Patents by Inventor Yen-Chun Liu

Yen-Chun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240106104
    Abstract: An electronic device includes a device body and an antenna module disposed in the device body and including a conductive structure and a coaxial cable including a core wire, a shielding layer wrapping the core wire, and an outer jacket wrapping the shielding layer. The conductive structure includes a structure body and a slot formed on the structure body and penetrating the structure body in a thickness direction of the structure body. A section of the shielding layer extends from the outer jacket and is connected to the structure body. A physical portion of the structure body and the section of the shielding layer are respectively located on two opposite sides of the slot in a width direction of the slot. A section of the core wire extends from the section of the shielding layer and overlaps the slot and the physical portion in the thickness direction.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 28, 2024
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Hung-Yu Yeh, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Chih-Heng Lin, Jui-Hung Lai
  • Patent number: 11923886
    Abstract: An antenna device and a method for configuring the same are provided. The antenna device includes a grounding metal, a grounding part, a radiating part, a feeding part, a proximity sensor, and a sensing metal. The radiating part is electrically connected to the grounding metal through the grounding part. The feeding part is coupled to the grounding metal through a feeding point. The sensing metal is electrically connected to the proximity sensor. The sensing metal is separated from the radiating part at a distance. The distance is less than or equal to one thousandth of a wavelength corresponding to an operating frequency of the antenna device.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: March 5, 2024
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Jhih-Ciang Chen, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Yan-Ming Lin, Jui-Hung Lai
  • Publication number: 20230192888
    Abstract: Provided is a monoclonal antibody of matrix metalloproteinase 1. The monoclonal antibody has a heavy chain variable region with an amino sequence comprising i) CDR1 selected from the group consisting of SEQ ID NOs: 1, 7 and 13, ii) CDR2 selected from the group consisting of SEQ ID NOs: 2, 8 and 14, and iii) CDR3 selected from the group consisting of SEQ ID NOs: 3, 9 and 15. The monoclonal antibody also has a light chain variable region with an amino sequence comprising i) CDR1 selected from the group consisting of SEQ ID NOs: 4, 10 and 16, ii) CDR2 selected from the group consisting of SEQ ID NOs: to 5, 11 and 17, and iii) CDR3 selected from the group consisting of SEQ ID NOs: 6, 12 and 18. A polynucleotide encoding the monoclonal antibody and a complementary polynucleotide sequence thereof are provided as well. A detection kit and a detection method are also provided, wherein the detection kit contains the monoclonal antibody of the matrix metalloproteinase 1.
    Type: Application
    Filed: February 27, 2020
    Publication date: June 22, 2023
    Inventors: Ya-Ting CHANG, Jau-Song YU, Jun-Sheng WANG, Shu-Fang WU, Chih-Ju CHEN, Yen-Chun LIU
  • Publication number: 20220372189
    Abstract: A copolymer is formed by reacting (A) aromatic monomer, an oligomer thereof, or a polymer thereof, with (B) aliphatic monomer, an oligomer thereof, or a polymer thereof. The aromatic monomer has a chemical structure of in which each of R1 is independently H or CH3, and n=1-4.
    Type: Application
    Filed: October 8, 2021
    Publication date: November 24, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Pin TING, Kuei-Yi CHUANG, Shih-Yao LIANG, Yen-Chun LIU
  • Patent number: 11476410
    Abstract: A semiconductor device includes a substrate having a magnetic random access memory (MRAM) region and a logic region, a first metal interconnection on the MRAM region, a second metal interconnection on the logic region, a stop layer extending from the first metal interconnection to the second metal interconnection, and a magnetic tunneling junction (MTJ) on the first metal interconnection. Preferably, the stop layer on the first metal interconnection and the stop layer on the second metal interconnection have different thicknesses.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: October 18, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yu-Chun Chen, Yen-Chun Liu, Ya-Sheng Feng, Chiu-Jung Chiu, I-Ming Tseng, Yi-An Shih, Yi-Hui Lee, Chung-Liang Chu, Hsiu-Hao Hu
  • Patent number: 11437162
    Abstract: A conductive material composition and a conductive material prepared therefrom are provided. The conductive material composition includes 40-80 parts by weight of disulfide resin having at least one terminal reactive functional group and 20-60 parts by weight of metal material. The terminal reactive functional group is independently acrylate group, methacrylate group, glycidyl group, oxiranyl group, oxetanyl group, or 3,4-epoxycyclohexyl group.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: September 6, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ying-Xuan Lai, Shou-Yi Ho, Yi-Chi Yang, Yen-Chun Liu
  • Patent number: 11383195
    Abstract: A device for capturing particles includes a gas-guiding unit, a gas-guiding unit and a mist-elimination unit. The gas-guiding unit has opposing first and second ends. The mist-elimination unit is disposed at the second end. The liquid-circulation unit, disposed under the mist-elimination unit by surrounding the gas-guiding unit, includes through holes below the gas-guiding unit by a gap. A gas containing particles enters the channel via the first end and then the mist-elimination unit via the second end. While the gas flows into the channel, the liquid in the liquid-circulation unit is inhaled into the channel via the gap to form droplets containing particles. After the droplets are captured by the mist-elimination unit, the liquid formed at the mist-elimination unit flows down into the liquid-circulation unit to reform the liquid to be further inhaled back to the channel of the gas-guiding unit via the gap.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: July 12, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tsung-Jen Ho, Sheng-Fu Huang, Yen-Chun Liu, Chun-Yi Chou
  • Patent number: 11286333
    Abstract: A degradation method of thermosetting resin is provided. The method includes the following steps, for example, a first resin composition is provided. The resin in the first resin composition includes a carbon-nitrogen bond, an ether bond, an ester bond or a combination thereof. The first resin composition and a catalyst composition are mixed to perform a degradation reaction to form a second resin composition. The catalyst composition includes a transition metal compound and a group IIIA metal compound. The second resin composition includes a resin monomer or an oligomer thereof having functional groups. The functional group includes an amine group, a hydroxyl group, an ester group, an acid group or a combination thereof. A catalyst composition used in the degradation method and a resin composition obtained by the degradation method are also provided.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: March 29, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kuei-Yi Chuang, Kuo-Chan Chiou, Yen-Chun Liu
  • Publication number: 20220029087
    Abstract: A semiconductor device includes a substrate having a magnetic random access memory (MRAM) region and a logic region, a first metal interconnection on the MRAM region, a second metal interconnection on the logic region, a stop layer extending from the first metal interconnection to the second metal interconnection, and a magnetic tunneling junction (MTJ) on the first metal interconnection. Preferably, the stop layer on the first metal interconnection and the stop layer on the second metal interconnection have different thicknesses.
    Type: Application
    Filed: August 19, 2020
    Publication date: January 27, 2022
    Inventors: Yu-Chun Chen, Yen-Chun Liu, Ya-Sheng Feng, Chiu-Jung Chiu, I-Ming Tseng, Yi-An Shih, Yi-Hui Lee, Chung-Liang Chu, Hsiu-Hao Hu
  • Publication number: 20210202126
    Abstract: A conductive material composition and a conductive material prepared therefrom are provided. The conductive material composition includes 40-80 parts by weight of disulfide resin having at least one terminal reactive functional group and 20-60 parts by weight of metal material. The terminal reactive functional group is independently acrylate group, methacrylate group, glycidyl group, oxiranyl group, oxetanyl group, or 3,4-epoxycyclohexyl group.
    Type: Application
    Filed: December 31, 2019
    Publication date: July 1, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ying-Xuan LAI, Shou-Yi HO, Yi-Chi YANG, Yen-Chun LIU
  • Publication number: 20210189057
    Abstract: A degradation method of thermosetting resin is provided. The method includes the following steps, for example, a first resin composition is provided. The resin in the first resin composition includes a carbon-nitrogen bond, an ether bond, an ester bond or a combination thereof. The first resin composition and a catalyst composition are mixed to perform a degradation reaction to form a second resin composition. The catalyst composition includes a transition metal compound and a group IIIA metal compound. The second resin composition includes a resin monomer or an oligomer thereof having functional groups. The functional group includes an amine group, a hydroxyl group, an ester group, an acid group or a combination thereof. A catalyst composition used in the degradation method and a resin composition obtained by the degradation method are also provided.
    Type: Application
    Filed: December 26, 2019
    Publication date: June 24, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kuei-Yi CHUANG, Kuo-Chan CHIOU, Yen-Chun LIU
  • Publication number: 20210154616
    Abstract: A device for capturing particles includes a gas-guiding unit, a gas-guiding unit and a mist-elimination unit. The gas-guiding unit has opposing first and second ends. The mist-elimination unit is disposed at the second end. The liquid-circulation unit, disposed under the mist-elimination unit by surrounding the gas-guiding unit, includes through holes below the gas-guiding unit by a gap. A gas containing particles enters the channel via the first end and then the mist-elimination unit via the second end. While the gas flows into the channel, the liquid in the liquid-circulation unit is inhaled into the channel via the gap to form droplets containing particles. After the droplets are captured by the mist-elimination unit, the liquid formed at the mist-elimination unit flows down into the liquid-circulation unit to reform the liquid to be further inhaled back to the channel of the gas-guiding unit via the gap.
    Type: Application
    Filed: June 18, 2020
    Publication date: May 27, 2021
    Inventors: TSUNG-JEN HO, SHENG-FU HUANG, YEN-CHUN LIU, CHUN-YI CHOU
  • Patent number: 11015018
    Abstract: A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: May 25, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Chun Liu, Min-Chian Wang, Hsiang-Yen Tsao, Kuo-Chan Chiou
  • Publication number: 20210104339
    Abstract: A conductive composition and a method for fabricating a micro light-emitting diode (LED) display are provided. The conductive composition includes 5-90 parts by weight of monomer, 10-95 parts by weight of epoxy resin, and 50-150 parts by weight of conductive powder. The total weight of the monomer and the epoxy resin is 100 parts by weight. The monomer has n reactive functional groups, wherein n is 1, 2, 3 or 4. The monomer has a molecular weight equal to or less than 350. The epoxy resin has an epoxy equivalent weight (EEW) from 160 g/Eq to 3500 g/Eq. Furthermore, there is a specific relationship among the weight of monomer, the number of reactive functional groups, the molecular weight of monomer, the weight of epoxy resin, and the epoxy equivalent weight of epoxy resin.
    Type: Application
    Filed: December 30, 2019
    Publication date: April 8, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shou-Yi HO, Yen-Chun LIU, Kuo-Chan CHIOU, Hsien-Kuang LIN
  • Publication number: 20210102886
    Abstract: This application relates generally to automated systems and methods for classifying subtypes of leukemia cells and other applications therefrom.
    Type: Application
    Filed: October 6, 2020
    Publication date: April 8, 2021
    Inventors: Sara Monaghan, Michael Boyiadzis, Steven H. Swerdlow, Yen-Chun Liu, Bor-Sheng KO, Yu-Fen Wang, Chi-Chun Lee, Jeng-Lin Li, Ming-Ya Ko
  • Publication number: 20190211138
    Abstract: A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.
    Type: Application
    Filed: September 28, 2018
    Publication date: July 11, 2019
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Chun LIU, Min-Chian WANG, Hsiang-Yen TSAO, Kuo-Chan CHIOU
  • Patent number: 10329468
    Abstract: A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, X1 is X2 is m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.
    Type: Grant
    Filed: February 18, 2016
    Date of Patent: June 25, 2019
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Chun Liu, Hui-Wen Chang, Min-Chian Wang, Kuo-Chan Chiou
  • Patent number: 10059866
    Abstract: An epoxy resin composition is provided. The epoxy resin composition includes a first aromatic epoxy resin represented by formula (I), and an amino compound selected from a group that includes 4,4?-methylenedianiline, 4,4?-ethylenedianiline, 4,4?-bis(4-aminophenoxy)biphenyl and 1,4-bis(4-aminophenoxy)benzene, wherein the ratio between the epoxy groups of the first aromatic epoxy resin and the amino groups of the amino compound ranges from 1:1 to 2:1.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: August 28, 2018
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Chun Liu, Hui-Wen Chang, Hsiang-Yen Tsao, Kuo-Chan Chiou
  • Publication number: 20180073081
    Abstract: The invention is directed to a method to predict prognostic results for diseases including acute myeloid leukemia (AML) by analyzing novel markers which comprises microRNA/mRNA (miRNA/mRNA) pairings. In particular, the miRNA/mRNA pairings are a kind of NPM1 mutation-modulated miRNA/mRNA regulation pairs.
    Type: Application
    Filed: September 13, 2016
    Publication date: March 15, 2018
    Inventors: Eric Y. Chuang, Mong-Hsun Tsai, Wen-Chien Chou, Liang-Chuan Lai, Hwei-Fang Tien, Yu-Chiao Chiu, Tzu-Pin Lu, Yen-Chun Liu, Yi-Yi Kuo, Hsin-An Hou, Yidong Chen
  • Patent number: 9820443
    Abstract: Disclosed herein is an industrial scale process of cultivating cultivating Ganoderma lucidum mycelia. As high as 15 Kg dried Ganoderma lucidum mycelia may be produced from about 300 liters liquid culture every 30 days, and the resulting dried Ganoderma lucidum mycelia are rich in triterpenoids that include at least ganoderic acid S (GAS), ganoderic acid T (GAT), ganoderic acid Me (GAMe), ganoderic acid R (GAR), and ganodermic acid S (GMAS).
    Type: Grant
    Filed: August 9, 2013
    Date of Patent: November 21, 2017
    Assignee: DOUBLE CRANE BIOTECHNOLOGY CO. LTD.
    Inventors: Li-Ming Huang, Chih-Wei Chen, Mon-Tarng Chen, Yen-Chun Liu, Kuang-Dee Chen