Abstract: A display device includes a driving substrate, a display medium layer, a glue layer, and a protective layer. The display medium layer is disposed on the driving substrate. The glue layer is disposed around the display medium layer. The protective layer covers the display medium layer and the glue layer, and the protective layer is bent toward the driving substrate along the glue layer.

Abstract: A display device includes a first substrate, a second substrate, a display layer, a bump, and a sealing material. The second substrate is disposed over the first substrate. The display layer is disposed between the first substrate and the second substrate, and has a boundary. The bump is connected to the first substrate or the second substrate and protrudes in a direction toward the opposite second substrate or first substrate, and is disposed around the boundary. The sealing material is filled between the bump and the display layer. The water vapor transmission rate of the bump is less than the water vapor transmission rate of the sealing material.

Abstract: A lighting module includes a circuit board, a light emitting diode, a light guide plate, and a waterproof adhesive. The circuit board has an insulating layer, a metal layer, and a circuit layer. The insulating layer is interposed between the metal layer and the circuit layer. The metal layer has an opening exposing a portion of the insulating layer. The light emitting diode has a light emitting surface and a non-light emitting surface facing the metal layer. The light guide plate is parallel or substantially parallel to the circuit board and is adjacent to the light emitting surface of the light emitting diode. An optical axis of the light emitting diode coincides with or substantially coincides with a symmetry axis of the light guide plate. The portion of the insulating layer is adhered to the light guide plate through the waterproof adhesive.

Abstract: A lighting module includes a circuit board, a light emitting diode, a light guide plate, and a waterproof adhesive. The circuit board has an insulating layer, a metal layer, and a circuit layer. The insulating layer is interposed between the metal layer and the circuit layer. The metal layer has an opening exposing a portion of the insulating layer. The light emitting diode has a light emitting surface and a non-light emitting surface facing the metal layer. The light guide plate is parallel or substantially parallel to the circuit board and is adjacent to the light emitting surface of the light emitting diode. An optical axis of the light emitting diode coincides with or substantially coincides with a symmetry axis of the light guide plate. The portion of the insulating layer is adhered to the light guide plate through the waterproof adhesive.

Abstract: A connector structure includes a first connector and a second connector configured to rotatably connect the first connector. The first connector includes an insulating support, a first conductor and a second conductor. The first and second conductors respectively include first and second convex curved surfaces. The second connector includes first and second insulating housings and first and second conductive layers. The first and second insulating housings are configured to cover at least a portion of the first conductor and at least a portion of the second conductor, respectively. The first conductive layer includes a first concave curved surface matching the first convex curved surface, and is configured to be in contact with the first conductor. The second conductive layer includes a second concave curved surface matching the second convex curved surface, and is configured to be in contact with the second conductor.

Abstract: A lighting module includes a circuit board, a light emitting diode, a light guide plate and a glue material. The light emitting diode is disposed over the circuit board, and the light emitting diode includes a light emitting side surface and a non-light emitting side surface. The light guide plate is substantially parallel to the circuit board, and a portion of the light guide plate is disposed over the circuit board and adjacent to the light emitting side surface of the light emitting diode. The glue material covers and is in contact with the non-light emitting side surface of the light emitting diode and the portion of the light guide plate.

Abstract: A lighting module includes a circuit board, a light emitting diode, a light guide plate and a glue material. The light emitting diode is disposed over the circuit board, and the light emitting diode includes a light emitting side surface and a non-light emitting side surface. The light guide plate is substantially parallel to the circuit board, and a portion of the light guide plate is disposed over the circuit board and adjacent to the light emitting side surface of the light emitting diode. The glue material covers and is in contact with the non-light emitting side surface of the light emitting diode and the portion of the light guide plate.

Abstract: A connector structure includes a first connector and a second connector configured to rotatably connect the first connector. The first connector includes an insulating support, a first conductor and a second conductor. The first and second conductors respectively include first and second convex curved surfaces. The second connector includes first and second insulating housings and first and second conductive layers. The first and second insulating housings are configured to cover at least a portion of the first conductor and at least a portion of the second conductor, respectively. The first conductive layer includes a first concave curved surface matching the first convex curved surface, and is configured to be in contact with the first conductor. The second conductive layer includes a second concave curved surface matching the second convex curved surface, and is configured to be in contact with the second conductor.