Abstract: A waterproof connector (1) comprises: retainers (50) and (60) which include an inner receiving portion (91) formed on opposite surfaces (51) and (61) which face a wiring substrate (30); and a first seal member (70) which is filled in at least the inner receiving portion (91). An outer receiving portion (92) is formed on outer surfaces (55) and (65) and side surfaces (50d), (50e), (60d), and (60e) of the retainers (50) and (60). Defective portions (58) and (68), which pass from the outer surfaces (55) and (65) to the inner receiving portion (91), are formed in the retainers (50) and (60). The inner receiving portion (91) communicates with the outer receiving portion (92) at the side surfaces (50d), (50e), (60d), and (60e). The first seal member (70) includes: an inner seal portion (70a) which is received in the inner receiving portion (91); and; a defective seal portion (70d) and a side seal portion (70c) which are formed integrally with the inner seal portion (70a).

Abstract: A waterproof connector (1) comprises: retainers (50) and (60) which include an inner receiving portion (91) formed on opposite surfaces (51) and (61) which face a wiring substrate (30); and a first seal member (70) which is filled in at least the inner receiving portion (91). An outer receiving portion (92) is formed on outer surfaces (55) and (65) and side surfaces (50d), (50e), (60d), and (60e) of the retainers (50) and (60). Defective portions (58) and (68), which pass from the outer surfaces (55) and (65) to the inner receiving portion (91), are formed in the retainers (50) and (60). The inner receiving portion (91) communicates with the outer receiving portion (92) at the side surfaces (50d), (50e), (60d), and (60e). The first seal member (70) includes: an inner seal portion (70a) which is received in the inner receiving portion (91); and; a defective seal portion (70d) and a side seal portion (70c) which are formed integrally with the inner seal portion (70a).

Abstract: An electronic device includes an electronic control unit, a wire, and a wiring-side connector. When a movable member is arranged in a first arrangement relative to a wiring-side connector main body, the movable member is in a position where the movable member does not prevent the wire from projecting from the main body to extend straight in a counter-fitting direction. When the movable member rotates from the first arrangement to a second arrangement relative to the main body, a restricting member approaches a portion of the main body from which the wire projects, to press and bend the wire, so a direction in which the wire projects from the main body is limited to a direction crossing the counter-fitting direction. When the movable member is arranged in the second arrangement and the main body is fitted to an ECU-side connector, the second arrangement is maintained.

Abstract: Provided is a bending rigid printed wiring board which facilitate the mounting of electric parts (realization of a high producibility and high assemblability substrate circuit) and enables spaces to be saved and which can be easily manufactured. That is, provided is a bending rigid printed wiring board, which is characterized in that a heat resistant resin layer is laminated on a front surface of a hard core material provided so as to contain a gap portion and also on a top surface of the gap portion, in that a heat resistant resin layer is laminated on a rear surface of the core material except the gap portion, in that a conductor layer is laminated and firmly fixed via the heat resistant resin layers and in that the conductor layer is etched, whereby a circuit is formed.

Abstract: An image pickup device has a signal processing part configured to perform signal process for the first to third color signals. The signal processing part includes a first color generator configured to generate a fourth color signal corresponding to a reference pixel based on a ratio between a second color signal at a pixel located in vicinity of the reference pixel and a first color signal at a pixel located in vicinity of the reference pixel, a second color generator configured to generate a fifth color signal corresponding to the reference pixel based on a ratio between a third color signal at a pixel located in vicinity of the reference pixel and the first color signal at a pixel located in vicinity of the reference pixel, and a image quality converter configured to generate color signals by performing a predetermined image process based on the first to fifth color signals.

Abstract: An electronic device includes an electronic control unit, a wire, and a wiring-side connector. When a movable member is arranged in a first arrangement relative to a wiring-side connector main body, the movable member is in a position where the movable member does not prevent the wire from projecting from the main body to extend straight in a counter-fitting direction. When the movable member rotates from the first arrangement to a second arrangement relative to the main body, a restricting member approaches a portion of the main body from which the wire projects, to press and bend the wire, so a direction in which the wire projects from the main body is limited to a direction crossing the counter-fitting direction. When the movable member is arranged in the second arrangement and the main body is fitted to an ECU-side connector, the second arrangement is maintained.

Abstract: This invention provides a bending-type rigid printed wiring board that can easily realize mounting of electric components (can realize a plated circuit having high productivity and assembling properties), can realize space saving, and can realize easy production. The bending-type rigid printed wiring board comprises a hard cure material (1) with a space part (1A) inserted thereinto. A heat-resistant resin layer (31) is stacked on the surface of the hard core material (1) and, at the same time, on the upper surface of the space part (1A). A heat-resistant resin layer (32) is stacked on the backside of the core material (1) except for the space part (1A). Further, a conductor layer (4) is stacked and fixed through the heat-resistant resin layers (31, 32). The conductor layer (4) has been etched to form a circuit.

Abstract: An image pickup apparatus comprises an image pickup device for obtaining a first image signal picked up with a first exposure time and a second image signal picked up with a second exposure time different from the first exposure time, an image signal processing unit for conducting image signal processing on the first image signal and the second image signal and combining them into one image signal, a control unit for controlling the image pickup device and the image signal processing unit, and an image signal output unit for taking out the image signal subjected to the signal processing. The image pickup means includes a CMOS sensor, and the first image signal and the second image signal supplied from the image pickup means are subjected to photoelectric conversion, immediately output as signals and subjected to the signal processing in the image signal output unit.

Abstract: A wire harness includes a flat cable having a trunk portion formed by covering a plurality of parallel electric wires with an insulating coating by integral molding, a plurality of branch portions formed by branching the trunk portion, and a joint device for connecting not less than two electric wires of the plurality of electric wires constituting the trunk portion to electrically short-circuit the branch portions.

Abstract: The present invention provides such a structure that a male-type terminal which in inserted to a female-type terminal to come in contact therewith comprises a resistor on at least a tip portion of a resistor and that at the time of insertion to the female-type terminal, a switching is made from the resistor to the conductor portion and, at the time of detachment from the female-type terminal, switching is made from the conductor portion to the resistor.

Abstract: The present invention provides such a structure that a male-type terminal which in inserted to a female-type terminal to come in contact therewith comprises a resistor on at least a tip portion of a resistor and that at the time of insertion to the female-type terminal, a switching is made from the resistor to the conductor portion and, at the time of detachment from the female-type terminal, switching is made from the conductor portion to the resistor.

Abstract: The present invention provides a method for polishing the surface of the transparent substrate layer of a color filter unit comprising a transparent substrate layer, a color filter layer, a protective film layer and a transparent electrode layer, which method comprises attaching, to the surface of the transparent electrode layer, a pressure-sensitive tape consisting of a base film layer and a pressure-sensitive adhesive layer giving substantially no staining to said surface of the transparent electrode layer, formed on one surface of the base film layer, as well as a pressure-sensitive tape used in the method. When the surface of the transparent substrate layer is polished according to the present method, there occurs no breakage of the color filter unit. Further, there occurs no staining of the surface of the transparent electrode layer owing to the adhesion of residual pressure-sensitive adhesive, abrasive, polishing refuse, etc.

Abstract: In a multi-function digital CCD camera according to the present invention, the image signal outputted from the solid-state image pick-up device is inputted into a signal processing circuit where the signal is shaped into an image signal. The image signal from the signal processing circuit is inputted into the image quality changeover circuit having a plurality of signal processing paths, each with a peculiar signal processing characteristic. In the image quality changeover circuit, the plurality of signal processing paths are combined based on a control signal from the image quality selective circuit. The image signal obtained from respective signal processing paths are inputted into the image composition circuit. The signal obtained from the image composition circuit is inputted into the color encoder where the signal is encoded into a camera output video signal.

Abstract: The present invention relates to a wafer processing film used for the prevention of breakage upon grinding a semiconductor wafer. The wafer processing film has a base film an adhesive layer provided on one surface of the base film and a synthetic resin film arranged on the adhesive layer. The surface roughness of the surface of the synthetic resin film in contact with the adhesive layer is not greater than 2 .mu.m.The present invention provides a wafer processing film which can protect the surface of a wafer from contamination and corrosion after grinding the wafer.

Abstract: The present invention provides a water processing film fitted on one side of the base film with a pressure-sensitive adhesive layer and further with a release film on the surface of the pressure-sensitive adhesive layer, and coated on the back side of the base film a phosphoric surfactant wherein ionic components are not detected by ion chromatography, and can prevent failure of an integrated circuit dye static electricity generated in the handling of the wafer processing film and can also inhibit contamination and corrosion of the wafer by surfactant.

Abstract: In a video camera apparatus, one of two optical paths obtained by a split optical system is led to a first solid state image pickup device and the other optical path is led to a second solid state image pickup device. The first and second solid state image pickup devices each have a plurality of optoelectric transducing elements as pixels arrayed vertically and horizontally in a plane on which an image is formed by the light passed through an objective. In the second device, an intervel between the two adjacent optoelectric transducing elements is equal to that between the two adjacent optoelectric transducing elements arrayed in the image forming plane of the first device. The optoelectric transducing elements arrayed in the image forming plane of the second device is vertically and horizontally displaced by 1/2 of the pixel pitch from the corresponding optoelectric transducing elements arrayed in the image forming plane of the first device.

Abstract: Storage charges held in a photosensitive section of a CCD, serving as a solid-state imaging device, are simultaneously transferred to a high-speed transfer section, in response to a field shift pulse from a driver. The high-speed transfer section then transfers the charges to a field memory, in unit of lines and at a high speed. The field memory includes first and second memory arrays each having a one-field memory capacity and corresponding to a high-speed transfer array in the high-speed transfer section. Charges from each high-speed transfer array are alternately transferred to the first and second field memory arrays by a gate controlled by gate pulses supplied from the driver. The charges stored in the first field memory array are read out and transferred by a line transfer section, in units of lines, thereby obtaining a video signal of an odd-numbered field.

Abstract: Storage charges held in a photosensitive section of a CCD, serving as a solid-state imaging device, are discharged in response to a discharge field shift pulse supplied from a driver. When a first signal read field shift pulse is supplied from the driver, storage charges held in the photosensitive section are simultaneously transferred to a high-speed transfer section, and then transferred from the high-speed transfer section to a field memory, in units of lines and at a high speed. When a second signal read field shift pulse is supplied from the driver, storage charges held in the photosensitive section are simultaneously transferred to the high-speed transfer section. The charges stored in the field memory are transferred, in units of liens, by a line transfer section, whereby a video signal of an odd-numbered filed is obtained.

Abstract: The mirror image generator for composite signals with chroma inversion includes a first step of orthogonally modulating first and second color difference signals by first and second subcarriers where the subcarriers have 0.degree. and 270.degree. phases with respect to a 90.degree.

Abstract: A color imaging device includes a solid state image sensor formed with a plurality of picture elements in a two dimensional array. A color filter array has filter portions in one-to-one correspondence with the picture elements. The filter portions are formed as lenses to provide a focusing effect. These lenses can include cyan focusing color filter portions, yellow focusing color filter portions, and full-color light-transmitting focusing color filter portions. All of these filter portions focus incident light using a lens effect onto respective elements on the solid state image sensor. In one embodiment, protective layers are located between filter parts. Other embodiments use tannic acid in their formation. In this way, inaccuracies in color signal separation are minimized.