Patents by Inventor Yi- Jie HUANG

Yi- Jie HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250116629
    Abstract: A semiconductor biosensor includes a semiconductor layer having a first surface and a second surface opposite to the first surface, a FET device in the semiconductor layer, an isolation layer over the first surface of the semiconductor layer, a pair of first electrodes over the isolation layer, and a pair of second electrodes over the isolation layer. The FET device includes a gate structure disposed over the second surface of the semiconductor layer. The isolation layer includes a rectangular opening substantially aligned with the FET device. The pair of second electrodes is separated from the pair of first electrodes.
    Type: Application
    Filed: December 18, 2024
    Publication date: April 10, 2025
    Inventors: YI-HSING HSIAO, JUI-CHENG HUANG, YU-JIE HUANG
  • Publication number: 20250068542
    Abstract: A computer-implemented method includes identifying a webpage comprising a set of user interface (UI) elements, analyzing the set of user UI elements to identify a set of interactable elements, classifying the elements of the set interactable elements as either focusable or not focusable, extracting features from source code corresponding to interactable elements of the set of interactable elements classified as focusable, and building an accessibility issue detection model using the extracted features from source code corresponding to focusable interactable elements as training data. The method may further include extracting features from source code corresponding to interactable elements classified as not focusable and updating the accessibility issue detection model using the extracted features from source code corresponding to interactable elements which are not focusable as training data.
    Type: Application
    Filed: August 21, 2023
    Publication date: February 27, 2025
    Inventors: Yuan Jie Zhang, Yi Chen Huang, Bo Zhang, Tony Ping-Chung YANG, Huai Ying HY Xia
  • Patent number: 12222317
    Abstract: An IC structure includes a biologically sensitive field-effect transistor (BioBET) in a semiconductor substrate, and a dielectric layer over a backside surface of the semiconductor substrate. The dielectric layer has a sensing well extending through the dielectric layer to a channel region of the BioFET. The IC structure further includes a biosensing film, a plurality of fluid channel walls, and a first heater. The biosensing film lines the sensing well in the dielectric layer. The fluid channel walls are over the biosensing film and define a fluid containment region over the sensing well of the dielectric layer. The first heater is in the semiconductor substrate. The first heater has at least a portion overlapping with the fluid containment region.
    Type: Grant
    Filed: November 30, 2023
    Date of Patent: February 11, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tung-Tsun Chen, Yi-Hsing Hsiao, Jui-Cheng Huang, Yu-Jie Huang
  • Patent number: 12209987
    Abstract: A biosensor includes a semiconductor layer having a first surface and a second surface opposite to the first surface, a FET device in the semiconductor layer, an isolation layer over the first surface of the semiconductor layer, a dielectric layer over the isolation layer and the first surface of the semiconductor layer, and a pair of first electrodes and a pair of second electrodes over the dielectric layer and separated from each other. The isolation layer has a rectangular opening substantially aligned with the FET device. The rectangular opening has pair of first sides and a pair of second sides. An extending direction of the pair of first sides is perpendicular to an extending direction of the pair of second sides. The pair of first electrodes is disposed over the pair of first sides, and the pair of second electrodes is disposed over the pair of second sides.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: January 28, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yi-Hsing Hsiao, Jui-Cheng Huang, Yu-Jie Huang
  • Publication number: 20140167598
    Abstract: Provided is a light emitting device including: a substrate; a light emitting diode chip; and a phosphor layer. The phosphor layer includes a first cover part and a second cover part; the first cover part is disposed on the top surface of the light emitting diode chip, and the second cover part covers the surface of the substrate at the peripheral area of the light emitting diode chip. Further, there is a height difference between the top surface of the second cover part and the top surface of the first cover part; the top surface of the second cover part is at a position lower than that of the top surface of the first cover part.
    Type: Application
    Filed: March 12, 2013
    Publication date: June 19, 2014
    Applicant: GENIUS ELECTRONIC OPTICAL CO., LTD.
    Inventors: Feng-Kuan CHEN, Yi- Jie HUANG, Lu- An CHEN