Abstract: A socket of a connector includes a socket housing, a socket terminal element, and an outer shield element. The socket housing includes a bottom plate, and first and second side wall portions facing each other and provided on an upper surface of the bottom plate. The outer shield element includes a main body portion disposed on an outer surface of the first side wall portion, a contact portion extending from the main body portion to the inner surface of the first side wall portion, and an outer shield terminal portion extending from the main body portion toward the bottom plate. The contact portion is configured to be electrically connected to an outside of the socket housing. The outer shield terminal is electrically connected to the contact portion via the main body portion. This connector suppresses generation of unnecessary radiation and noise, and also suppresses interference between high-frequency signals.

Abstract: According to one embodiment, a sensor includes a base body, a first supporter fixed to the base body, and a first movable part separated from the base body. The first movable part includes a first movable base part supported by the first supporter, a second movable base part connected with the first movable base part, and a first movable beam. The first movable beam includes a first beam, a first movable conductive part, and a first connection region. The first beam includes a first beam portion, a second beam portion, and a third beam portion between the first beam portion and the second beam portion. The first beam portion is connected with the first movable base part. The second beam portion is connected with the second movable base part. The first connection region connects the third beam portion and the first movable conductive part.

Abstract: A method for manufacturing a semiconductor device includes forming, on first and second impurity layers on a termination region side, an insulating layer, forming a first metal film and a second metal film in this order on the insulating layer and a drift layer, performing dry etching on the first and second metal films all together so that a position of a first end of a metallized layer, which is a remaining part of the first metal film, in the interface region on the termination region side and a position of a second end of an electrode, which is a remaining part of the second metal film, in the interface region on the terminal region side are the same in plan view. The first and second ends are closer to the active region than an end of the second impurity layer on the termination region side in plan view.

Abstract: According to one embodiment, a sensor includes a base body including a first surface including first and second base body regions, a first structure body provided in the first base body region, a second structure body provided in the second base body region, and a control device. The first structure body includes a first movable member configured to vibrate. The vibration of the first movable member includes first and second components. The second structure body includes a second movable member configured to vibrate. The control device includes a controller configured to perform a processing operation. The processing operation includes outputting a second rotation angle, The second rotation angle is obtained by correcting a first rotation angle based on a resonance frequency of the second movable member. The first rotation angle of the first movable member is obtained based on the first component and the second component.

Abstract: The present invention provides a heterocyclic compound having an orexin type 2 receptor agonist activity. A compound represented by the formula (I): wherein each symbol is as described in the specification, or a salt thereof, is useful as an agent for the prophylaxis or treatment of narcolepsy.

Abstract: A semiconductor device includes an insulating layer provided on a first impurity layer and a second impurity layer on a termination region side, a metallized layer provided on the first impurity layer and the second impurity layer exposed from the insulating layer and on the insulating layer, and an electrode provided on the metallized layer. A position of a first end of the metallized layer on the termination region side and a position of a second end of the electrode on the termination region side are the same in plan view.

Abstract: According to one embodiment, a sensor includes a sensor part. The sensor part includes a supporter and a movable part. The movable part includes a movable member located around the supporter in a first plane, and a plurality of structure members located between the supporter and the movable member. The structure members have bent shapes. The structure members connect the movable member with the supporter. The movable member is capable of vibrating. The movable part has the supporter as a center of rotational symmetry. The movable part has a plurality of mirror planes. The mirror planes pass through the center of the rotational symmetry and cross the first plane.

Abstract: According to one embodiment, a sensor includes a sensor part including first and second sensor elements, and a circuit part. The first sensor element includes a first supporter, a first movable part capable of vibrating, first and second electrodes. The first electrode outputs a first signal corresponding to a vibration of the first movable part. The second electrode outputs a second signal corresponding to the vibration of the first movable part. The second sensor element includes a second supporter, a second movable part capable of vibrating, third and fourth electrodes. The third electrode outputs a third signal corresponding to a vibration of the second movable part. The fourth electrode outputs a fourth signal corresponding to the vibration of the second movable part. The circuit part includes a calculator. The calculator outputs a differential operation result between first and second processing signals.

Abstract: According to one embodiment, a sensor includes a first detection element. The first detection element includes a base body, a first support member fixed to the base body, a conductive first movable member, and a first conductive part fixed to the base body. The first movable member includes first, second, third, fourth and fifth movable parts. In a second direction crossing a first direction from the base body toward the first movable member, the third movable part is between the first and second movable parts. In the second direction, the fourth movable part is between the first and third movable parts. In the second direction, the fifth movable part is between the third and second movable parts. The first movable part is supported by the first support member. The second, third, fourth and fifth movable parts are separated from the base body.

Abstract: [Problem] To provide a chain link which can improve wear resistance even under lubricating conditions in adhesive mode. [Solution] Steel link plates 2 for a silent chain having pinholes 22 for inserting linking pins 3 are formed. A hardened layer obtained by performing heat treatment (martempering, for example) is formed on the inner circumferential surface of the pinholes 22, and a large number of hard particles hp having the same hardness as or a greater hardness than the surface hardness of said hardened layer are dotted in a crystalline state within the martensite structure on the surface layer section of the hardened layer. The hard particles hp are an oxide, carbide or nitride of any element from Cr, V, Ti and Nb which was originally present in the steel of the link plate material.

Abstract: Problem. To provide a chain pin which makes it possible to improve wear resistance even in an environment in which degraded oil is used. Solution. A large number of pins are mixed/agitated together with a particle mixture including a penetrant comprising chromium (Cr) powder and tungsten carbide (WC) powder, and an iron chloride (FeCl3) catalyst, and WC particles penetrate the surface of the pins together with chromium carbide (CrC). As a result, a chromium carbide layer in which WC particles are diffused in a CrC layer (CrC—WC layer) is formed on the outermost surface part of the steel forming the parent material of the pins.

Abstract: [Problem] To provide a chain link which can improve wear resistance even under lubricating conditions in adhesive mode. [Solution] Steel link plates 2 for a silent chain having pinholes 22 for inserting linking pins 3 are formed. A hardened layer obtained by performing heat treatment (martempering, for example) is formed on the inner circumferential surface of the pinholes 22, and a large number of hard particles hp having the same hardness as or a greater hardness than the surface hardness of said hardened layer are dotted in a crystalline state within the martensite structure on the surface layer section of the hardened layer. The hard particles hp are an oxide, carbide or nitride of any element from Cr, V, Ti and Nb which was originally present in the steel of the link plate material.

Abstract: Problem. To provide a chain pin which makes it possible to improve wear resistance even in an environment in which degraded oil is used. Solution. A large number of pins are mixed/agitated together with a particle mixture including a penetrant comprising chromium (Cr) powder and tungsten carbide (WC) powder, and an iron chloride (FeCl3) catalyst, and WC particles penetrate the surface of the pins together with chromium carbide (CrC). As a result, a chromium carbide layer in which WC particles are diffused in a CrC layer (CrC—WC layer) is formed on the outermost surface part of the steel forming the parent material of the pins.

Abstract: Novel pyrrolopyrimidines as shown in formula (I): and pharmaceutically acceptable derivatives thereof. The compounds are useful in the inhibition of IGF-1R.

Abstract: Novel pyrrolopyrimidines as shown in formula (I): and pharmaceutically acceptable derivatives thereof. The compounds are useful in the inhibition of IGF-1R.

Abstract: This invention relates to newly identified compounds for treating and preventing tumors and cancers, and methods for treating proliferative diseases associated with the imbalance or inappropriate activity of tyrosine kinases implicated in proliferative diseases.

Abstract: Furo- and thienopyrimidine derivatives, which are useful as TIE-2 and/or VEGFR-2 inhibitors are described herein. The described invention also includes methods of making such furo- and thienopyrimidine derivatives as well as methods of using the same in the treatment of hyperproliferative diseases.

Abstract: Furo- and thienopyrimidine derivatives, which are useful as TIE-2 and/or VEGFR-2 inhibitors are described herein. The described invention also includes methods of making such furo- and thienopyrimidine derivatives as well as methods of using the same in the treatment of hyperproliferative diseases.

Abstract: This invention relates to newly identified compounds for treating and preventing tumors and cancers, and methods for treating proliferative diseases associated with the imbalance or inappropriate activity of tyrosine kinases implicated in proliferative diseases.

Abstract: Furo- and thienopyrimidine derivatives, which are useful as TIE-2 and/or VEGFR-2 inhibitors are described herein. The described invention also includes methods of making such furo- and thienopyrimidine derivatives as well as methods of using the same in the treatment of hyperproliferative diseases.