Patents by Inventor Yasuyuki Nakajima
Yasuyuki Nakajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20040142551Abstract: Provided is a semiconductor device comprising a first metal film formed above a semiconductor chip, a ball portion formed over said first metal film and made of a second metal, and an alloy layer of said first metal and said second metal which alloy layer is formed between said first metal film and said ball portion, wherein said alloy layer reaches the bottom of said first metal film, and said ball portion is covered with a resin; and a manufacturing method thereof. The present invention makes it possible to improve adhesion between the bonding pad portion and ball portion of a bonding wire over an interconnect, thereby improving the reliability of the semiconductor device.Type: ApplicationFiled: April 8, 2003Publication date: July 22, 2004Applicant: Hitachi, Ltd.Inventors: Yasuyuki Nakajima, Toshiaki Morita, Tomoo Matsuzawa, Seiichi Tomoi, Naoki Watanabe
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Publication number: 20040091044Abstract: The picture input section 12 fetches image data from the storage device 11, and then, inputs image data on sequential n images into the section 13 for measuring correlation between sequential images and the section 14 for measuring correlation between sampled images. The section 13 for measuring correlation between sequential images measures the correlation between sequential images based on video data. The section 14 for measuring correlation between sampled images measures the correlation between sub-sampled images. The short shot determining section 15 determines short cut points by using the correlation between the sequential images and the correlation between the sub-sampled images. Otherwise, short cut points may be determined in consideration of motion amount between the sequential images or the sub-sampled images.Type: ApplicationFiled: August 15, 2003Publication date: May 13, 2004Applicant: KDDI CORPORATIONInventors: Yasuyuki Nakajima, Masaru Sugano, Hiromasa Yanagihara
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Publication number: 20030230809Abstract: A highly reliable semiconductor device provided herein can prevent a junction between a pad and a wire from coming off, and pads from peeling off an underlying insulating layer on the interface thereof. The semiconductor device has plugs formed in a region in which an electrode pad is formed over a substrate. The plugs protrude into the electrode pad.Type: ApplicationFiled: January 9, 2003Publication date: December 18, 2003Applicants: Hitachi, Ltd., Hitachi ULSI Systems Co., Ltd.Inventors: Takashi Nakajima, Naotaka Tanaka, Yasuyuki Nakajima, Ryo Haruta, Tomoo Matsuzawa, Masashi Sahara, Ken Okutani
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Publication number: 20030222974Abstract: A video acquired by a video acquiring section of a video sender terminal is subjected to coding such as MPEG or the like by a video coding section, and the coded video is transmitted to a video receiver terminal through a communication line. In the video receiver side, the received video is decoded and displayed on a video display section. In the video receiver terminal, when a still picture acquiring instruction is made, time information is acquired from a video decoding section and transmitted to a still picture acquiring section of the video sender terminal. The still picture acquiring section reads a still picture at the same time from a video storing section, performs still picture coding such as JPEG to the still picture, and transmits the coded still picture to the video receiver terminal. In the video receiver terminal, the still picture is decoded and displayed on a still picture display section. As a result, the video receiver terminal can acquire a still picture having high quality.Type: ApplicationFiled: May 22, 2003Publication date: December 4, 2003Applicant: KDDI CorporationInventors: Akio Yoneyama, Yasuyuki Nakajima, Hiromasa Yanagihara
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Publication number: 20030218245Abstract: A semiconductor device comprising a plurality of wires for electrically connecting a plurality of electrode pads arranged on a main surface of a semiconductor chip along one side of the semiconductor chip to a plurality of connecting portions arranged on the main surface of a wiring substrate along one side of the semiconductor chip, respectively, wherein second wires out of the plural wires consisting of first and second wires adjacent to each other have a larger loop height than the first wires, one end portions of the second wires are connected to the electrode pads at positions farther from one side of the semiconductor chip than the one end portions of the first wires, and the other end portions of the second wires are connected to the connecting portions at positions farther from one side of the semiconductor chip than the other end portions of the first wires.Type: ApplicationFiled: May 7, 2003Publication date: November 27, 2003Applicants: Hitachi, Ltd., Hitachi ULSI Systems Co., Ltd.Inventors: Tomoo Matsuzawa, Takafumi Nishita, Yasuyuki Nakajima, Toshiaki Morita
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Publication number: 20030174770Abstract: Provided is a transcoder for coded video the encoding mode of that is changed according to the coded data, itself, that has been compressed by transcoding, or information prepared by decoding only a part thereof. A coded data extractor partially decodes DV coded data (a) that has been input, and sends DCT coefficients (b) to an approximate image generator and to a decoder, and outputs quantization parameters (c) to a first motion vector detector. The approximate image generator generates an approximate image according to a part of the DCT coefficients (b). A first motion vector detector roughly detects motion vector candidates (e). A second motion vector detector, using the motion vector candidates (e) as an initial position, hierarchically detects a motion vector (f).Type: ApplicationFiled: March 11, 2003Publication date: September 18, 2003Applicant: KDDI CORPORATIONInventors: Haruhisa Kato, Yasuyuki Nakajima
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Publication number: 20030168740Abstract: Provided is a semiconductor device comprising a first metal film formed above a semiconductor chip, a ball portion formed over said first metal film and made of a second metal, and an alloy layer of said first metal and said second metal which alloy layer is formed between said first metal film and said ball portion, wherein said alloy layer reaches the bottom of said first metal film, and said ball portion is covered with a resin; and a manufacturing method thereof. The present invention makes it possible to improve adhesion between the bonding pad portion and ball portion of a bonding wire over an interconnect, thereby improving the reliability of the semiconductor device.Type: ApplicationFiled: February 21, 2003Publication date: September 11, 2003Inventors: Yasuyuki Nakajima, Toshiaki Morita, Tomoo Matsuzawa, Seiichi Tomoi, Naoki Kawanabe
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Publication number: 20030153134Abstract: A method for manufacturing a semiconductor device including providing first and second semiconductor chips each having a main surface having a semiconductor element and a plurality of external terminals, and a lower surface respectively opposing the main surface. A first lead frame is provided which has a frame body which supports outer portions and inner portions extending from the outer portions, and a second lead frame is provided which has a frame body which supports outer portions and inner portions extending from the outer portions. After electrically connecting the external terminals to the inner portions of the lead frames and resin-sealing the first and second semiconductor chips so that the first and second lead frames are superimposed, the frame body of the second lead frame is removed and a first processing fluid is applied to the outer portions of the first lead frame and the second lead frame.Type: ApplicationFiled: February 27, 2003Publication date: August 14, 2003Inventors: Youichi Kawata, Kouji Koizumi, Michiaki Sugiyama, Atsushi Fujishima, Yasuyuki Nakajima, Takatoshi Hagiwara
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Publication number: 20030152032Abstract: This invention provides a video information transmission apparatus for efficiently transmitting a digital video such as MPEG video at real time while controlling congestion on a QoS non-guaranteed IP network and suppressing degradation of a video quality. A transmission control section 13 on a sender side outputs bit rate feedback information in accordance with congestion information on the network to a real-time encoder 12, and controls a transmission bit rate to change the transmission bit rate in accordance with congestion information on the network. The bit rate feedback information is obtained based on the congestion information on the network on the sender side, or obtained on a receiver side and fed back.Type: ApplicationFiled: January 27, 2003Publication date: August 14, 2003Applicant: KDDI CorporationInventors: Hiromasa Yanagihara, Akio Yoneyama, Yasuyuki Nakajima
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Patent number: 6551858Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin.Type: GrantFiled: April 29, 2002Date of Patent: April 22, 2003Assignees: Hitachi, Ltd., Hitachi ULSI Systems Co., Ltd.Inventors: Youichi Kawata, Kouji Koizumi, Michiaki Sugiyama, Atsushi Fujishima, Yasuyuki Nakajima, Takatoshi Hagiwara
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Publication number: 20020166886Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to be formed, there are various limitations on the material of which the bumps are made, due to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.Type: ApplicationFiled: May 28, 2002Publication date: November 14, 2002Inventors: Kosuke Inoue, Asao Nishimura, Takamichi Suzuki, Teru Fujii, Masayuki Morishima, Yasuyuki Nakajima, Noriyuki Oroku
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Patent number: 6479322Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin.Type: GrantFiled: January 2, 2002Date of Patent: November 12, 2002Assignees: Hitachi, Ltd., Hitachi ULSI Systems Co., Ltd.Inventors: Youichi Kawata, Kouji Koizumi, Michiaki Sugiyama, Atsushi Fujishima, Yasuyuki Nakajima, Takatoshi Hagiwara
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Patent number: 6473459Abstract: A coding parameter extracting unit extracts predictive-coded mode information, motion vectors, and coded transformed coefficients from video-signal-demultiplexed information. An abrupt scene change judging unit uses a characteristic that scenes change greatly before and after an abrupt scene change, to classify blocks on the basis of the predictive-coded mode information among the compressed moving picture data, so that an abrupt scene change is detected. A special effect judging unit detects dissolve from motion characteristic values calculated from the values of motion vectors, predictive-coded picture characteristic values derived from coefficients on frequency domains in blocks, and the number of blocks each having a motion vector that is larger than a threshold; and detects wipe by motion characteristic values calculated from the values of motion vectors, and predictive-coded picture characteristic values derived from coefficients on frequency domains in blocks.Type: GrantFiled: February 23, 1999Date of Patent: October 29, 2002Assignee: KDD CorporationInventors: Masaru Sugano, Yasuyuki Nakajima, Hiromasa Yanagihara, Akio Yoneyama
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Publication number: 20020136301Abstract: A variance between sequential video pictures is extracted, and then, a GOP boundary position is decided based on inter-frame variance information. Furthermore, simple motion estimation is carried out with respect to video pictures inside one GOP. If a motion variation between the video pictures is large, a small predictive frame interval is taken; to the contrary, if the motion variation is small, a large predictive frame interval is taken. The simple motion estimation is carried out between two downscaled feature planes at a timewise fixed interval with respect to a video picture which is discriminated to be an interlaced video picture, wherein a motion compensatory prediction error at that time is output as image variance information. If the image variance is small, coding is conducted by a frame structure; to the contrary, if the image variance is large, the coding is conducted by a field structure.Type: ApplicationFiled: April 3, 2002Publication date: September 26, 2002Applicant: KDD CorporationInventors: Akio Yoneyama, Yasuyuki Nakajima, Hiromasa Yanagihara, Masaru Sugano
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Patent number: 6455695Abstract: The present invention provides a process which enables easy and inexpensive preparation of alkylenebismelamines usable as components for forming resin materials, particularly aminoplasts, and flame retardants. The present invention is a process for preparation of alkylenebismelamines wherein the alkylene is a linear or branched C2-10 one by reacting an alkylenediamine wherein the alkylene is a linear or branched C2-10 one with melamine in the presence of an acidic catalyst under heating, characterized in that the amount of melamine is at least twice that of the alkylenediamine by mole.Type: GrantFiled: March 6, 2001Date of Patent: September 24, 2002Assignee: Nissan Chemical Industries, Ltd.Inventors: Hiroyuki Kousaka, Yasuyuki Nakajima
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Publication number: 20020133486Abstract: A thumbnail data having a time necessary for browsing display is extracted from a video file stored in a storage device in real time using query (cut point query, query by telop such as news, audio classification data, etc.), and then, high-precise thumbnail retrieval and browsing is carried out at frame unit and second unit. Further, high-precise segment playback by designating the thumbnail retrieval and browsing time as playback start/end points can be achieved without preparing a thumbnail data saving storage device. Therefore, it is possible to achieve high-precise thumbnail retrieval and browsing at frame unit and second unit without previously preparing and saving the thumbnail data. Further, it is possible to provide a retrieval, browsing and editing apparatus, which can effectively and accurately realize frame unit edit processing using the thumbnail retrieval and browsing, and to provide a recording medium recording the processing program.Type: ApplicationFiled: March 13, 2002Publication date: September 19, 2002Applicant: KDDI CORPORATIONInventors: Hiromasa Yanagihara, Yasuyuki Nakajima, Masaru Sugano
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Publication number: 20020119598Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, comprises a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by soldering outside the resin body after sealing them with resin.Type: ApplicationFiled: April 29, 2002Publication date: August 29, 2002Inventors: Youichi Kawata, Kouji Koizumi, Michiaki Sugiyama, Atsushi Fujishima, Yasuyuki Nakajima, Takatoshi Hagiwara
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Publication number: 20020118952Abstract: The present invention relates to the video playback unit of one or a plurality of videos, the delivery unit and the recording medium for recording the program of the processing of these units. The video playback unit of one video reads in order the video data of the video file from the storage unit. The display displays the video data, the time information sequence data and the still image sequence data positioned before and after the playback time of the video data. In this way, the video scene contained in the video file stored in the storage unit and the video file within the server network-connected can be effectively read or the target scene can be effectively retrieved. On the other hand, the playback unit of a plurality of videos divides a plurality of videos read from the storage unit into the main videos and the proxy videos so that these videos can be simultaneously displayed. In this way, a plurality of videos can be played back even in a limited transmission bandwidth and decoding capacity.Type: ApplicationFiled: February 26, 2002Publication date: August 29, 2002Applicant: KDDI CorporationInventors: Yasuyuki Nakajima, Hiromasa Yanagihara, Masaru Sugano
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Patent number: 6426772Abstract: A next input image selector 8 specifies a time at which an input image to be processed next is to be input immediately after finishing an encoding of one image. An input video capture 1 obtains an image of which input time has been specified and sends this image to an input image information detector 2. The input image information detector 2 makes a decision as to whether or not the input image is an image to be processed based on an image variance between this input image and an input image processed immediately before stored in a frame memory 3. If this decision is negative, an input image re-selector 4 re-selects an image to be processed, and if the decision is affirmative, this input image is sent as an image to be processed to a target output bits setter 5 and a motion predictor 11. An output bits controller 6 determines a quantizing level of a quantizer 14 from target output bits and actual output bits obtained from an encoder 15.Type: GrantFiled: October 7, 1998Date of Patent: July 30, 2002Assignee: KDDI CorporationInventors: Akio Yoneyama, Yasuyuki Nakajima, Hiromasa Yanagihara, Masaru Sugano
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Patent number: 6410365Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin.Type: GrantFiled: June 1, 1999Date of Patent: June 25, 2002Assignees: Hitachi, Ltd., Hitachi ULSI Systems Co., Ltd.Inventors: Youichi Kawata, Kouji Koizumi, Michiaki Sugiyama, Atsushi Fujishima, Yasuyuki Nakajima, Takatoshi Hagiwara