Patents by Inventor Yasushi Kurihara
Yasushi Kurihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9978675Abstract: A package includes an insulating member, first electrically conductive members, and a second electrically conductive member. Each of the first electrically conductive members includes a first terminal portion that forms a part of a first surface, and a second terminal portion that is positioned on a side of a side surface with respect to the first terminal portion and forms a part of the side surface. The second electrically conductive member includes an embedded portion embedded in the insulating member, third terminal portions each of which forms a part of the first surface and is connected to the embedded portion, and a fourth terminal portion that forms a part of a second surface and is connected to the embedded portion.Type: GrantFiled: November 14, 2016Date of Patent: May 22, 2018Assignee: CANON KABUSHIKI KAISHAInventors: Takanori Suzuki, Fujio Ito, Tadashi Kosaka, Takao Toyooka, Koji Tsuduki, Yasushi Kurihara, Ikuto Kimura
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Patent number: 9774769Abstract: A surface mounted electronic component is provided. The component includes a first and a second connection portion for performing connection to a mounting board. The first connection portion includes a joint region arranged on a lower surface. The second connection portion includes a lower surface region arranged on the lower surface, and a side surface region connected to the lower surface region and arranged on a side surface. In a direction along the side, the lower surface region is arranged apart from the joint region, a length of the lower surface region in the direction is longer than a length of the joint region, a length of the side surface region in the direction is shorter than the length of the lower surface region, and the side surface region is spaced apart from an end of the side surface.Type: GrantFiled: September 29, 2015Date of Patent: September 26, 2017Assignee: CANON KABUSHIKI KAISHAInventors: Takanori Suzuki, Koji Tsuduki, Hisatane Komori, Yasushi Kurihara
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Publication number: 20170150601Abstract: A package includes an insulating member, first electrically conductive members, and a second electrically conductive member. Each of the first electrically conductive members includes a first terminal portion that forms a part of a first surface, and a second terminal portion that is positioned on a side of a side surface with respect to the first terminal portion and forms a part of the side surface. The second electrically conductive member includes an embedded portion embedded in the insulating member, third terminal portions each of which forms a part of the first surface and is connected to the embedded portion, and a fourth terminal portion that forms a part of a second surface and is connected to the embedded portion.Type: ApplicationFiled: November 14, 2016Publication date: May 25, 2017Inventors: Takanori Suzuki, Fujio Ito, Tadashi Kosaka, Takao Toyooka, Koji Tsuduki, Yasushi Kurihara, Ikuto Kimura
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Publication number: 20160366774Abstract: An electronic component including an electronic device and a container accommodating the electronic device. The container includes a base portion including a first surface on which the electronic device is mounted and a second surface on an opposite side of the first surface, an opposing portion opposing the electronic device with a space in between, a frame portion surrounding the space between the base portion and the opposing portion, and a plurality of connecting portions that are positioned on the second surface and positioned in at least an orthographic projection area of the electronic device, the plurality of connecting portions being soldered to a wiring member. In the orthographic projection area of the electronic device, a thickness of the base portion in a central area is smaller than a thickness of the base portion in a peripheral area such that the second surface forms a concave surface.Type: ApplicationFiled: June 8, 2016Publication date: December 15, 2016Inventors: Shin Hasegawa, Fujio Ito, Takanori Suzuki, Takao Toyoka, Tadashi Kosaka, Yasushi Kurihara, Koji Tsuduki
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Publication number: 20160119564Abstract: A surface mounted electronic component is provided. The component includes a first and a second connection portion for performing connection to a mounting board. The first connection portion includes a joint region arranged on a lower surface. The second connection portion includes a lower surface region arranged on the lower surface, and a side surface region connected to the lower surface region and arranged on a side surface. In a direction along the side, the lower surface region is arranged apart from the joint region, a length of the lower surface region in the direction is longer than a length of the joint region, a length of the side surface region in the direction is shorter than the length of the lower surface region, and the side surface region is spaced apart from an end of the side surface.Type: ApplicationFiled: September 29, 2015Publication date: April 28, 2016Inventors: Takanori Suzuki, Koji Tsuduki, Hisatane Komori, Yasushi Kurihara
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Patent number: 9253922Abstract: A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body.Type: GrantFiled: April 24, 2013Date of Patent: February 2, 2016Assignee: Canon Kabushiki KaishaInventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Hisatane Komori, Yasushi Kurihara, Fujio Ito, Kazuya Notsu
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Patent number: 9220172Abstract: A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition ?L, ?F, ?B<?C is satisfied, where ?L is a thermal expansion coefficient of the lid body, ?F is a thermal expansion coefficient of the frame body, ?B is a thermal expansion coefficient of the base body, and ?C is a thermal expansion coefficient of the wiring member.Type: GrantFiled: April 24, 2013Date of Patent: December 22, 2015Assignee: Canon Kabushiki KaishaInventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
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Patent number: 9209330Abstract: A method of manufacturing a semiconductor device including a first member including a chip mounting region and a peripheral region, a semiconductor chip mounted in the chip mounting region, and a second member fixed to the first member to cover the semiconductor chip, includes adhering, to the second member, the peripheral region of the first member in a state that the semiconductor chip is mounted in the chip mounting region, using an adhesive, and generating a stress between the first member and the second member, after the adhesive starts to cure, to locally form a gap in at least one of a portion between the first member and the adhesive, and a portion between the second member and the adhesive.Type: GrantFiled: June 26, 2013Date of Patent: December 8, 2015Assignee: CANON KABUSHIKI KAISHAInventors: Koji Tsuduki, Yasushi Kurihara
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Patent number: 9155212Abstract: A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part.Type: GrantFiled: April 24, 2013Date of Patent: October 6, 2015Assignee: Canon Kabushiki KaishaInventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
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Patent number: 8680669Abstract: An electronic component includes a unit including an electronic device; and an opposite member opposing the electronic device, wherein the unit and the opposite member are bonded together with an adhering member disposed between the unit and the opposite member and having light-cured resin and inorganic particles dispersed in the light-cured resin; and wherein in a particle-diameter distribution of the inorganic particles by volume, a particle diameter having a cumulative value of distribution of 50 is 0.5 ?m or more, and a particle diameter having a cumulative value of distribution of 90% is 5.0 ?m or less.Type: GrantFiled: September 27, 2012Date of Patent: March 25, 2014Assignee: Canon Kabushiki KaishaInventors: Yasushi Kurihara, Koji Tsuduki, Hiroaki Kobayashi
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Publication number: 20140008753Abstract: A method of manufacturing a semiconductor device including a first member including a chip mounting region and a peripheral region, a semiconductor chip mounted in the chip mounting region, and a second member fixed to the first member to cover the semiconductor chip, includes adhering, to the second member, the peripheral region of the first member in a state that the semiconductor chip is mounted in the chip mounting region, using an adhesive, and generating a stress between the first member and the second member, after the adhesive starts to cure, to locally form a gap in at least one of a portion between the first member and the adhesive, and a portion between the second member and the adhesive.Type: ApplicationFiled: June 26, 2013Publication date: January 9, 2014Inventors: Koji Tsuduki, Yasushi Kurihara
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Publication number: 20130286566Abstract: A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part.Type: ApplicationFiled: April 24, 2013Publication date: October 31, 2013Applicant: CANON KABUSHIKI KAISHAInventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
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Publication number: 20130286565Abstract: A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition ?L, ?F, ?B<?C is satisfied, where ?L is a thermal expansion coefficient of the lid body, ?F is a thermal expansion coefficient of the frame body, ?B is a thermal expansion coefficient of the base body, and ?C is a thermal expansion coefficient of the wiring member.Type: ApplicationFiled: April 24, 2013Publication date: October 31, 2013Applicant: CANON KABUSHIKI KAISHAInventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
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Publication number: 20130286592Abstract: A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body.Type: ApplicationFiled: April 24, 2013Publication date: October 31, 2013Applicant: CANON KABUSHIKI KAISHAInventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Hisatane Komori, Yasushi Kurihara, Fujio Ito, Kazuya Notsu
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Patent number: 7679372Abstract: A driver for supplying a test signal to a device under test is shared by a plurality of terminals. In this way, the cost and time required for the test of the device under test can be reduced. A testing apparatus 10 relating to the present invention includes a test signal generating section 130 that generates a test signal to be supplied to a device under test 20, a driver 140 that outputs the test signal, a switch 150 that is disposed on a wire between the driver 140 and a first terminal of the device under test 20, a switch 160 that is disposed on a wire between the driver 140 and a second terminal of the device under test 20, and a connection control section 100 that (i) turns on the switch 150 and turns off the switch 160 when the test signal is supplied to the first terminal of the device under test 20, and (ii) turns off the switch 150 and turns on the switch 160 when the test signal is supplied to the second terminal of the device under test 20.Type: GrantFiled: November 27, 2007Date of Patent: March 16, 2010Assignee: Advantest CorporationInventors: Yasushi Kurihara, Shinya Sato
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Publication number: 20080297165Abstract: A driver for supplying a test signal to a device under test is shared by a plurality of terminals. In this way, the cost and time required for the test of the device under test can be reduced. A testing apparatus 10 relating to the present invention includes a test signal generating section 130 that generates a test signal to be supplied to a device under test 20, a driver 140 that outputs the test signal, a switch 150 that is disposed on a wire between the driver 140 and a first terminal of the device under test 20, a switch 160 that is disposed on a wire between the driver 140 and a second terminal of the device under test 20, and a connection control section 100 that (i) turns on the switch 150 and turns off the switch 160 when the test signal is supplied to the first terminal of the device under test 20, and (ii) turns off the switch 150 and turns on the switch 160 when the test signal is supplied to the second terminal of the device under test 20.Type: ApplicationFiled: November 27, 2007Publication date: December 4, 2008Inventors: Yasushi Kurihara, Shinya Sato
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Patent number: 5956480Abstract: A terminal device for carrying out online processing with a host computer by using information stored in a memory includes a store control unit which receives the information and version information regarding the information from the host computer and stores, in the memory, the information with two copies of the version information attached at the beginning and the end of the information, respectively. The terminal device further includes a check unit which reads and compares the two copies of the version information stored in the memory, and an online processing unit which starts the online processing based on the information stored in the memory if the two copies of the version information are identical. In addition, the terminal device further includes a display unit which displays a message indicating an abnormality of the information if the two copies of the version information are contradictory (not identical).Type: GrantFiled: August 18, 1994Date of Patent: September 21, 1999Assignee: Fujitsu LimitedInventor: Yasushi Kurihara