Abstract: A manufacturing method for a head-stack assembly. The method includes preparing a head-stack assembly. The method further includes placing a connection pad forming surface of a connector tab formed on an end of the trace so as to be positioned opposite to an edge of a circuit board; sliding an elastic component along a backside of the connection pad forming surface; and, stopping the elastic component on the backside and pressing the backside with the elastic component so as to press the connection pad forming surface against the edge. In addition, the method includes metal-joining the connector tab and a connection pad of the circuit board by applying heat to a connection pad of the connector tab and the connection pad on the circuit board while pressing the connection pad forming surface against the edge with the elastic component; and, removing the elastic component after the metal-joining.

Abstract: An object of the present invention is to provide an adhesive composition that can form an adhesive sheet for producing a semiconductor device capable of suppressing deterioration in ion scavengeability after the adhesive sheet goes through thermal history. It is an adhesive composition for producing a semiconductor device containing at least an organic complex-forming compound that forms a complex with cations, and the 5% weight loss temperature of the organic complex-forming compound measured by thermogravimetry is 180° C. or more.

Abstract: A method for producing a light-emitting diode device includes the steps of: preparing a light-emitting laminate including an optical semiconductor layer, and an electrode unit formed on the optical semiconductor layer; forming an encapsulating resin layer on the optical semiconductor layer so as to cover the electrode unit, the encapsulating resin layer containing a light reflection component; partially removing the encapsulating resin layer so as to expose the top face of the electrode unit, thereby producing a light-emitting diode element; and disposing the light-emitting diode element and a base substrate provided with terminals so that the light-emitting diode element and the base substrate face each other, and that the electrode unit and the terminals are electrically connected, thereby flip chip mounting the light-emitting diode element on the base substrate.

Abstract: An object of the present invention is to provide an adhesive sheet that can capture cations mixed in from outside during various processes of manufacturing a semiconductor device to prevent deterioration in electrical characteristics of a semiconductor device to be manufactured and to improve product reliability. It is an adhesive sheet for producing a semiconductor device, in which when 2.5 g of the adhesive sheet is soaked in 50 ml of an aqueous solution containing 10 ppm of copper ions, and the solution is left at 120° C. for 20 hours, the concentration of copper ions in the aqueous solution is 0 to 9.9 ppm.

Abstract: To present an injection head having silencing function for gas type fire extinguisher capable of reducing the noise generated upon release of fire extinguishing gas. In a gas type fire extinguisher using a fire extinguishing gas, a silencer 3A is disposed in an injection head 1A installed for releasing a fire extinguishing gas into a fire extinguishing area.

Abstract: An object of the present invention is to provide an adhesive composition that can form an adhesive sheet for producing a semiconductor device capable of suppressing deterioration in ion scavengeability after the adhesive sheet goes through thermal history. It is an adhesive composition for producing a semiconductor device containing at least an organic complex-forming compound that forms a complex with cations, and the 5% weight loss temperature of the organic complex-forming compound measured by thermogravimetry is 180° C. or more.

Abstract: An object of the present invention is to provide an adhesive sheet that can capture cations mixed in from outside during various processes of manufacturing a semiconductor device to prevent deterioration in electrical characteristics of a semiconductor device to be manufactured and to improve product reliability. It is an adhesive sheet for producing a semiconductor device, in which when 2.5 g of the adhesive sheet is soaked in 50 ml of an aqueous solution containing 10 ppm of copper ions, and the solution is left at 120° C. for 20 hours, the concentration of copper ions in the aqueous solution is 0 to 9.9 ppm.

Abstract: A method for producing a light-emitting diode device includes the steps of: preparing a light-emitting laminate including an optical semiconductor layer, and an electrode unit formed on the optical semiconductor layer; forming an encapsulating resin layer on the optical semiconductor layer so as to cover the electrode unit, the encapsulating resin layer containing a light reflection component; partially removing the encapsulating resin layer so as to expose the top face of the electrode unit, thereby producing a light-emitting diode element; and disposing the light-emitting diode element and a base substrate provided with terminals so that the light-emitting diode element and the base substrate face each other, and that the electrode unit and the terminals are electrically connected, thereby flip chip mounting the light-emitting diode element on the base substrate.

Abstract: A light-emitting diode element includes an optical semiconductor layer, an electrode unit to be connected to the optical semiconductor layer, and an encapsulating resin layer that encapsulates the optical semiconductor layer and the electrode unit, the encapsulating resin layer containing a light reflection component.

Abstract: A battery pack rechargeable by a magnetic induction effect incorporates a secondary coil electromagnetically coupled to a primary coil of a battery charger and a secondary battery rechargeable by electric power induced to the secondary coil. The secondary battery is in a form of a thin battery having a larger width than a thickness, and two opposing surfaces of the secondary battery are composed of a first flat surface and a second flat surface. The secondary coil is in a form of a planar coil with a wire material being spirally coiled in the plane. In the battery pack, the secondary coil in the form of the planar coil is fixedly layered on the first flat surface of the thin battery.

Abstract: A battery pack rechargeable by a magnetic induction effect incorporates a secondary coil electromagnetically coupled to a primary coil of a battery charger and a secondary battery rechargeable by electric power induced to the secondary coil. The secondary battery is in a form of a thin battery having a larger width than a thickness, and two opposing surfaces of the secondary battery are composed of a first flat surface and a second flat surface. The secondary coil is in a form of a planar coil with a wire material being spirally coiled in the plane. In the battery pack, the secondary coil in the form of the planar coil is fixedly layered on the first flat surface of the thin battery.

Abstract: There is provided a new film for manufacturing a semiconductor device that is superior to prevent contamination of a semiconductor chip having an excellent balance of holding power during dicing a semiconductor wafer even where the semiconductor wafer is thin, peeling property when peeling the semiconductor chip that is obtained by dicing together with its adhesive layer, and low contamination property in which there is no attachment of cutting debris to the semiconductor chip. A film for manufacturing a semiconductor device that is used when manufacturing a semiconductor device has a base layer, a first pressure-sensitive adhesive layer that is provided on the base layer, a radiation curing-type second pressure-sensitive adhesive layer that is provided on the first pressure-sensitive adhesive layer and cured by radiation irradiation in advance, and an adhesive layer that is provided on the second pressure-sensitive adhesive layer.

Abstract: Provided is an adhesive composition into which an additive for capturing a cation is incorporated, thereby making it possible to form a semiconductor-device-producing adhesive sheet capable of preventing deterioration of the electrical characteristic of a produced semiconductor device so as to improve the product reliability of the device. An adhesive composition, for producing a semiconductor device, which contains at least an additive for capturing a cation.

Abstract: A manufacturing method for a head-stack assembly. The method includes preparing a head-stack assembly. The method further includes placing a connection pad forming surface of a connector tab formed on an end of the trace so as to be positioned opposite to an edge of a circuit board; sliding an elastic component along a backside of the connection pad forming surface; and, stopping the elastic component on the backside and pressing the backside with the elastic component so as to press the connection pad forming surface against the edge. In addition, the method includes metal joining the connector tab and a connection pad of the circuit board by applying heat to a connection pad of the connector tab and the connection pad on the circuit board while pressing the connection pad forming surface against the edge with the elastic component; and, removing the elastic component after the metal joining.

Abstract: The battery pack has a battery, output terminals to bring out the battery electrodes, and a molding holder to connect to the battery as well as retain the output terminals. The battery pack is molded with at least the battery, the molding holder, and its connecting region inserted into a molded plastic resin region. The molded plastic resin region exposes output terminal surfaces, and also joins the battery, output terminals, and molding holder as a single unit.

Abstract: Embodiments of the present invention provide a soldering method capable of satisfactorily melting a solder without damaging a workpiece be soldered. One embodiment of a soldering method removes component waves of predetermined wavelengths from a light beam emitted by a light source and melts a solder by irradiating the solder with a light beam obtained by removing the component waves of the predetermined wavelengths from the light beam emitted by the light source.

Abstract: A motor-operated valve has a rotor unit in a can, and is rotationally driven by a stator unit. The rotation of the rotor unit is transmitted to a screw feed member. A stem member fixed to a valve body is engaged threadedly with the screw feed member by a first screw portion. At the same time, the screw feed member is engaged threadedly with an external thread portion fixed to a valve stem by the second screw portion. The first screw portion and the second screw portion constitute a differential screw mechanism, and feeds the valve stem according to a difference in pitch.

Abstract: A battery pack rechargeable by a magnetic induction effect incorporates a secondary coil electromagnetically coupled to a primary coil of a battery charger and a secondary battery rechargeable by electric power induced to the secondary coil. The secondary battery is in a form of a thin battery having a larger width than a thickness, and two opposing surfaces of the secondary battery are composed of a first flat surface and a second flat surface. The secondary coil is in a form of a planar coil with a wire material being spirally coiled in the plane. In the battery pack, the secondary coil in the form of the planar coil is fixedly layered on the first flat surface of the thin battery.

Abstract: In a manufacture of a probe for a scattering type near-field microscope, there is provided a method of coating, with a high reproducibility, uniform metal particles efficiently inducing a surface enhanced Raman scattering. It has been adapted such that, in the probe for the scattering type near-field microscope, one part or all of the probe due to an interaction of at least an evanescent field is coated by metal particles which don't mutually adhere and have a particle diameter of 10 nm or larger and 50 nm or smaller in radius of curvature.

Abstract: A fan-motor-incorporated heat sink effectively supplies cooling air flow in a thin electronic device having limited space above the heat sink. The heat sink enables air intake above the heat sink by positioning a fan, the fins of a heat sink substrate and the side wall of the substrate lower than the fan driving unit. The heat sink substrate and the fins are formed such that air is exhausted only in one direction. A cover is provided on the side of the heat sink substrate on which the fan driving unit is mounted and to which air is taken in to prevent exhausted air from being taken in. The structure of the electronic device is positioned close to the upper surface of the fan driving unit on the heat sink. Thus, the heat sink can be installed on a thin electronic device while improving the cooling of a heat emitting element.