Patents by Inventor Yasushi Inagaki

Yasushi Inagaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and method for manufacturing printed circuit board
    Publication number: 20050157478
    Abstract: Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.
    Type: Application
    Filed: February 23, 2005
    Publication date: July 21, 2005
    Applicant: IBIDEN CO., LTD.
    Inventors: Yasushi Inagaki, Motoo Asai, Dongdong Wang, Hideo Yabashi, Seiji Shirai
  • Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board
    Patent number: 6876554
    Abstract: Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.
    Type: Grant
    Filed: September 1, 2000
    Date of Patent: April 5, 2005
    Assignee: Ibiden Co., Ltd.
    Inventors: Yasushi Inagaki, Motoo Asai, Dongdong Wang, Hideo Yabashi, Seiji Shirai
  • Printed circuit board and method of manufacturing printed circuit board
    Publication number: 20040160751
    Abstract: A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.
    Type: Application
    Filed: February 19, 2004
    Publication date: August 19, 2004
    Applicant: IBIDEN Co., Ltd.
    Inventors: Yasushi Inagaki, Motoo Asai, Dongdong Wang, Hideo Yabashi, Seiji Shirai
  • Printed wiring board and method of producing the same
    Patent number: 6724638
    Abstract: A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makesit possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.
    Type: Grant
    Filed: April 25, 2001
    Date of Patent: April 20, 2004
    Assignee: Ibiden Co., Ltd.
    Inventors: Yasushi Inagaki, Motoo Asai, Dongdong Wang, Hideo Yabashi, Seiji Shirai
  • Terminal frame used to manufacture electronic devices and manufacturing system of terminal frames
    Patent number: 5859400
    Abstract: A terminal frame used to manufacture electronic devices, the terminal frame having a metal strip and a plurality of stick-like metal terminals. The metal terminals are joined to the metal strip by resistance welding. A manufacturing system of such terminal frames includes a device used for resistance welding, where the device has an electrode which holds each terminal at a portion near a joint portion, and a current is supplied to the terminal through the electrode.
    Type: Grant
    Filed: October 29, 1996
    Date of Patent: January 12, 1999
    Assignee: Murata Manufacturing, Co., Ltd.
    Inventors: Yasushi Inagaki, Daisaku Kugou, Kunikazu Nakahara