Patents by Inventor Yasuto Ishimaru

Yasuto Ishimaru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070023876
    Abstract: To provide a TAB tape carrier that can provide improved adhesion of a conductive pattern to an insulating base layer, while strengthening a connection between gold terminals of a semiconductor device and connection terminals covered with a tin plating layer, and can prevent the conductive pattern from sinking into the insulating base layer. In the TAB tape carrier, an insulating base layer is formed by laminating a thermoplastic polyimide resin layer of 4 ?m thick or less on a thermosetting polyimide resin layer, and a conductive pattern having inner leads covered with a tin plating layer is formed on a surface of the thermoplastic polyimide resin layer. In this TAB tape carrier, even when the gold terminals of the semiconductor device are press-bonded to the inner leads covered with the tin plating layer at high temperatures and pressures, the conductive pattern can be prevented from sinking into the insulating base layer.
    Type: Application
    Filed: July 25, 2006
    Publication date: February 1, 2007
    Applicant: Nitto Denko Corporation
    Inventors: Kei Nakamura, Yasuto Ishimaru
  • Publication number: 20070000689
    Abstract: In an outer lead portion, outer lead wirings are provided on one surface of a base insulating layer and a plurality of metal substrates are provided on the opposite surface thereof. The plurality of metal substrates are provided with predetermined spacings therebetween. The outer lead wirings are not provided on the areas on the surface opposite to the areas on the other surface of the base insulating layer on which the slits are provided between the metal substrates. Metals such as stainless steel, copper or copper alloy can be used for the metal substrates. Coefficient of linear expansion of each metal substrate is preferably equal to that of the base insulating layer.
    Type: Application
    Filed: June 29, 2006
    Publication date: January 4, 2007
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yasuto ISHIMARU, Kei NAKAMURA
  • Patent number: 7087844
    Abstract: The width of a particular part (A) of a strip conductor 2 of a wiring circuit board for mounting is reduced, wherein the strip conductor is exposed to form a stripe pattern, so that individual conductor can be connected to electrode E of an electronic component. The particular part (A) is one section in the longitudinal direction of a strip conductor having a long end, which part includes an area overlapping an electrode which is connected to a short end and transferred in parallel in the strip width direction up to the position on the strip conductor having a long end. Due to this constitution, a structure capable of suppressing a short circuit between an electrode and a wiring pattern can be afforded to a wiring circuit board, even to an electronic component having an electrode formed in high-density and in a zigzag arrangement pattern, which comprises an area overlapping an electrode.
    Type: Grant
    Filed: December 16, 2004
    Date of Patent: August 8, 2006
    Assignee: Nitto Denko Corporation
    Inventors: Yasuto Ishimaru, Kensuke Nishi, Hiroshi Yamazaki
  • Patent number: 7075017
    Abstract: At least a particular part of a strip conductor 2 of a wiring circuit board for mounting, wherein the strip conductor is exposed to form a stripe pattern, so that individual conductor can be connected to electrode E of an electronic component, is covered with a solder resist 3. The particular part is one section in the longitudinal direction of a strip conductor having a long end, which section includes an area overlapping an electrode which is connected to a short end and transferred in parallel in the strip width direction up to the position on the strip conductor having a long end. As a result, a structure capable of suppressing a short circuit between an electrode and a wiring pattern can be afforded to a wiring circuit board, even to an electronic component having an electrode formed in high-density and in a zigzag arrangement pattern, which comprises an area overlapping an electrode.
    Type: Grant
    Filed: December 16, 2004
    Date of Patent: July 11, 2006
    Assignee: Nitto Denko Corporation
    Inventors: Kensuke Nishi, Yasuto Ishimaru
  • Publication number: 20050139371
    Abstract: The width of a particular part (A) of a strip conductor 2 of a wiring circuit board for mounting is reduced, wherein the strip conductor is exposed to form a stripe pattern, so that individual conductor can be connected to electrode E of an electronic component. The particular part (A) is one section in the longitudinal direction of a strip conductor having a long end, which part includes an area overlapping an electrode which is connected to a short end and transferred in parallel in the strip width direction up to the position on the strip conductor having a long end. Due to this constitution, a structure capable of suppressing a short circuit between an electrode and a wiring pattern can be afforded to a wiring circuit board, even to an electronic component having an electrode formed in high-density and in a zigzag arrangement pattern, which comprises an area overlapping an electrode.
    Type: Application
    Filed: December 16, 2004
    Publication date: June 30, 2005
    Applicant: Nitto Denko Corporation
    Inventors: Yasuto Ishimaru, Kensuke Nishi, Hiroshi Yamazaki
  • Publication number: 20050139387
    Abstract: At least a particular part of a strip conductor 2 of a wiring circuit board for mounting, wherein the strip conductor is exposed to form a stripe pattern, so that individual conductor can be connected to electrode E of an electronic component, is covered with a solder resist 3. The particular part is one section in the longitudinal direction of a strip conductor having a long end, which section includes an area overlapping an electrode which is connected to a short end and transferred in parallel in the strip width direction up to the position on the strip conductor having a long end. As a result, a structure capable of suppressing a short circuit between an electrode and a wiring pattern can be afforded to a wiring circuit board, even to an electronic component having an electrode formed in high-density and in a zigzag arrangement pattern, which comprises an area overlapping an electrode.
    Type: Application
    Filed: December 16, 2004
    Publication date: June 30, 2005
    Applicant: Nitto Denko Corporation
    Inventors: Kensuke Nishi, Yasuto Ishimaru