Patents by Inventor Yasuo Tsukuda

Yasuo Tsukuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060263872
    Abstract: Disclosed is a spectrophotometry for a spectral transmission measurement of an extremely small volume of sample solution. A sampler 15 is formed of a flat plate member formed with a sample-holding hole 152 which penetrates the flat plate member in its thickness direction and has a reverse truncated cone shape, and a target sample solution is dropped into the sample-holding hole 152 of the sampler 15 positioned approximately horizontally and held in the hole 152 based on a surface tension of the sample solution in the form of a droplet S. Then, a measurement light is emitted to the held droplet S from directly above. A transmitted light getting out of the droplet S downward is introduced to a diffraction grating 19 through a window plate 17 and a slit 18, and dispersed in a wavelength dependent manner. The resulting light with dispersed wavelength components is detected by a multichannel detector 20 approximately simultaneously.
    Type: Application
    Filed: May 18, 2006
    Publication date: November 23, 2006
    Inventor: Yasuo Tsukuda
  • Patent number: 7101257
    Abstract: A substrate polishing apparatus polishes a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed and a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate. The substrate polishing apparatus also has a fluid supply passage for supplying a fluid for measurement, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the fluid for measurement to the fluid chamber.
    Type: Grant
    Filed: July 14, 2003
    Date of Patent: September 5, 2006
    Assignees: Ebara Corporation, Shimadzu Corporation
    Inventors: Kazuto Hirokawa, Yoichi Kobayashi, Shunsuke Nakai, Shinro Ohta, Yasuo Tsukuda
  • Publication number: 20060166606
    Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.
    Type: Application
    Filed: October 15, 2003
    Publication date: July 27, 2006
    Inventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya
  • Publication number: 20050239372
    Abstract: A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
    Type: Application
    Filed: June 30, 2005
    Publication date: October 27, 2005
    Inventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Hiroki Yamauchi
  • Patent number: 6942543
    Abstract: The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
    Type: Grant
    Filed: May 27, 2004
    Date of Patent: September 13, 2005
    Assignees: Ebara Corporation, Shimadzu Corporation
    Inventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Hiroki Yamauchi
  • Publication number: 20040235393
    Abstract: A substrate polishing apparatus polishes a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus according to the present invention has a polishing table against which a substrate is pressed, a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate, a fluid supply passage for supplying a fluid for measurement, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the fluid for measurement to the fluid chamber.
    Type: Application
    Filed: July 14, 2003
    Publication date: November 25, 2004
    Inventors: Kazuto Hirokawa, Yoichi Kobayashi, Shunsuke Nakai, Shinro Ohta, Yasuo Tsukuda
  • Publication number: 20040219865
    Abstract: The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device, wherein the table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
    Type: Application
    Filed: May 27, 2004
    Publication date: November 4, 2004
    Inventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Hiroki Yamauchi
  • Patent number: 6758723
    Abstract: The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device, wherein the table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: July 6, 2004
    Assignees: Ebara Corporation, Shimadzu Corporation
    Inventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Hiroki Yamauchi
  • Publication number: 20030124957
    Abstract: The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device, wherein the table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
    Type: Application
    Filed: December 27, 2002
    Publication date: July 3, 2003
    Inventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Hiroki Yamauchi
  • Patent number: 5731594
    Abstract: An infrared light source used in spectrometers including an infrared range, a Fourier Transform Infrared Spectroscope (FTIR), etc. The infrared light source is composed of a panel made of sintered silicon nitride plates, a heating element made of metal and embedded in the panel, and a pair of conducting lines for supplying electricity to the heating element. The infrared light is emitted homogeneously from the flat surface of the panel, as compared to a conventional infrared light source using a metal filament in which infrared light is emitted inhomogeneously. It is preferred to form a silicon oxide layer on a surface of the panel to prevent initial change in the infrared emitting characteristic.
    Type: Grant
    Filed: August 20, 1996
    Date of Patent: March 24, 1998
    Assignee: Shimadzu Corporation
    Inventors: Shin-ichi Kuroda, Hideki Sato, Yasuo Tsukuda
  • Patent number: 5422483
    Abstract: A near infrared analyzer has, arranged on a base, a halogen tungsten lamp as light source, an optical stop for light from the source, an optical system for converging a flux of light for measuring and directing it to a measuring section and a system including an integrating sphere at which a sample is set. A spectrometer part has its entrance slit placed on the bottom surface of the integrating sphere, and includes a diffraction grating for diffraction and dispersion of incident light flux from the entrance slit, an arrayed detector and a reflective mirror for reflecting the diffracted light from the diffraction grating so as to be dispersed and focused on the surface of the detector. Signals from the detector can be sequentially retrieved for electronically scanning wavelengths without mechanically oscillating or rotating the grating. This makes it possible to maintain high accuracy in wavelengths over a long period of time.
    Type: Grant
    Filed: July 7, 1993
    Date of Patent: June 6, 1995
    Assignee: Shimadzu Corporation
    Inventors: Osamu Ando, Atsuhiro Iida, Kan Nakamura, Yasuo Tsukuda
  • Patent number: 4808490
    Abstract: A film resistor heater comprising a sprayed film resistor comprisng NiCr particles uniformly dispersed and partly contacted with each other in an insulating ceramic matrix. The film resistor heater may further comprise a bonding layer, an insulating layer and a protective layer. The film resistor heater is prepared by spraying, particularly plasma spraying. It may be used advantageously for home electric appliances such as hot plates, rice cookers and vacuum kettles, heat rolls for electrostatic copiers, etc.
    Type: Grant
    Filed: October 29, 1986
    Date of Patent: February 28, 1989
    Assignee: Hitachi Metals, Ltd.
    Inventors: Yasuo Tsukuda, Hisao Hara
  • Patent number: 4733088
    Abstract: A radiation detector comprises a scintillator capable of emitting light by radiation and a photodetector for detecting the light emitted from the scintillator, the scintillator being composed of a sintered body prepared by sintering rare earth oxysulfide as a body starting material containing a densification additive by hot isostactic pressing. The sintered body has a high light output and a high density.
    Type: Grant
    Filed: August 11, 1986
    Date of Patent: March 22, 1988
    Assignees: Hitachi, Ltd., Hitachi Medical Corp., Hitachi Metals, Ltd.
    Inventors: Hiromichi Yamada, Yasuo Tsukuda, Atsushi Suzuki, Hajime Yamamoto, Minoru Yoshida, Kenji Maio, Hideji Fujii
  • Patent number: 4715178
    Abstract: An improved exhaust port assembly, for an internal combustion engine comprises a port pipe made of heat resistance steel covered by a fibrous ceramic sheet which is covered by an aluminum foil to prevent molten aluminum from penetrating the fibrous ceramic sheet when aluminum casting.
    Type: Grant
    Filed: August 1, 1984
    Date of Patent: December 29, 1987
    Assignee: Hitachi Metals, Ltd.
    Inventors: Yasuo Tsukuda, Hisao Hara, Hideki Harada, Yasuo Iizuka
  • Patent number: 4306908
    Abstract: A ferromagnetic amorphous alloy having a composition represented by (Co.sub.x Ni.sub.y Fe.sub.z).sub.a M.sub.b G.sub.c, wherein M is Cr, Mo and/or W, G is Zr, Hf and/or Ti and x, y, z and a, b, c are selected to meet the conditions of x=1-y-z, 0.ltoreq.y.ltoreq.0.2, 0.ltoreq.z.ltoreq.0.7, a=1-b-c, 0.ltoreq.b.ltoreq.0.05 and 0.05.ltoreq.c.ltoreq.0.2 This amorphous alloy has a superior magnetic characteristic and a high thermal stability.
    Type: Grant
    Filed: September 19, 1980
    Date of Patent: December 22, 1981
    Assignees: Hitachi, Ltd., Hitachi Metals, Ltd., Hitachi Research Dev. Corp.
    Inventors: Shinji Takayama, Yasuo Tsukuda, Kazuo Shiiki, Shigekazu Otomo, Mitsuhiro Kudo, Yasunobu Ogata, Yoshizo Sawada
  • Patent number: 4259101
    Abstract: A method for producing an optical fiber preform comprising the steps of blowing, through at least one nozzle, gaseous material producing glass material soot by a CVD reaction to permit the glass material soot to be deposited on a target to produce a soot rod which grows in size, and heating and rendering transparent the soot rod produced in the first step, wherein a pipe is arranged substantially concentrically with the glass material soot so as to permit gas to flow through a clearance between the deposited glass material soot and the inner wall surface of the pipe in a direction in which the soot rod grows in size. The method makes it possible to prevent the outer peripheral portion of the soot rod from becoming porous and to satisfactorily control the diameter of the soot rod.
    Type: Grant
    Filed: March 2, 1979
    Date of Patent: March 31, 1981
    Assignee: Hitachi, Ltd.
    Inventors: Yasuo Tsukuda, Katsuyuki Imoto, Kenzo Susa, Iwao Matsuyama, Tsuneo Suganuma
  • Patent number: RE33022
    Abstract: A ferromagnetic amorphous alloy having a composition represented by (Co.sub.x Ni.sub.y Fe.sub.z).sub.a M.sub.b G.sub.c, wherein M is Cr, Mo and/or W, G is Zr, Hf and/or Ti and x,y,z and a, b, c are selected to meet the conditions of x=1-y-z, 0.ltoreq.y.ltoreq.0.2, 0.ltoreq.z.ltoreq.0.7, a=1-b-c, 0.ltoreq.b.ltoreq.0.05 and 0.05.ltoreq.c.ltoreq.0.2 This amorphous alloy has a superior magnetic characteristic and a high thermal stability.
    Type: Grant
    Filed: November 5, 1987
    Date of Patent: August 15, 1989
    Assignees: Hitachi, Ltd., Hitachi Metals, Ltd., Research Development Corp. of Japan
    Inventors: Shinji Takayama, Yasuo Tsukuda, Kazuo Shiiki, Shigekazu Otomo, Mitsuhiro Kudo, Yasunobu Ogata, Yoshizo Sawada