Patents by Inventor Yew Cheong Kuan
Yew Cheong Kuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9123869Abstract: A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.Type: GrantFiled: February 28, 2011Date of Patent: September 1, 2015Assignee: Intellectual Discovery Co., Ltd.Inventors: Kong Weng Lee, Kee Yean Ng, Yew Cheong Kuan, Cheng Why Tan, Gin Ghee Tan
-
Publication number: 20130264970Abstract: Light emitter components with improved light extraction and related methods are disclosed. In one embodiment, the light emitter component can include a submount, at least one light emitting chip disposed over the submount, and a lens disposed over a portion of the light emitting chip. The lens can include an optical element. The optical element can be configured to affect light output from the at least one light emitting chip.Type: ApplicationFiled: April 6, 2012Publication date: October 10, 2013Inventors: Yew Cheong Kuan, Craige William Hardin, Man Ngok Chu, Thye Linn Mok, Yung-Ching Hu, Hsien-Ming Wang, Heng-Yen Lee
-
Publication number: 20110147788Abstract: A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.Type: ApplicationFiled: February 28, 2011Publication date: June 23, 2011Applicant: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Kong Weng Lee, Kee Yean Ng, Yew Cheong Kuan, Cheng Why Tan, Gin Ghee Tan
-
Patent number: 7938557Abstract: A light source and a method for operating the same are disclosed. The light source includes a light emitter and a controller. The light emitter generates light in response to a control signal coupled thereto. The light emitter is characterized by an age related to the amount of light that has been cumulatively generated by the light emitter, the generated light for a given control signal changing with the age. The controller measures the age of the light emitter and generates the control signal based on the desired light intensity and the measured age of the light emitter. In one embodiment, the controller stores an age value for the light emitter, and the controller determines the control signal in response to an input signal specifying a desired light intensity from the light emitter, the controller updating the age value each time the control signal is determined.Type: GrantFiled: December 23, 2004Date of Patent: May 10, 2011Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Sundar Natarajan Yoganandan, Thye Linn Mok, Kian Shin Lee, Norfidathul Aizar Abdul Karim, Su Lin Oon, Siew It Pang, Kheng Leng Tan, Fakhrul Arifin Mohd Afif, Wen Ya Ou, Yew Cheong Kuan
-
Patent number: 7919787Abstract: A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive interconnecting elements.Type: GrantFiled: August 14, 2007Date of Patent: April 5, 2011Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Kong Weng Lee, Kee Yean Ng, Yew Cheong Kuan, Cheng Why Tan, Gin Ghee Tan
-
Patent number: 7888868Abstract: A light source that has improved light mixing. The light source uses a nanolens layer in conjunction with an LED light source to enhance the mixing of the colored light emitting from the LED light source.Type: GrantFiled: April 28, 2006Date of Patent: February 15, 2011Inventors: Yew Cheong Kuan, Siew It Pang, Ng Fook Chuin, Tong Fatt Chew, Thye Linn Mok
-
Patent number: 7404652Abstract: A light-emitting diode (“LED”) device includes a plurality of LEDs. Each LED in the plurality of LEDs is adjacent to at least one other of the plurality of LEDs. At least one of the plurality of LEDs has a radiation with a full-width-half-maximum greater than 50 nm.Type: GrantFiled: December 15, 2004Date of Patent: July 29, 2008Assignee: Avago Technologies ECBU IP Pte LtdInventors: Kee Yean Ng, Heng Yow Cheng, Yew Cheong Kuan
-
Patent number: 7315048Abstract: In one embodiment, light emitted by a plurality of solid-state light emitters is mixed by mounting the plurality of solid-state light emitters on a transparent to translucent substrate so that they primarily emit light away from the substrate. The light emitters are then covered with a transparent to translucent encapsulant; and the encapsulant is coated with a reflective material that reflects light emitted by the light emitters toward the substrate. Related apparatus is also disclosed.Type: GrantFiled: October 22, 2004Date of Patent: January 1, 2008Assignee: Avago Technologies ECBU IP (Singapore) PTE LtdInventors: Elizabeth Ching Ling Fung, Thye Linn Mok, Hong Huat Yeoh, Yew Cheong Kuan, Fakhrul Arifin Mohd Afif, Norfidathul Aizar Abdul Karim, Kian Shin Lee, Hui Peng Koay
-
Patent number: 7279355Abstract: A substantially planar substrate having opposed major surfaces is provided. The substrate includes a through hole that extends between the major surfaces. The through hole is filled with a conductive interconnecting element. A conductive mounting pad and a conductive connecting pad are formed on different ones of the major surfaces in electrical contact with the conductive interconnecting element. The packaging device formed by the method has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.Type: GrantFiled: June 27, 2003Date of Patent: October 9, 2007Assignee: Avago Technologies ECBUIP (Singapore) Pte LtdInventors: Kong Weng Lee, Kee Yean Ng, Yew Cheong Kuan, Gin Ghee Tan, Cheng Why Tan
-
Patent number: 7256486Abstract: The packaging device includes a substrate, a mounting pad, a connecting pad and an interconnecting element. The substrate is substantially planar and has opposed major surfaces. The mounting pad is conductive and is located on one of the major surfaces. The connecting pad is conductive and is located on the other of the major surfaces. The conductive interconnecting element extends through the substrate and electrically interconnects the mounting pad and the connecting pad. The packaging device has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.Type: GrantFiled: June 27, 2003Date of Patent: August 14, 2007Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Kong Weng Lee, Kee Yean Ng, Yew Cheong Kuan, Gin Ghee Tan, Cheng Why Tan
-
Patent number: 7241030Abstract: Illumination apparatus includes a support structure, at least one light emitting element, and a heat sink thermally coupled to the light emitting element. The light emitting element and heat sink are moveable in relation to the support structure. An actuator system moves the at least one light emitting element and the heat sink with respect to the support structure.Type: GrantFiled: July 30, 2004Date of Patent: July 10, 2007Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Thye Linn Mok, Sundar Natarajan Yogananadan, Kian Shin Lee, Kheng Leng Tan, Siew It Pang, Yew Cheong Kuan, Norfidathul Aizar Abdul Karim, Su Lin Oon, Fakhrul Arifin Mohd Afif, Wen Ya Ou
-
Patent number: 7210817Abstract: A system and method for a reverse mounted light array. In one method embodiment, the present invention couples a reverse mounted light-generating source with a substrate. Additionally, the present invention couples an electrical portion of the reverse mounted light generating source with a conductive trace coupled to the reverse side of the substrate, wherein the coupling of the conductive trace with the substrate and the reverse mounted light generating source forms a reverse mounted light array.Type: GrantFiled: April 27, 2004Date of Patent: May 1, 2007Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Kian Shin Lee, Janet Bee Yin Chua, Yew Cheong Kuan, Heng Yow Cheng, Kee Yean Ng, Wen Ya Ou
-
Patent number: 7208738Abstract: A light source is disclosed. The light source has a light-emitting chip that includes an LED that generates light in an active region thereof. The LED emits a light signal in a forward direction, and infrared radiation generated in the active region is emitted in a side direction in the form of a first infrared signal. The first light signal is determined by a first drive signal coupled to the LED. The light source also includes an infrared detector positioned to collect a portion of the infrared signal. The infrared detector generates a heat signal indicative of the amount of infrared radiation detected. A controller generates the drive signal so as to maintain the heat signal at a first target value. In light sources having LEDs that emit in different spectral ranges, the infrared detectors can all detect heat in the same spectral range.Type: GrantFiled: February 28, 2005Date of Patent: April 24, 2007Inventors: Sundar Natarajan Yoganandan, Fakhrul Arifin Mohd. Afif, Klan Shin Lee, Slew It Pang, Kheng Leng Tan, Yew Cheong Kuan, Su Lin Oon, Wen Ya Ou, Norfidathul Aizar Abdul Karim, Thye Linn Mok
-
Patent number: 7141779Abstract: A system and method for emitting and detecting light uses a light emitting device, e.g., a light emitting diode, to emit light and to detect incident light. As an example, the system and method may be used in a digital camera, a camera phone or an illuminated device, such as a liquid crystal display device.Type: GrantFiled: September 19, 2005Date of Patent: November 28, 2006Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Tong Fatt Chew, Gim Eng Chew, Kheng Guan Peh, Yew Cheong Kuan, Kevin John Theseira, Yih Sien Teh, Eit Thian Yap, Kevin Len Li Lim, Joon Chok Lee
-
Patent number: 7128442Abstract: An illumination unit includes a thin and flexible substrate and flexible electrical tracks formed on the flexible substrate. A number of solid-state light generating sources are arranged on the flexible substrate along the electrical tracks and are electrically connected to the electrical tracks. A flexible and optically transparent encapsulant is provided to encapsulate the light generating sources on the substrate such that the illumination unit is both thin and flexible.Type: GrantFiled: January 20, 2004Date of Patent: October 31, 2006Inventors: Kian Shin Lee, Janet Bee Yin Chua, Wen Ya Ou, Yew Cheong Kuan
-
Publication number: 20060095100Abstract: In one embodiment, apparatus is provided with at least one solid-state light emitter, at least one fiber optic light guide, at least one photosensor, and a control system. Each of the at least one fiber optic light guide has a first end that is independently positionable with respect to the solid-state light emitter(s) to receive the light emitted by the solid-state light emitter(s). Each photosensor is positioned to receive light emitted from a second end of one of the light guides. The control system is operably associated with the solid-state light emitter(s) and the photosensor(s) to regulate the light output of the light emitter(s) in accordance with measurements received from the photosensor(s).Type: ApplicationFiled: October 29, 2004Publication date: May 4, 2006Inventors: Kian Shin Lee, Thye Linn Mok, Kheng Leng Tan, Fakhrul Arifin Mohd Afif, Siew It Pang, Yew Cheong Kuan, Norfidathul Aizar Abdul Karim, Su Lin Oon, Wen Ya Ou, Sundar A/L Natarajan Yoganandan
-
Patent number: 6860620Abstract: A light unit is provided that includes a thin flexible substrate layer. A number of flexible electrical tracks are formed on the flexible substrate layer. A number of Light Emitting Diodes (LEDs) are arranged on the flexible substrate layer along the electrical tracks and are electrically connected to the electrical tracks such that the light unit is both thin and flexible.Type: GrantFiled: May 9, 2003Date of Patent: March 1, 2005Assignee: Agilent Technologies, Inc.Inventors: Yew Cheong Kuan, Seong Choon Lim, Kar Phooi Foong, Wen Ya Ou
-
Publication number: 20040262738Abstract: The packaging device includes a substrate, a mounting pad, a connecting pad and an interconnecting element. The substrate is substantially planar and has opposed major surfaces. The mounting pad is conductive and is located on one of the major surfaces. The connecting pad is conductive and is located on the other of the major surfaces. The conductive interconnecting element extends through the substrate and electrically interconnects the mounting pad and the connecting pad. The packaging device has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.Type: ApplicationFiled: June 27, 2003Publication date: December 30, 2004Inventors: Kong Weng Lee, Kee Yean Ng, Yew Cheong Kuan, Gin Ghee Tan, Cheng Why Tan
-
Publication number: 20040266058Abstract: A substantially planar substrate having opposed major surfaces is provided. The substrate includes a through hole that extends between the major surfaces. The through hole is filled with a conductive interconnecting element. A conductive mounting pad and a conductive connecting pad are formed on different ones of the major surfaces in electrical contact with the conductive interconnecting element. The packaging device formed by the method has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.Type: ApplicationFiled: June 27, 2003Publication date: December 30, 2004Inventors: Kong Weng Lee, Kee Yean Ng, Yew Cheong Kuan, Gin Ghee Tan, Cheng Why Tan
-
Publication number: 20040223327Abstract: A light unit is provided that includes a thin flexible substrate layer. A number of flexible electrical tracks are formed on the flexible substrate layer. A number of Light Emitting Diodes (LEDs) are arranged on the flexible substrate layer along the electrical tracks and are electrically connected to the electrical tracks such that the light unit is both thin and flexible.Type: ApplicationFiled: May 9, 2003Publication date: November 11, 2004Inventors: Yew Cheong Kuan, Seong Choon Lim, Kar Phooi Foong, Wen Ya Ou