Patents by Inventor Yi Xu
Yi Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11917494Abstract: This application provides a positioning method and apparatus. The method includes: obtaining, by a positioning apparatus, information about a transmission environment of each channel in a plurality of channels for a terminal device; determining, by the positioning apparatus, a target channel from the plurality of channels based on the information about the transmission environment of each channel; and locating, by the positioning apparatus, the terminal device based on positioning measurement information of the target channel. The positioning method and apparatus provided in this application helps improve positioning accuracy.Type: GrantFiled: June 13, 2022Date of Patent: February 27, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Yi Wang, Bin Hu, Xiaodong Xu
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Patent number: 11916989Abstract: A server determines, at a first predetermined time, a default decision as to whether to provide a first media content clip after the end of a first media content item. At a second predetermined time, after the first predetermined time, the server initiates a determination of a first decision as to whether to provide the first media content clip after the end of the first media content item. In accordance with the first decision being reached within a predetermined latency period, the server provides the first media content clip to the first electronic device in accordance with the first decision. In accordance with a determination that the predetermined latency period has elapsed without the first decision being reached, provides the first media content clip to the first electronic device in accordance with the default decision.Type: GrantFiled: July 11, 2022Date of Patent: February 27, 2024Assignee: Spotify ABInventors: Shana Offen, David Saverio Susi, Aron Patrick Glennon, Aarshay Jain, Yi Yuan, Lan Xu, Yin Kwan Chung, Gautham Padmanabhan Nair, Jiming Shi, Raj Kumar Rajendran
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Patent number: 11901264Abstract: Embodiments disclosed herein include electronic packages with chocked flow cooling. In an embodiment, an electronic package may comprise a package substrate, a die electrically and mechanically coupled to the package substrate, and a lid over the die. In an embodiment, the lid has a first opening and a second opening that is opposite from the first opening. In an embodiment, the electronic package may further comprise a coolant plate covering the first opening. In an embodiment, the coolant plate comprises a first surface facing away from the die and a second surface facing the die, and a plurality of vents from the first surface to the second surface. In an embodiment, the first openings of the plurality of vents have a first dimension and second openings of the plurality of vents have a second dimension that is smaller than the first dimension.Type: GrantFiled: October 31, 2018Date of Patent: February 13, 2024Assignee: SK hynix NAND Product Solutions Corp.Inventors: Mark Forsnes, Yuhong Cai, Florence Pon, Yi Xu
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Patent number: 11900688Abstract: A computer vision processor of a camera generates hyperzooms for persons or vehicles from image frames captured by the camera. The hyperzooms include a first hyperzoom associated with the persons or vehicles. The computer vision processor tracks traffic patterns of the persons or vehicles while obviating network usage by the camera by predicting positions of the persons or vehicles using a Kalman Filter from the first hyperzoom. The persons or vehicles are detected in the second hyperzoom. The positions of the persons or vehicles are updated based on detecting the persons or vehicles in the second hyperzoom. The first hyperzoom is removed from the camera. Tracks of the persons or vehicles are generated based on the updated positions. The second hyperzoom is removed from the camera. Track metadata is generated from the tracks for storing in a key-value database located on a non-transitory computer-readable storage medium of the camera.Type: GrantFiled: January 17, 2023Date of Patent: February 13, 2024Assignee: Verkada Inc.Inventors: Yi Xu, Mayank Gupta, Xia Yang, Yuanyuan Chen, Zixiao (Shawn) Wang, Qiang (Kevin) Fu, Yunchao Gong, Naresh Nagabushan
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Patent number: 11899848Abstract: A method includes: sensing, by a mobile device when the mobile device is tethered to a head-mounted display (HMD) and when the mobile device is held by a first hand, first data; detecting, by the mobile device, information indicating which hand is used to perform a gesture from the first data; sending, by the mobile device, the information to the HMD; receiving, by the HMD, the information, and not detecting, by the HMD, the information by an image-based detection method; wherein the gesture is performed by a second hand and the information is an updated indication with respect to the gesture considering a hand switch state during a first elapsed duration from a sensing time of the first data to a sensing time of the first image data; and performing, by the HMD, side-adapted hand pose estimation on the first image data using the information.Type: GrantFiled: December 22, 2022Date of Patent: February 13, 2024Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventors: Yi Xu, Yang Zhou
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Publication number: 20240044480Abstract: A new heat dissipation structure for sealed optical machines comprises an optical machine housing, an LED light source, a light cone, a first Fresnel lens, heat insulating glass, a liquid crystal screen, a second Fresnel lens, and a reflector; the upper part of the optical machine housing is installed with a second heat dissipation fan. The invention adopts two independent heat dissipation systems inside and outside, which can greatly increase the heat dissipation performance of the optical machine, and the external heat sink of the external heat dissipation system and the light heat sink share a fan in parallel, simplifying the structure and reducing the cost. The second heat dissipation fan is integrated with the optical machine shell, which effectively reduces the height of the optical machine, reduces the volume of the optical machine, and achieves a better internal circulation, further improving the heat dissipation efficiency.Type: ApplicationFiled: March 1, 2023Publication date: February 8, 2024Inventor: Yi Xu
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Patent number: 11894334Abstract: Embodiments disclosed herein include wire bonds and tools for forming wire bonds. In an embodiment, a wire bond may comprise a first attachment ball, and a first wire having a first portion contacting the first attachment ball and a second portion. In an embodiment, the wire bond may further comprise a second attachment ball, and a second wire having a first portion contacting the second attachment ball and a second portion. In an embodiment, the second portion of the first wire is connected to the second portion of the second wire.Type: GrantFiled: October 15, 2018Date of Patent: February 6, 2024Assignee: Intel CorporationInventors: Yuhong Cai, Bilal Khalaf, Yi Xu
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Patent number: 11893273Abstract: A method of writing to a tiered memory system of a computing device, the tiered memory system including volatile memory and persistent memory (PMEM), includes the steps of: in response to a first write request including first data to write to a first page of the tiered memory system, copying contents of the first page to a second page located in the PMEM; after copying the contents of the first page to the second page, writing the first data to the second page; and after writing the first data to the second page, updating a first mapping of the tiered memory system to reference the second page instead of the first page.Type: GrantFiled: January 20, 2022Date of Patent: February 6, 2024Assignee: VMware, Inc.Inventors: Robert T. Johnson, Alexander John Horton Conway, Yi Xu, Aishwarya Ganesan, Ramnatthan Alagappan
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Publication number: 20240037425Abstract: Aspects of the present disclosure provide techniques for machine learning and rules integration. Embodiments include receiving input values corresponding to a subset of a set of input variables associated with an automated determination. Embodiments include generating a directed acyclic graph (DAG) representing a set of constraints corresponding to the set of input variables. The set of constraints relate to one or more machine learning models and one or more rules. Embodiments include receiving one or more outputs from the one or more machine learning models based on one or more of the input values. Embodiments include determining outcomes for the one or more rules based on at least one of the input values. Embodiments include populating the DAG based on the input values, the one or more outputs, and the outcomes. Embodiments include making the automated determination based on logic represented by the DAG.Type: ApplicationFiled: May 8, 2023Publication date: February 1, 2024Inventors: Sricharan Kallur Palli KUMAR, Conrad DE PEUTER, Efraim David FEINSTEIN, Nagaraj JANARDHANA, Yi Xu NG, Ian Andrew SEBANJA
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Patent number: 11878434Abstract: The present disclosure provides a visual-tactile perception apparatus and a small-sized robot. The apparatus includes a visual perception module, a tactile perception module, a control module, and a signal transmission module. The signal transmission module is separately connected to the visual perception module, the tactile perception module, and the control module. The visual perception module is configured to obtain image information of a surrounding environment of the apparatus; the tactile perception module is configured to obtain tactile information of the surrounding environment of the apparatus; the signal transmission module is configured to transmit the image information and the tactile information to the control module; and the control module is configured to generate a control instruction based on the image information and the tactile information, and transmit the control instruction.Type: GrantFiled: January 20, 2021Date of Patent: January 23, 2024Assignee: BEUING INSTITUTE OF TECHNOLOGYInventors: Qing Shi, Guanglu Jia, Tao Sun, Chen Chen, Yi Xu, Shurui Yan, Qiang Huang
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Patent number: 11879627Abstract: A new heat dissipation structure for sealed optical machines comprises an optical machine housing, an LED light source, a light cone, a first Fresnel lens, heat insulating glass, a liquid crystal screen, a second Fresnel lens, and a reflector; the upper part of the optical machine housing is installed with a second heat dissipation fan. The invention adopts two independent heat dissipation systems inside and outside, which can greatly increase the heat dissipation performance of the optical machine, and the external heat sink of the external heat dissipation system and the light heat sink share a fan in parallel, simplifying the structure and reducing the cost. The second heat dissipation fan is integrated with the optical machine shell, which effectively reduces the height of the optical machine, reduces the volume of the optical machine, and achieves a better internal circulation, further improving the heat dissipation efficiency.Type: GrantFiled: March 1, 2023Date of Patent: January 23, 2024Assignee: Xihe Technology (Shenzhen) Co., LtdInventor: Yi Xu
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Publication number: 20240018648Abstract: Embodiments of a purge ring for use in a process chamber are provided herein. In some embodiments, a purge ring includes: an annular body having an inner portion and an outer portion, wherein the inner portion includes an inner surface of the annular body, the inner surface comprising a first inner sidewall, a second inner sidewall, and a third inner sidewall, wherein the inner portion has an upper inner notch that defines the first inner sidewall and a lower inner notch that defines the second inner sidewall, wherein a third inner sidewall is disposed between the first inner sidewall and the second inner sidewall, and wherein the first inner sidewall and the second inner sidewall are disposed radially outward of the third inner sidewall.Type: ApplicationFiled: July 11, 2023Publication date: January 18, 2024Inventors: Geraldine VASQUEZ, Yi XU, Dien-yeh WU, Aixi ZHANG, Jallepally RAVI, Yu LEI
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Publication number: 20240014072Abstract: A method of forming a semiconductor device structure includes forming a nucleation layer within at least one feature. The method includes exposing the nucleation layer to a nitrogen plasma treatment. The nitrogen plasma treatment preferentially treats the top field and sidewalls while leaving the bottom surface substantially untreated to encourage bottom up metal growth.Type: ApplicationFiled: June 21, 2023Publication date: January 11, 2024Inventors: Tsung-Han YANG, Zhimin QI, Yongqian GAO, Rongjun WANG, Yi XU, Yu LEI, Xingyao GAO, Chih-Hsun HSU, Xi CEN, Wei LEI, Shiyu YUE, Aixi ZHANG, Kai WU, Xianmin TANG
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Publication number: 20240006236Abstract: A method of forming a structure on a substrate includes forming a tungsten nucleation layer within at least one feature. The method includes forming the nucleation layer via a cyclic vapor deposition process. The cyclic vapor deposition process includes forming a portion of the nucleation layer and then exposing the exposing the nucleation layer a chemical vapor transport (CVT) process to remove impurities from the portion of the nucleation layer. The CVT process may be performed at a temperature of 400 degrees Celsius or less and comprises forming a plasma from a processing gas comprising greater than or equal to 90% of hydrogen gas of a total flow of hydrogen gas and oxygen.Type: ApplicationFiled: April 11, 2023Publication date: January 4, 2024Inventors: Tsung-Han YANG, Junyeong YUN, Rongjun WANG, Yi XU, Yu LEI, Wenting HOU, Xianmin TANG
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Publication number: 20230420295Abstract: A method and apparatus for tungsten gap-fill in semiconductor devices are provided. The method includes performing a gradient oxidation process to oxidize exposed portions of a liner layer, wherein the gradient oxidation process preferentially oxidizes an overhang portion of the liner layer, which obstructs or blocks top openings of one or more features formed within a field region of a substrate. The method further includes performing an etchback process to remove or reduce the oxidized overhang portion of the liner layer, exposing the liner layer to a chemical vapor transport (CVT) process to remove metal oxide remaining from the gradient oxidation process and the etchback process, and performing a tungsten gap-fill process to fill or partially fill the one or more features.Type: ApplicationFiled: April 11, 2023Publication date: December 28, 2023Inventors: Tsung-Han YANG, Xingyao GAO, Shiyu YUE, Chih-Hsun HSU, Shirish PETHE, Rongjun WANG, Yi XU, Wei LEI, Yu LEI, Aixi ZHANG, Xianyuan ZHAO, Zhimin QI, Jiang LU, Xianmin TANG
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Patent number: 11848292Abstract: Embodiments described herein provide techniques for forming an interconnect structure that includes micro features formed therein. Such embodiments can assist with improving interconnect joint reliability when compared to conventional pads that have a flat surface. An interconnect structure may comprise: a metal pad over a substrate (e.g., a semiconductor package, a PCB, an interposer, etc.). Micro features may be formed in an edge of the metal pad or away from the edge of the metal pad. The micro features can assist with: (i) increasing the contact area between solder used to form an interconnect joint and the metal pad; and (ii) improving adherence of solder used to form an interconnect joint to the metal pad. These benefits can improve interconnect joint reliability by, among others, improving the interconnect joint's ability to absorb stress from substrates having differing coefficients of thermal expansion.Type: GrantFiled: October 11, 2018Date of Patent: December 19, 2023Assignee: Intel CorporationInventors: Sireesha Gogineni, Yi Xu, Yuhong Cai
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Publication number: 20230394850Abstract: A method and related system operations includes, determining, for each respective frame of a frame sequence, a respective bounding box that surrounds a respective sub-image of the respective frame, determining a respective string and respective confidence values associated with the respective string based on the respective sub-image, updating the tracklet to comprise the respective bounding box based on the respective string and at least one string generated by the object recognition model for a previous frame, and updating a voting table by adding the respective confidence values to the voting table. The method also includes generating an aggregated string based on the voting table by, for a set of positions of the aggregated string, determining a character associated with a maximum confidence value indicated by the voting table and associating the aggregated string with the tracklet in a data structure.Type: ApplicationFiled: August 22, 2023Publication date: December 7, 2023Inventors: Mayank GUPTA, Suraj Arun VATHSA, Song CAO, Yi XU, Yuanyuan CHEN, Yunchao GONG
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Patent number: 11830156Abstract: Techniques for rendering a 3D virtual object in an augmented-reality system are described. A system, a method, and a non-transitory memory device for augmented reality rendering of three-dimensional, virtual objects are described. In an example, a number of images of an environment are acquired; relative movement of a camera acquiring the number of images is tracked; camera pose is determined relative to the environment using the number of images and tracked relative movement of the camera; depth and normal surfaces of objects in the environment are estimated using a depth map and a normal map; a surface geometry of the environment is reconstructed using the depth map and the normal map; and the virtual object is rendered using the surface geometry of the environment.Type: GrantFiled: April 25, 2022Date of Patent: November 28, 2023Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventors: Yi Xu, Shuxue Quan
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Patent number: D1013759Type: GrantFiled: December 9, 2020Date of Patent: February 6, 2024Assignee: Shenzhen Dongzheng Optical Technology Co., LtdInventors: Yi Xu, Zhiquan Yang, Yonghui Yuan, Jieming Li, Sufan Peng
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Patent number: D1015500Type: GrantFiled: January 7, 2022Date of Patent: February 20, 2024Assignee: ZHEJIANG IKAHE SANITARY WARE CO., LTDInventors: Geng Cheng, Chen Zhu, Yi Xu