Abstract: A first conductive plate (31A) constituting the radiation surface of a slot antenna (30A) inclines with respect to a first dielectric member (13) opposed to the radiation surface of the slot antenna (30A). Consequently, a plasma generated by the electric field of an electromagnetic field entering directly from the slot antenna (30A) can be set dominant over a plasma generated by the electric field of a standing wave formed in a processing vessel (11). Since the former can be controlled more easily than the latter, the plasma distribution can be improved.

Abstract: The length (L) of a slot (26) increases monotonously from the central portion (A) of an antenna surface (28) in the radial direction, and reaches the maximal value at the first intermediate portion (C). The maximal value is maintained from the first intermediate portion (C) until the peripheral portion (B). When compared to a case wherein the length of the slot is increased monotonously from the central portion of the antenna surface (28) until its peripheral portion, the power radiated from a slot antenna can increase. Accordingly, the power which is not radiated from the slot antenna but remains in it decreases, so that the reflected power from the slot antenna decreases.

Abstract: A plasma processing apparatus, comprising: at least, a plasma processing chamber for processing therein an object to be processed; antenna means for guiding microwaves into the plasma processing chamber; and a dielectric member disposed between the antenna means and the plasma processing chamber; wherein a surface of the dielectric member facing the inside of the plasma processing chamber has a projecting shape.

Abstract: A plasma processing apparatus that generates a uniform plasma, thus allowing uniform processing of large-diameter wafers. The cylindrical apparatus includes a wafer mounting table, a silica plate providing an airtight seal, a microwave supplier for propagating a microwave in TE11-mode, and a cylindrical waveguide connected at one end to the microwave supplier. A radial waveguide box is connected between the other end of the cylindrical waveguide and the silica plate. The radial waveguide box extends radially outward from the cylindrical waveguide, forming a flange and defining an interior waveguide space. A disc-shaped slot antenna is located at the lower end of the radial waveguide box, above the silica plate. A circularly-polarized wave converter disposed in the cylindrical waveguide rotates the TE11-mode microwave about the axis of the cylindrical waveguide, and sends the rotating microwave to the radial waveguide box.

Abstract: A plasma processing apparatus that generates a uniform plasma, thus allowing uniform processing of large-diameter wafers. The cylindrical apparatus includes a wafer mounting table, a silica plate providing an airtight seal, a microwave supplier for propagating a microwave in TE11 mode, and a cylindrical waveguide connected at one end to the microwave supplier. A radial waveguide box is connected between the other end of the cylindrical waveguide and the silica plate. The radial waveguide box extends radially outward from the cylindrical waveguide, forming a flange and defining an interior waveguide space. A disc-shaped slot antenna is located at the lower end of the radial waveguide box, above the silica plate. A circularly-polarized wave converter disposed in the cylindrical waveguide rotates the TE11-mode microwave about the axis of the cylindrical waveguide, and sends the rotating microwave to the radial waveguide box.

Abstract: A apparatus includes a waveguide (21) including a first conductive plate (23) having a plurality of slots (26) and a second conductive plate (22) arranged opposite to the former plate, a cylindrical waveguide (13) connected to an opening of the second conductive plate (22), and a bump (27) provided on the first conductive plate (23) and projecting toward the opening (25) of the second conductive plate (22). At least part of the bump (27) is made of a dielectric. The cylindrical waveguide (13) larger in characteristic impedance than in a coaxial waveguide is used to generally reduce a transmission loss. The bump (27) can reduce power reflection at the connecting portion of the cylindrical waveguide (13) and waveguide (21). A transmission loss and power reflection thus reduced can enhance an electromagnetic field supply efficiency.

Abstract: An electromagnetic wave absorber (4) of a material that causes a large dielectric or magnetic loss is disposed so as to surround a region between a high-frequency wave transmitting window (3) and an antenna (32) to suppress the formation of a sanding wave by suppressing the reflection of microwaves.

Abstract: A plasma processing apparatus, comprising: at least, a plasma processing chamber for processing therein an object to be processed; antenna means for guiding microwaves into the plasma processing chamber; and a dielectric member disposed between the antenna means and the plasma processing chamber; wherein a surface of the dielectric member facing the inside of the plasma processing chamber has a projecting shape.

Abstract: A radial antenna (30) for supplying an electromagnetic field into a processing vessel has slots (36) that are arranged along a spiral line having an interval d of approximately N times (N is a natural number) a wavelength &lgr;g of the electromagnetic field within the radial antenna (30). The electromagnetic field is fed from the center of the radial antenna (30) in a rotational mode.

Abstract: An electromagnetic wave absorber (4) of a material that causes a large dielectric or magnetic loss is disposed so as to surround a region between a high-frequency wave transmitting window (3) and an antenna (32) to suppress the formation of a sanding wave by suppressing the reflection of microwaves.

Abstract: A plasma processing apparatus has a process container, a carriage housed in the process container and having a surface for carrying an object to be processed, and a slot antenna disposed to oppose the carrying surface of the carriage and having a radiation plane formed with a plurality of slots so as to radiate electromagnetic fields to the inside of the process container through the plurality of slots. The slot antenna radiates the electromagnetic fields in a direction oblique to the normal direction of the radiation plane.

Abstract: A plasma processing apparatus includes a processing container 53 whose interior has a mount table 10, a glass plate 8 for covering an upper opening of the processing container 53, a microwave supplier 50, a coaxial waveguide 52 having its end connected with the microwave supplier 50 to have an inner conductor 52B and an outer conductor 52A, a radial waveguide box 54 connected to the other end of the outer conductor 52A of the coaxial waveguide 52 and formed to expand from the other end of the outer conductor 52A outward in the radial direction and subsequently extend downward, a disc-shaped antenna member 60 for covering a lower opening of the radial waveguide box 54, the antenna member 60 having its central part connected with the other end of the inner conductor 52B, and a metallic reflector 64 arranged on the opposite side of the antenna member's part connected with the inner conductor 52B, for reflecting ah electric field reflected by an inner wall of the processing container 4.

Abstract: A plasma-assisted processing system has a lifting mechanism capable of vertically moving a microwave power unit and a waveguide to adjust the level of a planar slot antenna disposed on an expanded lower end part of the waveguide. A space extending under the antenna is surrounded by a shielding member. An optical sensor having an array of photosensors is disposed on the outer side of a window formed in the side wall of a vacuum vessel to monitor the lower limit level of a cease region for a plasma (cease level). An ideal distance between the cease level and the antenna is determined beforehand and the level of the antenna is adjusted on the basis of a measured cease level so that the antenna is spaced the ideal distance apart from the cease level. Since the difference between the cease level and a level X0 for the cutoff density of an X-wave is fixed, the level X0 may be monitored instead of the cease level.

Abstract: A plasma processing system may include a vacuum vessel, a substrate table arranged in the vacuum vessel, and a radio-frequency power supply system for generating high-frequency waves. A waveguide may be provided for guiding high-frequency waves into the vacuum vessel, and a dielectric member may be arranged at an end portion of the waveguide. The plasma processing system may also include a conductive film arranged on the dielectric member and facing the substrate table, wherein the conductive film may have a thickness smaller than or approximately equal to a skin thickness of the conductive film.

Abstract: A first conductive plate (31A) constituting the radiation surface of a slot antenna (30A) inclines with respect to a first dielectric member (13) opposed to the radiation surface of the slot antenna (30A). Consequently, a plasma generated by the electric field of an electromagnetic field entering directly from the slot antenna (30A) can be set dominant over a plasma generated by the electric field of a standing wave formed in a processing vessel (11). Since the former can be controlled more easily than the latter, the plasma distribution can be improved.

Abstract: A plasma-assisted processing system has a lifting mechanism capable of vertically moving a microwave power unit and a waveguide to adjust the level of a planar slot antenna disposed on an expanded lower end part of the waveguide. A space extending under the antenna is surrounded by a shielding member. An optical sensor having an array of photosensors is disposed on the outer side of a window formed in the side wall of a vacuum vessel to monitor the lower limit level of a cease region for a plasma (cease level). An ideal distance between the cease level and the antenna is determined beforehand and the level of the antenna is adjusted on the basis of a measured cease level so that the antenna is spaced the ideal distance apart from the cease level. Since the difference between the cease level and a level X0 for the cutoff density of an X-wave is fixed, the level X0 may be monitored instead of the cease level.

Abstract: A plasma processing apparatus includes a processing container 53 whose interior has a mount table 10, a glass plate 8 for covering an upper opening of the processing container 53, a microwave supplier 50, a coaxial waveguide 52 having its end connected with the microwave supplier 50 to have an inner conductor 52B and an outer conductor 52A, a radial waveguide box 54 connected to the other end of the outer conductor 52A of the coaxial waveguide 52 and formed to expand from the other end of the outer conductor 52A outward in the radial direction and subsequently extend downward, a disc-shaped antenna member 60 for covering a lower opening of the radial waveguide box 54, the antenna member 60 having its central part connected with the other end of the inner conductor 52B, and a metallic reflector 64 arranged on the opposite side of the antenna member's part connected with the inner conductor 52B, for reflecting ah electric field reflected by an inner wall of the processing container 4.

Abstract: A plasma-assisted processing system has a lifting mechanism capable of vertically moving a microwave power unit and a waveguide to adjust the level of a planar slot antenna disposed on an expanded lower end part of the waveguide. A space extending under the antenna is surrounded by a shielding member. An optical sensor having an array of photosensors is disposed on the outer side of a window formed in the side wall of a vacuum vessel to monitor the lower limit level of a cease region for a plasma (cease level). An ideal distance between the cease level and the antenna is determined beforehand and the level of the antenna is adjusted on the basis of a measured cease level so that the antenna is spaced the ideal distance apart from the cease level. Since the difference between the cease level and a level X0 for the cutoff density of an X-wave is fixed, the level X0 may be monitored instead of the cease level.

Abstract: A plasma processing apparatus includes a processing container whose interior has a mount table, a glass plate for covering an upper opening of the processing container, a microwave supplier, a coaxial waveguide having its end connected with the microwave supplier to have an inner conductor and an outer conductor, a radial waveguide box connected to the other end of the outer conductor of the coaxial waveguide to expand from the other end of the outer conductor outward in the radial direction and extend downward, a disc-shaped antenna member for covering a lower opening of the radial waveguide box having its central part connected with the other end of the inner conductor, and a metallic reflector on the opposite side of the antenna member's part connected with the inner conductor.

Abstract: A plasma processing apparatus is provided. The plasma processing apparatus can generate a uniform plasma in a processing container to perform a uniform processing on even a large-diameter wafer. The apparatus includes a processing container 4 shaped to be a cylinder with a bottom and accommodating amounting table 10 for mounting a wafer W thereon, a silica plate 8 for covering an upper opening of the processing container 4 in an airtight manner, a microwave supplier 50 for supplying a microwave in TE11 mode and a cylindrical waveguide 52 having one end connected to the microwave supplier 50 to extend toward the silica plate 8 and also having an interior waveguide space. The apparatus further includes a radial waveguide box 54 connected to the other end of the cylindrical waveguide 52.