Abstract: A display apparatus including a display panel and a display driver is provided. The display driver is coupled to the display panel. The display driver is configured to drive the display panel by at least one of a plurality of gray levels to display an image frame in a first state. The display driver is configured to drive the display panel by a predetermined gray level to display a standby frame in a second state. The display driver determines the predetermined gray level of the standby frame according to the gray levels of the image frame. In addition, a driving method of a display apparatus is also provided.

Abstract: A chemical mechanical polishing (CMP) system includes a polishing pad configured to polish a substrate. The CMP system further includes a heating system configured to adjust a temperature of the polishing pad. The heating system comprises at least one heating element spaced apart from the polishing pad. The CMP system further includes a sensor configured to measure the temperature of the polishing pad.

Abstract: The current disclosure describes techniques of protecting a metal interconnect structure from being damaged by subsequent chemical mechanical polishing processes used for forming other metal structures over the metal interconnect structure. The metal interconnect structure is receded to form a recess between the metal interconnect structure and the surrounding dielectric layer. A metal cap structure is formed within the recess. An upper portion of the dielectric layer is strained to include a tensile stress which expands the dielectric layer against the metal cap structure to reduce or eliminate a gap in the interface between the metal cap structure and the dielectric layer.

Abstract: Disclosed are some examples of Phase interpolator circuitry used in retimer systems. The phase interpolator circuitry includes a phase interpolator configured to: receive the phase control signal, generate, based on the phase control signal, an output clock signal, and provide the output clock signal to the transmitter to track a plurality data packets. Phase interpolator circuitry is coupled with clock data recovery circuitry. In some implementations, clock data recovery circuitry is coupled between a receiver and a transmitter. The clock data recovery circuitry is configured to: extract a data component from an input data signal associated with the receiver, provide the data component to the transmitter, and generate a phase control signal.

Abstract: A slurry composition, a semiconductor structure and a method for forming a semiconductor structure are provided. The slurry composition includes a slurry and a precipitant dispensed in the slurry. The semiconductor structure comprises a blocking layer including at least one element of the precipitant. The method includes using the slurry composition with the precipitant to polish a conductive layer and causing the precipitant to flow into the gap.

Abstract: Methods of forming a slurry and methods of performing a chemical mechanical polishing (CMP) process utilized in manufacturing semiconductor devices, as described herein, may be performed on semiconductor devices including integrated contact structures with ruthenium (Ru) plug contacts down to a semiconductor substrate. The slurry may be formed by mixing a first abrasive, a second abrasive, and a reactant with a solvent. The first abrasive may include a first particulate including titanium dioxide (TiO2) particles and the second abrasive may include a second particulate that is different from the first particulate. The slurry may be used in a CMP process for removing ruthenium (Ru) materials and dielectric materials from a surface of a workpiece resulting in better WiD loading and planarization of the surface for a flat profile.

Abstract: A display device includes a driving substrate, an electronic ink layer, and a conductive barrier layer. The electronic ink layer is located on the driving substrate. The conductive barrier layer is located on the electronic ink layer, the conductive barrier layer includes a conductive layer and a base layer, the conductive layer is located between the base layer and the electronic ink layer, and the conductive layer is separated from the electronic ink layer.

Abstract: Disclosed are some examples of retimer circuitry, systems and methods. In some implementations, clock data recovery circuitry is coupled between a receiver and a transmitter. The clock data recovery circuitry is configured to: extract a data component from an input data signal associated with the receiver, provide the data component to the transmitter, and generate a phase control signal. Phase interpolator circuitry is coupled with the clock data recovery circuitry. The phase interpolator circuitry includes a phase interpolator configured to: receive the phase control signal, generate, based on the phase control signal, an output clock signal, and provide the output clock signal to the transmitter to track data packets of the data component.

Abstract: A flexible display device includes a supporting layer and a flexible display panel. The supporting layer has two non-folding regions and a folding region between the two non-folding regions. The folding region has a central region and two edge regions. Each of the edge regions is located between one of the two non-folding regions and the central region, and open porosities of the two edge regions are different from an open porosity of the central region. The flexible display panel is located on the supporting layer.

Abstract: Methods of forming a slurry and methods of performing a chemical mechanical polishing (CMP) process utilized in manufacturing semiconductor devices, as described herein, may be performed on semiconductor devices including integrated contact structures with ruthenium (Ru) plug contacts down to a semiconductor substrate. The slurry may be formed by mixing a first abrasive, a second abrasive, and a reactant with a solvent. The first abrasive may include a first particulate including titanium dioxide (TiO2) particles and the second abrasive may include a second particulate that is different from the first particulate. The slurry may be used in a CMP process for removing ruthenium (Ru) materials and dielectric materials from a surface of a workpiece resulting in better WiD loading and planarization of the surface for a flat profile.

Abstract: A metal-oxide semiconductor module includes multiple metal-oxide semiconductor components separated from one another by at least one first trench. Each of the metal-oxide semiconductor components includes a heavily doped semiconductor layer which includes a drain region, an epitaxial layer which is formed with an indentation such that the drain region is partially exposed from the epitaxial layer, and a metallic patterned contact unit. The epitaxial layer also includes a source region and a gate region that are spaced-apart formed therein. The metallic patterned contact unit includes source, gate, and drain patterned contacts which are electrically connected to the source, gate, and drain regions, respectively. A light-emitting diode display device including the metal-oxide semiconductor module is also disclosed.

Abstract: An enclosure for a computer proofed against being accidentally opened includes a cabinet and a cover plate, the cabinet defines a first chute, the cover plate includes a first hook structure, the first hook structure cooperates with the first chute to cover the cover plate on the cabinet. The cabinet defines a groove in the first chute, the first hook structure comprises a locking portion, and the locking portion is used to engage with the groove.

Abstract: A method for locating a wireless tag includes transmitting a first set of signals by the wireless tag in a first time period, receiving the first set of signals by a base station of at least one base station during the first time period, generating a first set of distance values according to the first set of signals received by the base station, generating a first subset of distance values by removing at least a maximum distance value and a minimum distance value from the first set of distance values, obtaining a first distance between the wireless tag and the base station by averaging the first subset of distance values, and identifying a first location of the wireless tag according to at least one first distance.

Abstract: A flexible display panel can be bent around an axis, and includes a flexible substrate and an accommodating structure. The accommodating structure is disposed on the flexible substrate and includes a plurality of polygonal microcups connected to each other, where the polygonal microcups are arranged regularly, and the axis is not substantially parallel to any sidewall of each polygonal microcup.

Abstract: A display apparatus including a display panel and a display driver is provided. The display driver is coupled to the display panel. The display driver is configured to drive the display panel by at least one of a plurality of gray levels to display an image frame in a first state. The display driver is configured to drive the display panel by a predetermined gray level to display a standby frame in a second state. The display driver determines the predetermined gray level of the standby frame according to the gray levels of the image frame. In addition, a driving method of a display apparatus is also provided.

Abstract: A method for locating a wireless tag includes transmitting a first set of signals by the wireless tag in a first time period, receiving the first set of signals by a base station of at least one base station during the first time period, generating a first set of distance values according to the first set of signals received by the base station, generating a first subset of distance values by removing at least a maximum distance value and a minimum distance value from the first set of distance values, obtaining a first distance between the wireless tag and the base station by averaging the first subset of distance values, and identifying a first location of the wireless tag according to at least one first distance.

Abstract: A display device includes an array substrate and two electronic ink layers. The array substrate includes two active regions and a folding region that connects these two active regions. The two active regions are located at two opposite sides of the folding region. The two electronic ink layers are respectively located on the two active regions. The folding region of the array substrate is located below a gap between the two electronic ink layers. When the display device is at an unfolded state, two edges of the two electronic ink layers are adjacent to each other. When the display device is at a folded state, the two electronic ink layers are located between the two active regions of the array substrate.

Abstract: Embodiments disclosed herein relate to a speech system for a vehicular device holder. The speech system can include a sensor base embedded with an inductive circuit chip and a surface for holding a device. The inductive circuit chip can comprise at least one identification code. The speech system may also include a mobile computing device coupled to the sensor base and configured with a local terminal application. The mobile computing device can be placed within the surface of the sensor base to transmit the at least one identification code. The speech system may also include a remote server that is configured to received the identification code from the mobile computing device, and authenticate the identification code, and transmit an acknowledge signal to the mobile computing device. The speech system may also include an input device coupled to the remote server and mobile computing device.

Abstract: A semiconductor device includes a first dielectric layer over a substrate, the first dielectric layer including a first dielectric material extending from a first side of the first dielectric layer distal from the substrate to a second side of the first dielectric layer opposing the first side; a second dielectric layer over the first dielectric layer; a conductive line in the first dielectric layer, the conductive line including a first conductive material, an upper surface of the conductive line being closer to the substrate than an upper surface of the first dielectric layer; a metal cap in the first dielectric layer, the metal cap being over and physically connected to the conductive line, the metal cap including a second conductive material different from the first conductive material; and a via in the second dielectric layer and physically connected to the metal cap, the via including the second conductive material.

Abstract: Semiconductor devices and methods of forming are provided. In some embodiments the semiconductor device includes a substrate, and a dielectric layer over the substrate. A first conductive feature is included in the dielectric layer, the first conductive feature comprising a first number of material layers. A second conductive feature is included in the dielectric layer, the second conductive feature comprising a second number of material layers, where the second number is higher than the first number. A first electrical connector is included overlying the first conductive feature.