Patents by Inventor Yi-Tai Chung

Yi-Tai Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6856087
    Abstract: A full-color display device is disclosed. The present invention comprises a plurality of pixel units each comprising a base, a plurality of transparent conductive substrates, a plurality of light emitting elements, and a plurality of electrode parts. The base has at least three openings formed thereon, the bottom of each opening is a reflective surface, and each of the transparent conductive substrates individually covers each opening. Each of the light emitting elements is individually disposed on one side of each transparent conductive substrate and held in each opening. Each of the electrode parts is formed on the base and electrically connected to the electrodes of the light emitting elements and the transparent conductive substrates.
    Type: Grant
    Filed: January 6, 2003
    Date of Patent: February 15, 2005
    Assignee: Highlink Technology Corporation
    Inventors: Ming-Der Lin, Kwang-Ru Wang, Shih-Cheng Huang, Ming-Fa Yeh, Yi-Tai Chung
  • Publication number: 20040070333
    Abstract: A full-color display device is disclosed. The present invention comprises a plurality of pixel units each comprising a base, a plurality of transparent conductive substrates, a plurality of light emitting elements, and a plurality of electrode parts. The base has at least three openings formed thereon, the bottom of each opening is a reflective surface, and each of the transparent conductive substrates individually covers each opening. Each of the light emitting elements is individually disposed on one side of each transparent conductive substrate and held in each opening. Each of the electrode parts is formed on the base and electrically connected to the electrodes of the light emitting elements and the transparent conductive substrates.
    Type: Application
    Filed: January 6, 2003
    Publication date: April 15, 2004
    Applicant: HIGHLINK TECHNOLOGY CORPORATION
    Inventors: Ming-Der Lin, Kwang-Ru Wang, Shih-Cheng Huang, Ming-Fa Yeh, Yi-Tai Chung