Abstract: A latch mechanism includes a first and second latch body. The first and second latch body respectively includes a first and second base, a first and second latch portion and a first and second acting portion. The first latch body disposes through the second base. The second acting portion is pivoted to the second base. The second latch portion is disposed on the rotational path and limited to the first latch portion. The second acting portion includes a first and a second pushing structure. When the second acting portion is rotated along the rotational path, the second latch portion is pushed by the first pushing structure such that the second latch portion is disengaged from the first latch portion, and then the first acting portion is pushed by the second pushing structure such that the first latch body is disengaged from the second latch body in a releasing direction.

Abstract: The disclosure provides an adjusting device having an active region and a peripheral region adjacent to the active region. The adjusting device includes a first substrate, a first conducting layer, a first insulating layer, a second conducting layer, a second insulating layer, and a sealant layer. The first insulating layer is disposed on the first conducting layer and includes a first opening disposed in the peripheral region. The second conducting layer is disposed on the first conducting layer and electrically connected to the first conducting layer through the first opening. The second insulating layer includes multiple first protruding structures disposed in the peripheral region and on the first insulating layer. The sealant layer is disposed in the peripheral region and on the second insulating layer. The first opening is disposed between two of the first protruding structures.

Abstract: A semiconductor package structure includes a substrate. The substrate includes a first ground layer. The first ground layer has a body and a first tooth protruding from a side of the body. The first tooth has a first lateral side. The first lateral side of the first tooth is inclined relative to the side of the body in a top view of the first ground layer.

Abstract: An apparatus, a system and a method are disclosed. An exemplary method includes providing a wafer process chamber and a plurality of radiant heat elements under the wafer process chamber, receiving a wafer holder configured to be used in the wafer process chamber, and processing a wafer located on the wafer holder in the wafer process chamber. The wafer holder includes: a wafer contact portion including an upper surface and a lower surface, an exterior portion including an upper surface and a lower surface, and a tapered region formed in the wafer contact portion.

Abstract: Disclosed is an electronic device, including a substrate, a first electrode, a second electrode, a modulation element, a first solder, and a switch element. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The modulation element is disposed on the substrate and includes at least two connecting pads. The first solder is disposed between the first electrode and one connecting pad of the modulation element. The switch element is disposed on the substrate. The one connecting pad of the modulation element is electrically connected to the switch element sequentially through the first solder, the first electrode, and the second electrode.

Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.

Abstract: A manufacturing method of a package structure including the following steps is provided. A carrier is provided. An anti-warpage structure is formed on the carrier. And a redistribution layer is formed on the carrier. In the normal direction of the carrier, a warpage trend of the anti-warpage structure is opposite to a warpage trend of the redistribution layer.

Abstract: An electronic device including a pair of substrates, a sealant, and a heating unit is provided. Each of the pair of substrates includes a peripheral area and an active area, and each of the peripheral areas are adjacent to an edge of a corresponding one of the pair of substrates. The sealant is disposed between the pair of substrates. The heating unit is disposed on one of the pair of substrates and comprising a first portion disposed in the peripheral area of the one of the pair of substrates and adjacent to an edge of the one of the pair of substrates, a third portion disposed in the active area, and a second portion connecting the first portion and the third portion. The resistance of the first portion is less than a resistance of the third portion. Therefore, the electronic device may have improved heating efficiency.

Abstract: The present disclosure provides a manufacturing method of a package device, which includes providing a carrier substrate, a first conductive layer, and a release layer, where the carrier substrate has a device region and a peripheral region, and the first conductive layer and the release layer are disposed on the carrier substrate. The method further includes forming a second conductive layer on the release layer in the device region, where at least one of the first and second conductive layers includes a first pad in the peripheral region. The second conductive layer includes a second pad electrically connected to the first pad through the first conductive layer. The method also includes performing an inspection step to provide an input signal to one of the first and second pads, and to receive an output signal from another of the first and second pads.

Abstract: An antenna device is provided, including a first substrate, a first conductive element, a second substrate, a second conductive element, and an insulating layer. The first conductive element is disposed on the first substrate to define, on the first substrate, a recessed region adjacent to the first conductive element. The second substrate faces the first substrate. The second conductive element is disposed on the second substrate and located between the first substrate and the second substrate. The insulating layer is disposed between the first substrate and the second substrate. In a top view of the antenna device, the second conductive element overlaps the first conductive element and the recessed region, and the insulating layer at least partially overlaps the recessed region.

Abstract: An omni-directional conditioner device includes a carrier that includes a holding part for holding and rotating an object for polishing purpose; a conditioner disposed around the carrier; and a transmission mechanism connected with the carrier on one side and the conditioner on the other side, the transmission mechanism including at least one directional adjustment unit that controls the rotational direction of the conditioner. When the directional adjustment unit is set in one position, the carrier and the conditioner rotate in a same direction, and when the directional adjustment unit is set in another position, the carrier and the conditioner rotate in opposite directions.

Abstract: The bicycle which includes a rear wheel and a frame is disclosed. The frame includes a frame main body and two first supporting platforms. The frame main body includes two supporting parts, a bottom frame and a surrounding part. The two supporting parts are respectively located on the two sides of the rear wheel. The bottom frame is located in front of the rear wheel. The surrounding part is located in back of the rear wheel. The two first supporting platforms are respectively located on the two sides of the rear wheel. Each of the two first supporting platforms includes a side plate and a top plate. The side plate includes a front connecting end and a back connecting end.

Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.

Abstract: A manufacturing method of a metal structure is disclosed, which includes the following steps: forming a seed layer on a substrate; forming a patterned metal layer on the seed layer, wherein the patterned metal layer includes a metal member; forming a first patterned photoresist layer on the seed layer, wherein a thickness of the first patterned photoresist layer is less than a thickness of the patterned metal layer; and performing a first patterning process to the seed layer through the first patterned photoresist layer to form a patterned seed layer, wherein after the first patterning process, the metal member includes a first part and a second part, the first part is disposed between the patterned seed layer and the second part, and a width of the first part is greater than a width of the second part.

Abstract: A manufacturing method of a metal structure is disclosed, which includes the following steps: forming a seed layer on a substrate; forming a patterned metal layer on the seed layer, wherein the patterned metal layer includes a metal member; forming a first patterned photoresist layer on the seed layer, wherein a thickness of the first patterned photoresist layer is less than a thickness of the patterned metal layer; and performing a first patterning process to the seed layer through the first patterned photoresist layer to form a patterned seed layer, wherein after the first patterning process, the metal member includes a first part and a second part, the first part is disposed between the patterned seed layer and the second part, and a width of the first part is greater than a width of the second part.

Abstract: A contact lens and a method of manufacturing the same are provided. The contact lens includes a contact lens body and a blue light blocking material covering the contact lens body. The blue light blocking material includes a plurality of metal particles dispersed on the contact lens body. The present invention includes compositions of at least one compound including metal ion with at least one or more reducing factors. The interactions between reducing factors endow contact lens body with homogeneous or pupil-regional preference of metal particles distribution with enhanced or decreased efficacy of blue light blocking. A further modification strengthens surface properties of contact lens including contact angle, water break-up time and long-term protein depositions.

Abstract: A contact lens and a method of manufacturing the same are provided. The contact lens includes a contact lens body and a blue light blocking material. The blue light blocking material covers the contact lens body. The blue light blocking material includes a plurality of metal particles dispersed on the contact lens body. The contact lens has good blue light blocking efficacy and surface properties.

Abstract: A belt tensioner for use with a bike is provided. The bike includes a frame and a belt. The frame includes a chain stay and a seat stay having a top surface and bottom surface. The belt tensioner includes a tensioner skeleton, a roller and a tension regulator. The tensioner skeleton is pivotally connected to the chain stay or the seat stay. An included angle is formed between the tensioner skeleton and chain stay or the seat stay. The roller is pivotally connected to the tensioner skeleton and in contact with the belt. The tension regulator presses against the belt to adjust tension of the belt. The tension regulator is disposed at an end of the tensioner skeleton, and the end of the tensioner skeleton is positioned distal to the bottom surface.

Abstract: The bicycle which includes a rear wheel and a frame is disclosed. The frame includes a frame main body and two first supporting platforms. The frame main body includes two supporting parts, a bottom frame and a surrounding part. The two supporting parts are respectively located on the two sides of the rear wheel. The bottom frame is located in front of the rear wheel. The surrounding part is located in back of the rear wheel. The two first supporting platforms are respectively located on the two sides of the rear wheel. Each of the two first supporting platforms includes a side plate and a top plate. The side plate includes a front connecting end and a back connecting end.

Abstract: A method for ex vivo treating blood or plasma is provided. The method includes (a) ex vivo contacting a blood or plasma with an enzyme composition to react the enzyme composition with the blood or plasma, wherein the enzyme composition is capable of eliminating electronegative low-density lipoprotein from the blood or plasma by the activity of the enzyme composition, and the enzyme composition is selected from a group consisting of: a first enzyme for eliminating a glycan residue of an electronegative low-density lipoprotein (LDL); a second enzyme for eliminating ceramide carried by a electronegative low-density lipoprotein (LDL); and a combination thereof; and (b) terminating contact between the blood or plasma and the enzyme composition to terminate the reaction of the enzyme composition with the blood or plasma.