Patents by Inventor Yasuyoshi Hirai

Yasuyoshi Hirai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6992383
    Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: January 31, 2006
    Assignee: Denso Corporation
    Inventors: Kuniaki Mamitsu, Yasuyoshi Hirai
  • Patent number: 6967404
    Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: November 22, 2005
    Assignee: Denso Corporation
    Inventors: Kuniaki Mamitsu, Yasuyoshi Hirai
  • Patent number: 6960825
    Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: November 1, 2005
    Assignee: Denso Corporation
    Inventors: Kuniaki Mamitsu, Yasuyoshi Hirai
  • Publication number: 20050167821
    Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.
    Type: Application
    Filed: November 4, 2003
    Publication date: August 4, 2005
    Inventors: Kuniaki Mamitsu, Yasuyoshi Hirai
  • Patent number: 6891265
    Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: May 10, 2005
    Assignee: Denso Corporation
    Inventors: Kuniaki Mamitsu, Yasuyoshi Hirai
  • Patent number: 6798062
    Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: September 28, 2004
    Assignee: Denso Corporation
    Inventors: Kuniaki Mamitsu, Yasuyoshi Hirai
  • Publication number: 20040097082
    Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.
    Type: Application
    Filed: November 4, 2003
    Publication date: May 20, 2004
    Inventors: Kuniaki Mamitsu, Yasuyoshi Hirai, Kazuhito Nomura, Yutaka Fukuda, Kazuo Kajimoto, Takeshi Miyajima, Tomoatsu Makino, Yoshimi Nakase
  • Publication number: 20040089940
    Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.
    Type: Application
    Filed: November 4, 2003
    Publication date: May 13, 2004
    Inventors: Kuniaki Mamitsu, Yasuyoshi Hirai
  • Publication number: 20040089942
    Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.
    Type: Application
    Filed: November 4, 2003
    Publication date: May 13, 2004
    Inventors: Kuniaki Mamitsu, Yasuyoshi Hirai
  • Publication number: 20040070072
    Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.
    Type: Application
    Filed: November 4, 2003
    Publication date: April 15, 2004
    Inventors: Kuniaki Mamitsu, Yasuyoshi Hirai
  • Publication number: 20040070060
    Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.
    Type: Application
    Filed: November 4, 2003
    Publication date: April 15, 2004
    Inventors: Kuniaki Mamitsu, Yasuyoshi Hirai
  • Patent number: 6703707
    Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.
    Type: Grant
    Filed: November 22, 2000
    Date of Patent: March 9, 2004
    Assignee: Denso Corporation
    Inventors: Kuniaki Mamitsu, Yasuyoshi Hirai, Kazuhito Nomura, Yutaka Fukuda, Kazuo Kajimoto, Takeshi Miyajima, Tomoatsu Makino, Yoshimi Nakase
  • Patent number: 6380622
    Abstract: A pressed-contact type semiconductor device in which a main electrode surface of a semiconductor element is contacted with an electrode plate by a pressed-contact, which can reduce both an electric resistance and a thermal resistance between the main electrode surface of the semiconductor element and the electrode plate. The pressed-contact type semiconductor device (100) is provided with a semiconductor element (1) having electrode surfaces, a pair of electrode plates (2) contacted with the electrode surfaces by the pressed-contact, a pair of insulating plates (3) contacted with the outer side of the pair of the electrode plates by the pressed-contact, and a pair of radiating plates (4) contacted with the outer side of the pair of the insulating plates by the pressed-contact. A contact intermediary member (5), which is made up of particle member having at least thermal conductivity and electric conductivity, is intercalated between the semiconductor element and the electrode plate.
    Type: Grant
    Filed: November 8, 1999
    Date of Patent: April 30, 2002
    Assignee: Denso Corporation
    Inventors: Yasuyoshi Hirai, Kazuhito Nomura, Tomoatsu Makino, Takahiko Yoshida, Masahiro Shiozawa, Atsushi Hashikawa, Muneo Yorinaga