Patents by Inventor Yasuyuki TOYOTA

Yasuyuki TOYOTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11005445
    Abstract: An electronic component including a pad electrode provided on a wiring electrode and a Au bump provided on the pad electrode, wherein the uppermost layer of the wiring electrode is a first Ti layer, the uppermost layer of the pad electrode is a Au layer, and the thickness of the first Ti layer in at least a portion on which the Au bump is superposed in plan view is greater than the thickness of at least a portion of the first Ti layer in a portion on which the Au bump is not superposed in plan view.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: May 11, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ryuta Yamada, Yasuyuki Toyota, Masaharu Fujiya, Toru Takeshita, Masaaki Shimada
  • Publication number: 20200204152
    Abstract: An electronic component including a pad electrode provided on a wiring electrode and a Au bump provided on the pad electrode, wherein the uppermost layer of the wiring electrode is a first Ti layer, the uppermost layer of the pad electrode is a Au layer, and the thickness of the first Ti layer in at least a portion on which the Au bump is superposed in plan view is greater than the thickness of at least a portion of the first Ti layer in a portion on which the Au bump is not superposed in plan view.
    Type: Application
    Filed: December 12, 2019
    Publication date: June 25, 2020
    Inventors: Ryuta YAMADA, Yasuyuki TOYOTA, Masaharu FUJIYA, Toru TAKESHITA, Masaaki SHIMADA