Abstract: A computer-implemented method, computer program product and computer system to automatically perform file management operations is provided. A processor identifies a plurality of files to monitor. A processor generates tracking attributes for the plurality of files. A processor monitors user interactions with the plurality of files. A processor generates prediction vectors for a plurality of file interactions based on the user interactions with the plurality of files. A processor determines at least one file in the plurality of files with tracking attributes that correlate with at least one prediction vector. A processor performs an operation on the at least one file that corresponds with the at least one prediction vector.

Abstract: Technologies related to computer-implemented conditional language models (CLMs) are described. A first CLM is trained to generate output texts based upon input texts and conditions. Output texts generated by the first CLM are included in a training set, and a second CLM is trained based upon the training set. The second CLM is then configured to receive input text and a condition and generate an output text based upon the input text and the condition.

Abstract: Methods are disclosed for manufacturing electronic packages and electronic assemblies. A method of manufacture can include encapsulating electrically conductive through-mold connections with a mold structure and removing a portion of the mold structure to expose the electrically conductive through-mold connections. The electrically conductive though-mold connections can have a higher melting point than solder connections that can connect the electrically conductive through-mold connections to a circuit board. Related electronic packages, electronic assemblies, electronic devices, and methods of mounting an electronic package to a circuit board are disclosed.

Abstract: Methods are disclosed for mounting an electronic package to a circuit board are disclosed. The electronic package can be mounted to the circuit board by use of intermediate solder portions such that each intermediate solder portion couples a corresponding through-mold connection of the electronic package to the circuit board. The through-mold connections can have a melting point in excess of a melting point of the intermediate solder portions. Related electronic packages, electronic assemblies, electronic devices, and methods of manufacturing electronic packages are disclosed.

Abstract: An electronic package is provided. The electronic package includes a substrate configured to receive one or more electronic modules, a first electronic module mounted to a first side of the substrate, a first mold structure extending over at least part of the first side of the substrate; and a group of electrically conductive through-mold connections provided on the first side of the substrate. The first mold structure substantially encapsulates the group of through-mold connections. The group of through-mold connections is exposed through the first mold structure. The group of through-mold connections is configured to couple to a circuit board by a corresponding group of intermediate solder portions. The through-mold connections can have a melting point in excess of a melting point of the intermediate solder portion. Related electronic assemblies, electronic devices, and methods of manufacturing and/or mounting an electronic package are provided.

Abstract: Software is increasingly being developed as a collection of loosely coupled applications. Loosely coupled applications exchange data by publishing data to and retrieving data from a data store, such as a database, a file located on a storage cluster, etc. Data produced by one application and consumed by another is referred to as a data dependency. In some embodiments, an application's data dependencies are identified by analyzing cached query plans associated with the application. Query plans include a hierarchical representation of a query, where non-leaf nodes represent commands and leaf nodes identify data dependencies. An application's data dependencies are identified by traversing the hierarchical representation of the query. Data dependencies consumed by the application are identified by finding leaf nodes that descend from a read command, while data dependencies produced by the application are identified by finding leaf nodes that descend from a write command.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a wafer structure. The wafer structure has a normal region and a trimmed region adjacent to the normal region. A top surface of the trimmed region is lower than a top surface of the normal region. The semiconductor structure includes a dielectric layer and a conductive layer disposed on the wafer structure in the normal region and the trimmed region. The semiconductor structure includes a protective layer disposed on a portion of the dielectric layer in the trimmed region and a portion of the conductive layer in the trimmed region. The semiconductor structure includes another dielectric layer disposed on a portion of the dielectric layer in the normal region and a portion of the conductive layer in the normal region and on the protective layer.

Abstract: An electronic device includes a substrate, a first bus line, a second bus line, a plurality of driving units, a first signal line and a second signal line. The first bus line is disposed on the substrate and outputs a first signal. The second bus line is disposed on the substrate and outputs a second signal. The driving units are disposed between the first bus line and the second bus line, and include a first driving unit and a second driving unit which are adjacent to each other. The first signal line is electrically connected to the first bus line and transmits the first signal to the first driving unit and the second driving unit. The second signal line is electrically connected to the second bus line and transmits the second signal to at least one of the first driving unit and the second driving unit.

Abstract: Methods, apparatuses, and systems that cause rendering of a gas concentration trend chart user interface on a display is provided. The gas concentration trend chart user interface includes a gas concentration data point graphic section configured to display a first data set in an hourly mode, a left graphic slider user interface element, and a right graphic slider user interface element. A first user interaction input causing a reduced graphic distance between the left graphic slider user interface element and the right graphic slider user interface element is received and identified. The reduced graphic distance is determined to satisfy a minute mode triggering distance threshold and in response to determining that the reduced graphic distance satisfies the minute mode triggering distance threshold, the gas concentration data point graphic section is caused to display a second data set in a minute mode.

Abstract: A paste extruding device for a tubular positive plate includes a plate main body. The plate main body includes a cross beam, ribs and a tab. The ribs are linearly distributed on a bottom surface of the cross beam, and the tab is provide on a top surface of the cross beam. A processing tube is sleeved outside the rib, and the processing tube has a cavity shell structure with an open top. A filling cavity is formed between the rib and the processing tube, and a sliding groove is provided at a vertical central line of an outer wall of the processing tube. A processing sliding base is slidably sleeved on the outer wall of the processing tube. A paste extruding cavity is provided at an inner top of the processing sliding base, and a cooling cavity is provided at an inner bottom of the processing sliding base.

Abstract: BCMA/TACI antigen-binding molecules are disclosed. Also disclosed are nucleic acids and expression vectors encoding, compositions comprising, and methods using, the BCMA/TACI antigen-binding molecules.

Abstract: In a method of application programming interface (API) testing, a computing device obtains an API file transmitted by a user, parses the API file, and generates an API operation relationship graph and a test oracle. The computing device generates a first test case set based on the API operation relationship graph, and triggers a service node to execute a test case in the first test case set. The computing device obtains an API request initiated in a process of executing the test case in the first test case set and a corresponding API response, and provides the user with a matching status between the test oracle and the API request initiated in the process of executing the test case in the first test case set and the API response.

Abstract: The present application is a composition including abase resin comprising between about 4% and about 15% acrylic acid monomer and an oligomer additive comprising (a) one of an acrylamide or meth(acrylamide) copolymer and (b) a high glass transition temperature monomer. The oligomer additive has a molecular weight range of between about 20,000 and about 1,000,000 and a glass transition temperature of between about 70° C. and about 115° C. The composition has a blending ratio of base resin to oligomer additive of between about 7 to about 30 parts per hundred of resin.

Abstract: Provided are a phenanthrene compound and use thereof, wherein the phenanthrene compound has the structure represented by Formula I. The phenanthrene organic compound contains a heteroarylamine structure, and at least one of Ar2 and Ar3 is selected from substituted or unsubstituted C2-C20 nitrogen-containing fused-ring heteroaryl having an electron-withdrawing property. All active sites of phenanthrene are substituted and passivated, and the phenanthrene has a stable chemical structure and high thermal stability. The phenanthrene compound thus has a high glass transition temperature and a high refractive index in the visible-light field, and when applied to the CPL layer of an organic electroluminescent device, can effectively improve the light extraction efficiency of the organic electroluminescent device, thereby improving the luminescence efficiency and service life of the organic electroluminescent device.

Abstract: The present disclosure provides fingerprint recognition substrate including fingerprint recognition units arranged in array, signal reading line groups and gating circuits, fingerprint recognition units are divided into first fingerprint recognition groups arranged along row direction, first fingerprint recognition groups, signal reading line groups and gating circuits are in one-to-one correspondence with one another; first fingerprint recognition group includes fingerprint recognition units consecutively arranged in row direction, signal reading line group includes signal reading lines each coupled to corresponding column of fingerprint recognition units; gating circuit includes switch circuits each coupled to one signal transmission channel on signal receiving unit through corresponding switch circuit; among all signal reading lines, different signal reading lines in same signal reading line group are coupled to different signal transmission channels, and at least two signal reading lines in different sign

Abstract: Provided is a display substrate. The display substrate includes a base substrate, a plurality of gate lines, a plurality of data lines, and a plurality of rows of pixels arranged in an array on the base substrate, and a plurality of shift circuits disposed on the base substrate, wherein in a plurality of pixels connected to each shift circuit, the respective pixels sharing the same data line have the same color, and each shift circuit is connected to one turn-on signal terminal.

Abstract: An integrated device package is disclosed. The integrated device package can include a carrier, an electronic component mounted on the carrier, a molding material disposed over the carrier, and an electromagnetic interference shield layer disposed over the molding material. The electronic component is at least partially disposed in the molding material. The electromagnetic interference shield layer is configured to shield the electronic component from a radio frequency signal. The electromagnetic interference shield layer has a thickness in a range between 2 ?m and 6 ?m. A surface of the electromagnetic interference shield layer includes an ink mark that has a thickness in a range between 5 ?m and 15 ?m, or a laser mark that has a depth in a range between 1 ?m and 2 ?m.

Abstract: An integrated device package is disclosed. the integrated device package can include a carrier, an electronic component mounted on the carrier, a molding material disposed over the carrier, and an electromagnetic interference shield layer disposed over the molding material. The electronic component is at least partially disposed in the molding material. At least a portion of the shield layer is in contact with the electronic component. The electromagnetic interference shield layer is configured to shield the electronic component from a radio frequency signal. A surface of the electromagnetic interference shield layer includes an ink mark or a laser mark.

Abstract: The present disclosure provides compounds and pharmaceutically acceptable salt thereof, and methods of using the same. The compounds and methods have a range of utilities as therapeutics, diagnostics, and research tools. In particular, the subject compositions and methods are useful for reducing signaling output of oncogenic proteins.