are locally collected together to form a conductive path. Simultaneously, a second magnetic field G2 is acted in the sheet thickness direction on the intermediate region and the magnetic field G2 is moved in the lateral direction to move conductive magnetic particles 2b left in the intermediate region to join the collection forming the conductive path. As a result, the number of the conductive magnetic particles left in the insulating resin becomes smaller.

Abstract: An electrical connecting member is provided with a holding member made of an electric insulating material and a plurality of conductive members held by the holding member in a state of being insulated with each other. One end of each of the conductive members is exposed on one surface of the holding member and the other end of each of the conductive members is exposed on the other surface of the holding member. The conductive members have portions exposed from the holding member, the length of which is longer than the thickness of the holding member. These exposed portions are easily deformed by the pressure force exerted at the time of connecting electric circuit components to reduce the coupling load even when there is irregularity in the heights thereof or unevenness in the junctions of the objects connection, hence enabling high density connections between the electric circuit components. The exposed portions can also be formed to have empty holes, i.e.

Abstract: A flexible wiring board including a gold pad having dynamic Vickers hardness of not less than 50 or having a ratio of amount of nickel in a surface of the gold pad (atomic weight %) to thickness of gold (&mgr;m) of not more than 5 or having both the dynamic Vickers hardness of not less than 50 and the ratio of amount of nickel in the surface of the gold pad (atomic weight %) to thickness of gold (&mgr;m) of not more than 5, to provide a flexible wiring board that can substantially ensure the connection reliability when the board is connected with a semiconductor device by wiring bonding.

Abstract: A film carrier to be used for fabricating a new laminate type mounting structure, a new laminate type mounting structure comprising semiconductor elements mounted on the film carrier of the present invention and the laminate type mounting structure comprising a heat-releasing structure are provided. Due to the invention of the film carrier, handling of the semiconductor elements as well as fabrication of a laminate type mounting structure are facilitated. When a heat-releasing structure is added, the laminate type mounting structure of the present invention can advantageously efficiently release the heat generated by the semiconductor element in each layer.

Abstract: There is provided a catalyst that is highly resistant to sulfur and nitrogen compounds and active for hydrogenation and shows a low hydrocracking rate and a long service life as well as a method of converting aromatic hydrocarbons in hydrocarbon oil containing sulfur and nitrogen compounds into saturated hydrocarbons by using such a catalyst. A method of hydrogenating aromatic hydrocarbons in hydrocarbon oil containing 80 wt % or more of a fraction having a boiling point of 170 to 390° C. and said aromatic hydrocarbons is characterized in that the hydrocarbon oil is brought into contact with hydrogen in the presence of a catalyst containing clay minerals having principal ingredients of Si and Mg as carrier and at least one of the VIII-group metals of periodic table as active metal.

Abstract: A method for the electrical connection between electrical joints of electric circuit components includes disposing said electric circuit components so that said joints for the electrical connection are opposed to each other, and making the electrical connection between said electrical joints with a biasing force which is exerted by an elastic member from at least one side of said electric circuit component so that the biasing force is exerted consecutively from an intermediate position of connecting area where said joints are located to the periphery of said connecting area.

Abstract: An electrical connecting member is provided with a holding member made of an electric insulating material and a plurality of conductive members held by the holding member in a state of being insulated with each other. One end of each of the conductive members is exposed on one surface of the holding member and the other end of each of the conductive members is exposed on the other surface of the holding member. The conductive members have portions exposed from the holding member, the length of which is longer than the thickness of the holding member. These exposed portions are easily deformed by the pressure force exerted at the time of connecting electric circuit components to reduce the coupling load even when there is irregularity in the heights thereof or unevenness in the junctions of the objects connection, hence enabling high density connections between the electric circuit components.

Abstract: A ceramic substrate has a five-layered thin metallic film thereon. The first layer is Ti, Zr, Cr and/or W; the second layer is Ni and/or Mo; the third layer is one or more metals of group Ib in the periodic table; the fourth layer contains the same metals as the second layer and the fifth layer contains the same metals as the third layer.

Abstract: An electrical connecting member, one surface of which is connected to a connecting section of a first electrical circuit member and another surface of which is connected to a connecting section of a second electrical circuit member. The electrical connecting member includes a holding member formed of an electrically insulative member. The holding member has a plurality of recess holes. The connecting member also includes a plurality of electrically conductive members provided in the electrically insulative member, insulated from each other. One end of the electrically conductive members is exposed on one surface of the holding member to be connected to the connecting section of the first electrical circuit member. Another end of the electrically conductive members is exposed on another surface of the holding member to be connected to the connecting section of the second electrical circuit member.

Abstract: A process for the fluid catalytic cracking of heavy fraction oils containing heavy metals such as Ni and V, which comprises withdrawing a portion of ferrite-containing catalyst particles circulating in a fluid catalytic cracking apparatus, separating the thus withdrawn catalyst particles into metals-richly deposited catalyst particles and metals-poorly deposited ones by using a magnetic separator and then returning the metals-poorly deposited catalyst particles, together with fresh ferrite-containing catalyst particles, into said cracking apparatus.

Abstract: A process for preparing an electrical connecting member having a holding member comprising an electrically insulating material and a plurality of electroconductive members equipped in the holding member under the state mutually insulated from each other, one end of the each electroconductive member being exposed at one surface of the holding member, and the other end of the each electroconductive member being exposed at the other surface of the each holding member, the process having the following steps, namely the step of forming a matrix having the state where the holding member is in contact with a base member for supporting the holding member the step of irradiating a high energy beam on the matrix from the holding member side to remove the holding member, thereby forming a plurality of holes the step of filling an electroconductive material which becomes the electroconductive member into the plurality of holes formed and the step of removing the base member.

Abstract: A method of manufacturing an electrical connecting member having a holding member formed of an electrically insulative material, and a plurality of electrically conductive members provided in a mutually insulated state in the holding member, one end of each of the electrically conductive members being exposed on one surface of the holding member and the other end of each of the electrically conductive members being exposed on the other surface of the holding member, includes the steps of providing photosensitive resin which provides the holding member on a base body, applying light to the photosensitive resin through a photomask forming a predetermined pattern to thereby expose the photosensitive resin to the light, developing the photosensitive resin to form a plurality of apertures in the photosensitive resin, thereby exposing the base body, leaving the photosensitive resin through which the base body has been exposed in a heated atmosphere and/or a negative pressure atmosphere for a predetermined time, etc

Abstract: A process for preparing an electrical connecting member having a holding member comprises an electrically insulating material, a plurality of electroconductive members equipped in the holding member under the state mutually insulated from each other, one end of the each electroconductive member being exposed at one surface of the holding member, and the other end of the each electroconductive member being exposed at the other surface of the holding member, the process comprising the steps of:(A) constituting a matrix member by providing a photosensitive resin which becomes the holding member on both surfaces of a base member, respectively;(B) exposing and developing the respective photosensitive resins to form a plurality of holes through the photosensitive resins, thereby having the base member exposed;(C) curing the photosensitive resins;(D) etching away a part of the base member exposed;(E) filling an electroconductive member into the holes formed in the holding members coplanar with or protruded from the

Abstract: A process for preparing an electrical connecting member having a holding member with an electrically insulating material, and a plurality of electroconductive members. The electroconductive members are mutually insulated from each other and one end of each of the electroconductive members is exposed at one surface of the holding member and the other end is exposed at another surface of the holding member. A holding member is formed by forming a layer on a base member with the holding member having a photosensitive resin on the uppermost surface of the layer. The holding member is exposed and developed by forming a plurality of holes through the holding member, thereby exposing the uppermost surface of the layer. A part of the exposed layer is etched away and the holes on the holding member are filled with an electroconductive member. The remaining layer and base member are then removed.