Patents by Inventor Yasuyuki Sasada
Yasuyuki Sasada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12202941Abstract: Provided are a film which includes at least a first resin layer containing aromatic polyester amide, and a second resin layer disposed on the first resin layer, and an elastic modulus of the second resin layer at 160° C. is less than 1.0 GPa.Type: GrantFiled: February 20, 2023Date of Patent: January 21, 2025Assignee: FUJIFILM CorporationInventors: Shohei Yamazaki, Yasuyuki Sasada
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Publication number: 20240402598Abstract: Provided are a base material for a metamaterial, containing a bondable compound with at least one of a conductive material or a material which transits from an insulator to a conductor; and a metamaterial and a laminate including the base material for a metamaterial.Type: ApplicationFiled: August 15, 2024Publication date: December 5, 2024Applicant: FUJIFILM CorporationInventor: Yasuyuki SASADA
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Publication number: 20240399714Abstract: Provided are a metamaterial including a base material including at least an elastic layer in which an elastic recovery rate at 25° C. is 80% or less and a pattern provided on a surface of the elastic layer, in which the pattern is composed of at least one of a conductive material or a material which transits from an insulator to a conductor; and a laminate.Type: ApplicationFiled: August 11, 2024Publication date: December 5, 2024Applicant: FUJIFILM CorporationInventor: Yasuyuki SASADA
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Publication number: 20240402597Abstract: Provided are a metamaterial including a base material having a dielectric loss tangent of 0.01 or less and a pattern provided on a surface of the base material, in which the pattern is composed of at least one of a conductive material or a material which transits from an insulator to a conductor, and a thermal expansion coefficient of the base material is 80 ppm/K or less; and a laminate including the metamaterial.Type: ApplicationFiled: August 15, 2024Publication date: December 5, 2024Applicant: FUJIFILM CorporationInventor: Yasuyuki SASADA
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Publication number: 20240399715Abstract: Provided are a base material for a metamaterial, in which a glass transition temperature is 160° C. or higher and a surface roughness Ra of at least one surface is 300 nm or less; and a metamaterial and a laminate including the base material for a metamaterial.Type: ApplicationFiled: August 15, 2024Publication date: December 5, 2024Applicant: FUJIFILM CorporationInventor: Yasuyuki SASADA
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Publication number: 20240402569Abstract: Provided are a base material for a metamaterial, in which a thermal dimensional change rate in a case of being allowed to stand in an environment of 90° C. for 24 hours is 0.01% or more and less than 10%; a metamaterial and a laminate including the base material for a metamaterial; and a manufacturing method of a metamaterial.Type: ApplicationFiled: August 14, 2024Publication date: December 5, 2024Applicant: FUJIFILM CorporationInventor: Yasuyuki SASADA
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Publication number: 20240407090Abstract: A film includes a layer A, and a layer B provided on at least one surface of the layer A, in which a ratio of an elastic modulus of the layer A at 160° C. to an elastic modulus of the layer B at 160° C. is 1.2 or more, and a thermal conductivity of the layer A is 0.05 W/(m·K) or more. A laminate includes a layer A, a layer B, and a metal layer or a metal wire, in this order, in which a ratio of an elastic modulus of the layer A at 160° C. to an elastic modulus of the layer B at 160° C. is 1.2 or more, and a thermal conductivity of the layer A is 0.05 W/(m·K) or more.Type: ApplicationFiled: August 14, 2024Publication date: December 5, 2024Applicant: FUJIFILM CorporationInventors: Yasuyuki SASADA, Miyoko HARA
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Patent number: 12160949Abstract: A wiring board, comprising: wiring patterns that are buried in the wiring board, in which a region positioned between wiring patterns disposed in an in-plane direction of the same plane has an elastic modulus at 140° C. equal to or less than 0.1 MPa, and a dielectric loss tangent is equal to or less than 0.006.Type: GrantFiled: May 25, 2022Date of Patent: December 3, 2024Assignee: FUJIFILM CorporationInventors: Genya Tanaka, Yasuyuki Sasada
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Patent number: 12152116Abstract: Provided are a polymer film containing a polymer and a filler, in which the polymer film has a phase-separated structure including at least two phases, and all of the at least two phases have an elastic modulus of 0.01 GPa or more; and an application thereof.Type: GrantFiled: August 3, 2023Date of Patent: November 26, 2024Assignee: FUJIFILM CorporationInventor: Yasuyuki Sasada
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Publication number: 20240373550Abstract: A wiring board including a first resin layer, wiring patterns arranged on at least one surface of the first resin layer, and a second resin layer disposed between the wiring patterns and on the wiring patterns, in which, in a cross section along a thickness direction, an interface roughness Rz1 of an interface between the first resin layer and the second resin layer is larger than an interface roughness Rz2 of an interface between the first resin layer and the wiring pattern; and applications thereof are provided.Type: ApplicationFiled: July 22, 2024Publication date: November 7, 2024Applicant: FUJIFILM CorporationInventor: Yasuyuki SASADA
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Publication number: 20240360158Abstract: The present invention provides a novel polycyclic aromatic compound having a plurality of aromatic rings linked by a boron atom, a nitrogen atom, and the like, and thus increases the number of alternatives of a material for an organic electroluminescent (EL) device. Furthermore, the present invention provides an excellent organic EL device by using a novel polycyclic aromatic compound as a material for an organic EL device.Type: ApplicationFiled: November 20, 2023Publication date: October 31, 2024Applicants: Kwansei Gakuin Educational Foundation, SK Materials JNC Co., Ltd.Inventors: Takuji HATAKEYAMA, Yasuhiro KONDO, Yasuyuki SASADA, Motoki YANAI, Toshiaki IKUTA
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Publication number: 20240336845Abstract: A film having a phase-separated structure including at least two phases, in which a first phase which is one of the at least two phases contains a first liquid crystal polyester, a second phase which is one of the at least two phases and is different from the first phase contains a second liquid crystal polyester different from the first liquid crystal polyester, and a density is 1.2 g/cm3 or less; and applications thereof are provided.Type: ApplicationFiled: June 20, 2024Publication date: October 10, 2024Applicant: FUJIFILM CorporationInventors: Shohei YAMAZAKI, Yasuyuki SASADA, Miyoko HARA
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Publication number: 20240254322Abstract: The present invention provides a cover film having excellent storage stability. The cover film of the present invention includes a cellulose acetate support and a polymer layer containing a polymer, in which the support contains an additive A other than cellulose acetate, and in a case where the support contains one kind of the additive A, a molecular weight of the one kind of the additive A is 500 or more, and in a case where the support contains two or more kinds of the additives A, an average molecular weight of the two or more kinds of the additives A is 500 or more.Type: ApplicationFiled: March 20, 2024Publication date: August 1, 2024Applicant: FUJIFILM CorporationInventors: Takato SUZUKI, Miyoko HARA, Yasuyuki SASADA
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Publication number: 20240255746Abstract: An object of the present invention is to provide a cover film including a support and a polymer layer, in which a mass reduction can be suppressed and peeling of an adhesive site between the cover film and an adherend can be suppressed in a case where a laminate of the cover film and the adherend is stored for a long period of time. The cover film of the present invention includes a support and a polymer layer containing a polymer, in which a surface haze of the cover film is 0.5% to 50%, and a content of an ester compound satisfying a predetermined requirement 1 in the support is 1% by mass or less with respect to a total mass of the support.Type: ApplicationFiled: March 20, 2024Publication date: August 1, 2024Applicant: FUJIFILM CorporationInventors: Yasuyuki SASADA, Miyoko HARA, Takato SUZUKI
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Publication number: 20240228715Abstract: An object of the present invention is to provide a cover film in which chips during cutting are unlikely to be generated, voids during bonding to a substrate using an enclosing solution are unlikely to be generated, and adhesiveness with the substrate is excellent. The cover film of the present invention is used for covering a test subject on a substrate, the cover film including a support and a polymer layer containing a polymer, in which a fracture toughness value of the polymer layer is 0.2 MPa·m0.5 or more, an in-plane retardation of the support at a wavelength of 590 nm is 1,000 nm or less, and a requirement regarding a dissolution rate of the polymer layer in xylene and a requirement regarding a viscosity of a xylene solution of the polymer layer are satisfied.Type: ApplicationFiled: March 25, 2024Publication date: July 11, 2024Applicant: FUJIFILM CorporationInventors: Miyoko HARA, Takato SUZUKI, Yasuyuki SASADA, Akio TAMURA, Reiko INUSHIMA
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Patent number: 11987732Abstract: A polarizing plate includes: a polarizer and an optical film, in which the optical film is laminated on at least one surface of the polarizer with an adhesive containing at least one or more polymerizable compounds, and the at least one or more polymerizable compounds are not substantially infiltrated into the optical film.Type: GrantFiled: November 4, 2020Date of Patent: May 21, 2024Assignee: FUJIFILM CorporationInventors: Yasuyuki Sasada, Kazuya Hisanaga, Daiki Wakizaka
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Patent number: 11937495Abstract: An organic light-emitting device containing both a compound represented by the following general formula (1) and a compound represented by the following general formula (2) has a high light emission efficiency. The rings a to c each are a benzene ring that can be optionally condensed, R1 and R2 each represent a substituted or unsubstituted aryl group, etc., four of R31 to R35 each are a substituted or unsubstituted carbazol-9-yl group, but all of these four are not the same, and the remaining one is a hydrogen atom, a cyano group, etc.Type: GrantFiled: August 7, 2019Date of Patent: March 19, 2024Assignees: KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION, KWANSEI GAKUIN EDUCATIONAL FOUNDATION, KYULUX, INC.Inventors: Hajime Nakanotani, Takuji Hatakeyama, Yasuhiro Kondo, Yasuyuki Sasada, Motoki Yanai, Chin-Yiu Chan, Masaki Tanaka, Hiroki Noda, Chihaya Adachi, Yoshitake Suzuki, Naoto Notsuka
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Patent number: 11877506Abstract: A polycyclic aromatic compound represented by Formula (1) is provided by the invention: wherein A11 ring, A21 ring, A31 ring, B11 ring, B21 ring, C11 ring, and C31 ring are an aryl or heteroaryl ring which may be substituted, Y11, Y21, Y31 are B or the like, X11, X12, X21, X22, X31, X32 are >O or >N—R, R in the above >N—R is an and which may be substituted or the like, R in the above >N—R or the like may be bonded to A11 ring, A21 ring, A31 ring, B11 ring, B21 ring, C11 ring, and/or C31 ring by a linking group or a single bond; and at least one hydrogen in the compound represented by Formula (1) may be replaced with deuterium, cyano, or a halogen.Type: GrantFiled: February 7, 2020Date of Patent: January 16, 2024Assignees: KWANSEI GAKUIN EDUCATIONAL FOUNDATION, SK MATERIALS JNC CO., LTD.Inventors: Takuji Hatakeyama, Bungo Kawakami, Susumu Oda, Yasuyuki Sasada, Yasuhiro Kondo
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Publication number: 20230383076Abstract: Provided are a polymer film containing a polymer and a filler, in which the polymer film has a phase-separated structure including at least two phases, and all of the at least two phases have an elastic modulus of 0.01 GPa or more; and an application thereof.Type: ApplicationFiled: August 3, 2023Publication date: November 30, 2023Applicant: FUJIFILM CorporationInventor: Yasuyuki SASADA
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Publication number: 20230364887Abstract: Provided are a polymer film including a layer A and a layer B on at least one surface of the layer A, in which the layer A contains a polymer having a dielectric loss tangent of 0.01 or less or at least one polymer A selected from the group consisting of a liquid crystal polymer, a fluorine-based polymer, a polymerized substance of a compound which has a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond, a polyphenylene ether, and an aromatic polyether ketone, the layer B contains an additive, and the layer B has an inflection point in a change in elastic modulus due to a change in temperature or a change in deformation rate, or has a reduced elastic modulus under pressurization; a laminate using the polymer film; and a method for manufacturing the same.Type: ApplicationFiled: July 25, 2023Publication date: November 16, 2023Applicant: FUJIFILM CorporationInventors: Yasuyuki Sasada, Naoyuki Morooka