Patents by Inventor Yasuyoshi Hirai
Yasuyoshi Hirai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6992383Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.Type: GrantFiled: November 4, 2003Date of Patent: January 31, 2006Assignee: Denso CorporationInventors: Kuniaki Mamitsu, Yasuyoshi Hirai
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Patent number: 6967404Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.Type: GrantFiled: November 4, 2003Date of Patent: November 22, 2005Assignee: Denso CorporationInventors: Kuniaki Mamitsu, Yasuyoshi Hirai
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Patent number: 6960825Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.Type: GrantFiled: November 4, 2003Date of Patent: November 1, 2005Assignee: Denso CorporationInventors: Kuniaki Mamitsu, Yasuyoshi Hirai
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Publication number: 20050167821Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.Type: ApplicationFiled: November 4, 2003Publication date: August 4, 2005Inventors: Kuniaki Mamitsu, Yasuyoshi Hirai
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Patent number: 6891265Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.Type: GrantFiled: November 4, 2003Date of Patent: May 10, 2005Assignee: Denso CorporationInventors: Kuniaki Mamitsu, Yasuyoshi Hirai
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Patent number: 6798062Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.Type: GrantFiled: November 4, 2003Date of Patent: September 28, 2004Assignee: Denso CorporationInventors: Kuniaki Mamitsu, Yasuyoshi Hirai
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Publication number: 20040097082Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.Type: ApplicationFiled: November 4, 2003Publication date: May 20, 2004Inventors: Kuniaki Mamitsu, Yasuyoshi Hirai, Kazuhito Nomura, Yutaka Fukuda, Kazuo Kajimoto, Takeshi Miyajima, Tomoatsu Makino, Yoshimi Nakase
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Publication number: 20040089940Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.Type: ApplicationFiled: November 4, 2003Publication date: May 13, 2004Inventors: Kuniaki Mamitsu, Yasuyoshi Hirai
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Publication number: 20040089942Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.Type: ApplicationFiled: November 4, 2003Publication date: May 13, 2004Inventors: Kuniaki Mamitsu, Yasuyoshi Hirai
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Publication number: 20040070060Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.Type: ApplicationFiled: November 4, 2003Publication date: April 15, 2004Inventors: Kuniaki Mamitsu, Yasuyoshi Hirai
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Publication number: 20040070072Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.Type: ApplicationFiled: November 4, 2003Publication date: April 15, 2004Inventors: Kuniaki Mamitsu, Yasuyoshi Hirai
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Patent number: 6703707Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.Type: GrantFiled: November 22, 2000Date of Patent: March 9, 2004Assignee: Denso CorporationInventors: Kuniaki Mamitsu, Yasuyoshi Hirai, Kazuhito Nomura, Yutaka Fukuda, Kazuo Kajimoto, Takeshi Miyajima, Tomoatsu Makino, Yoshimi Nakase
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Patent number: 6380622Abstract: A pressed-contact type semiconductor device in which a main electrode surface of a semiconductor element is contacted with an electrode plate by a pressed-contact, which can reduce both an electric resistance and a thermal resistance between the main electrode surface of the semiconductor element and the electrode plate. The pressed-contact type semiconductor device (100) is provided with a semiconductor element (1) having electrode surfaces, a pair of electrode plates (2) contacted with the electrode surfaces by the pressed-contact, a pair of insulating plates (3) contacted with the outer side of the pair of the electrode plates by the pressed-contact, and a pair of radiating plates (4) contacted with the outer side of the pair of the insulating plates by the pressed-contact. A contact intermediary member (5), which is made up of particle member having at least thermal conductivity and electric conductivity, is intercalated between the semiconductor element and the electrode plate.Type: GrantFiled: November 8, 1999Date of Patent: April 30, 2002Assignee: Denso CorporationInventors: Yasuyoshi Hirai, Kazuhito Nomura, Tomoatsu Makino, Takahiko Yoshida, Masahiro Shiozawa, Atsushi Hashikawa, Muneo Yorinaga