Patents by Inventor Yasuomi Ueda

Yasuomi Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thick film integrated circuits
    Patent number: 4051550
    Abstract: A thick film integrated circuit comprises a ceramic substrate, conductors formed on one surface of the ceramic substrate, circuit components mounted on the one surface of the ceramic substrate, a resistance for a variable resistor formed on the other surface of the ceramic substrate, variable resistor elements including an adjusting shaft and a slider member constituting the variable resistor formed in cooperation with the resistance, and means for mounting the elements of the variable resistor on the other surface of the ceramic substrate.
    Type: Grant
    Filed: November 25, 1975
    Date of Patent: September 27, 1977
    Assignee: Hitachi, Ltd.
    Inventors: Shougo Seno, Tatsuro Toyama, Teruo Takai, Yasuomi Ueda