Abstract: The present invention is a system and method for providing a modified Digital-to-Analog converter (DAC) for use in a time-interleaved successive-approximation-register (SAR) analog-to-digital converter (ADC), the DAC including grouping of capacitance electrodes by Bit in a DAC, thereby reducing parasitic capacitances, and substantially improving power efficiency and speed to operate at GHz frequencies.

Abstract: The present invention is a system and method for providing a modified Digital-to-Analog converter (DAC) for use in a time-interleaved successive-approximation-register (SAR) analog-to-digital converter (ADC), the DAC including grouping of capacitance electrodes by Bit in a DAC, thereby reducing parasitic capacitances, and substantially improving power efficiency and speed to operate at GHz frequencies.

Abstract: An antenna package structure comprises a substrate with a first surface and a second surface; a dielectric layer, disposed on the first surface of the substrate comprises at least a impedance matching structure and an interconnection structure; a molding layer, disposed on the dielectric layer comprises a plurality of chips wherein a control chip electrically connects to the impedance matching structure and a plurality of conducting structures; an antenna layer, disposed on the second surface of the substrate comprising at least an antenna electrically connects to the substrate; and a protection layer covers the antenna layer.

Abstract: A wireless receiving device is provided. The wireless receiving device includes a first passive mixer and a common gate amplifier. The first passive mixer receives an oscillation signal. The common gate amplifier is coupled to the first passive mixer, and automatically adjusts the input impedance of the common gate amplifier according to the oscillation frequency of the oscillation signal.

Abstract: An antenna package structure comprises a substrate with a first surface and a second surface; a dielectric layer, disposed on the first surface of the substrate comprises at least a impedance matching structure and an interconnection structure; a molding layer, disposed on the dielectric layer comprises a plurality of chips wherein a control chip electrically connects to the impedance matching structure and a plurality of conducting structures; an antenna layer, disposed on the second surface of the substrate comprising at least an antenna electrically connects to the substrate; and a protection layer covers the antenna layer.

Abstract: A wireless receiving device is provided. The wireless receiving device includes a first passive mixer and a common gate amplifier. The first passive mixer receives an oscillation signal. The common gate amplifier is coupled to the first passive mixer, and automatically adjusts the input impedance of the common gate amplifier according to the oscillation frequency of the oscillation signal.

Abstract: Method for manufacturing a multi-band antenna package structure includes providing a first temporary substrate; forming a first dielectric material layer, and first metal patterns; forming at least one metal via; forming at least one metal pillar, and disposing an integrated circuit chip; forming a molding layer; thinning down the molding layer thus forming an integrated circuit chip layer; forming a first redistribution layer; forming a first antenna unit layer; forming a first protection layer, thus a first stacked structure formed; removing the first temporary substrate, and facing down the first stacked structure to adhere it on a second temporary substrate with a second glue layer; forming a second redistribution layer; forming a second protection layer; forming bump balls, thus a second stacked structure formed; removing the second temporary substrate with the second glue layer, facing down and mounting the second stacked structure on a substrate through the bump balls.

Abstract: Method for manufacturing a multi-band antenna package structure includes providing a first temporary substrate; forming a first dielectric material layer, and first metal patterns; forming at least one metal via; forming at least one metal pillar, and disposing an integrated circuit chip; forming a molding layer; thinning down the molding layer thus forming an integrated circuit chip layer; forming a first redistribution layer; forming a first antenna unit layer; forming a first protection layer, thus a first stacked structure formed; removing the first temporary substrate, and facing down the first stacked structure to adhere it on a second temporary substrate with a second glue layer; forming a second redistribution layer; forming a second protection layer; forming bump balls, thus a second stacked structure formed; removing the second temporary substrate with the second glue layer, facing down and mounting the second stacked structure on a substrate through the bump balls.

Abstract: A multi-band antenna package structure includes a first redistribution layer; an integrated circuit layer, formed on the first redistribution layer, comprising at least one metal via, at least one metal pillar, an integrated circuit chip, and a molding layer, wherein the molding layer is used to fill openings formed by the metal via, the metal pillar and the integrated circuit chip which are disposed on the first redistribution layer, the metal via is electrically connected to one of the first metal patterns of the first redistribution layer; a second redistribution layer, formed on the integrated circuit layer; and a first antenna unit layer, comprising a first dielectric layer and third metal patterns formed in openings of the first dielectric layer, wherein at least one of the third metal patterns is electrically connected to one of the second metal patterns, and the third metal patterns form a first antenna unit.

Abstract: A method and apparatus for dynamically modifying filter characteristics of a Delta-Sigma modulator to accommodate for Doppler shift. A transceiver in a wireless cellular communication system for adapt to changes in the RF carrier frequency for maintaining signal integrity by applying a pilot tone in calibration to determine a frequency shift response for a bandpass filter. During operation, the system is operative to determine a Doppler shift and to shift the bandpass filter in response.

Abstract: A Delta-Sigma modulator architecture is disclosed that uses interleaving and dynamic matching algorithms to address the needs of multi-mode, multi-band high bandwidth transmitters. The proposed architecture also supports a novel software defined transmitter architecture based on an interleaved Delta-Sigma modulator to generate RF signals. The proposed architecture leverages interleaving concepts to relax subcomponent clock rates without changing the effective oversampling ratio, thus, making it easier to reach aggressive dynamic range goals across wider bandwidths at higher frequencies. The DEM algorithm helps to randomize mismatch errors across all interleaved paths and improves substantially the signal-to-noise ratio. Additionally, a tunable bandpass filter can be added to reject out-of-band emissions.

Abstract: A variable inductor which comprises a primary conductor, first and second secondary conductors and one or more switch. The primary conductor has a first node and a second node, wherein the first node is used to connect a first external component and the second node is used to connect a second external component. The first and second secondary conductors magnetically couple to the primary conductor. The one or more switch has two sides connected to the first or second secondary conductor, respectively. The first and second secondary conductors are formed a single-loop structure with two or more changeable current paths which are operated by the states of the one or more switch. An integrated circuit using the variable inductor is also introduced.

Abstract: A multi-band antenna package structure includes a first redistribution layer; an integrated circuit layer, formed on the first redistribution layer, comprising at least one metal via, at least one metal pillar, an integrated circuit chip, and a molding layer, wherein the molding layer is used to fill openings formed by the metal via, the metal pillar and the integrated circuit chip which are disposed on the first redistribution layer, the metal via is electrically connected to one of the first metal patterns of the first redistribution layer; a second redistribution layer, formed on the integrated circuit layer; and a first antenna unit layer, comprising a first dielectric layer and third metal patterns formed in openings of the first dielectric layer, wherein at least one of the third metal patterns is electrically connected to one of the second metal patterns, and the third metal patterns form a first antenna unit.

Abstract: A variable inductor comprises a primary conductor, a first secondary conductor and one or more switch. The primary conductor has a first node and a second node, wherein the first node is used to connect a first external component and the second node is used to connect a second external component. The first secondary conductor magnetically couples to the primary conductor. The one or more switch has two sides connected to the first secondary conductor, respectively. The first secondary conductor is formed a single-loop structure with two or more changeable current paths which are operated by the states of the one or more switch. An integrated circuit using the variable inductor is also introduced.

Abstract: A variable inductor which comprises a primary conductor, first and second secondary conductors and one or more switch. The primary conductor has a first node and a second node, wherein the first node is used to connect a first external component and the second node is used to connect a second external component. The first and second secondary conductors magnetically couple to the primary conductor. The one or more switch has two sides connected to the first or second secondary conductor, respectively. The first and second secondary conductors are formed a single-loop structure with two or more changeable current paths which are operated by the states of the one or more switch. An integrated circuit using the variable inductor is also introduced.

Abstract: A Delta-Sigma modulator architecture is disclosed that uses interleaving and dynamic matching algorithms to address the needs of multi-mode, multi-band high bandwidth transmitters. The proposed architecture also supports a novel software defined transmitter architecture based on an interleaved Delta-Sigma modulator to generate RF signals. The proposed architecture leverages interleaving concepts to relax subcomponent clock rates without changing the effective oversampling ratio, thus, making it easier to reach aggressive dynamic range goals across wider bandwidths at higher frequencies. The DEM algorithm helps to randomize mismatch errors across all interleaved paths and improves substantially the signal-to-noise ratio. Additionally, a tunable bandpass filter can be added to reject out-of-band emissions.

Abstract: A radio frequency amplifier comprises a transistor, a transformer and a variable capacitor. The transistor has an input terminal, an output terminal and a control terminal. The transformer has a first coil conductor and a second coil conductor. The first coil conductor magnetically couples to the second coil conductor. The second coil conductor connects to the control terminal. The first coil conductor connects to the input terminal. The variable capacitor connects in parallel with the second coil conductor. An integrated circuit using the radio frequency amplifier is also introduced.

Abstract: A radio frequency amplifier comprises a transistor, a transformer and a variable capacitor. The transistor has an input terminal, an output terminal and a control terminal. The transformer has a first coil conductor and a second coil conductor. The first coil conductor magnetically couples to the second coil conductor. The second coil conductor connects to the control terminal. The first coil conductor connects to the input terminal. The variable capacitor connects in parallel with the second coil conductor. The radio frequency amplifier is configured to be an input or output stage of an integrated circuit. An integrated circuit using the radio frequency amplifier is also introduced.

Abstract: A apparatus for dynamically modifying filter characteristics of a delta-sigma modulator in order to receive and transmit radio frequency signals over a wide frequency range. The system is used for wide bandwidth radio system designed to adapt to various global radio standards and, more particularly, to a cellular radio architecture that employs a combination of a single circulator, programmable band-pass sampling radio frequency (RF) front-end and optimized digital baseband that is capable of supporting all current cellular wireless access protocol frequency bands.

Abstract: A convolution operation method includes the following steps of: performing convolution operations for data inputted in channels, respectively, so as to output a plurality of convolution results; and alternately summing the convolution results of the channels in order so as to output a sum result. A convolution operation device executing the convolution operation method is also disclosed.