Patents by Inventor Yin-Chang Cheng

Yin-Chang Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12199393
    Abstract: A method of assembling a waterproof structure includes the following operations. Connect a first input/output connector of a circuit board to a first positioning fixture. A first elastic adhesive is combined with a first rigid board. An end of the first positioning fixture away from the first input/output connector is passed out of the first rigid board, and the first input/output connector and the first elastic adhesive are separated on two sides of the first rigid board. The circuit board is arranged in the casing, wherein the first positioning fixture is inserted from the first input/output opening on the first wall inside the casing, so that the first elastic adhesive adheres the first rigid board to the first wall of the casing, and the first elastic adhesive fills a spacing between the first positioning fixture and the first input/output opening.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: January 14, 2025
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Chia-Chen Chen, Yin-Chang Cheng, Tang-An Liu, Yung-Hung Chu, Chi-Zen Peng
  • Publication number: 20230291160
    Abstract: A method of assembling a waterproof structure includes the following operations. Connect a first input/output connector of a circuit board to a first positioning fixture. A first elastic adhesive is combined with a first rigid board. An end of the first positioning fixture away from the first input/output connector is passed out of the first rigid board, and the first input/output connector and the first elastic adhesive are separated on two sides of the first rigid board. The circuit board is arranged in the casing, wherein the first positioning fixture is inserted from the first input/output opening on the first wall inside the casing, so that the first elastic adhesive adheres the first rigid board to the first wall of the casing, and the first elastic adhesive fills a spacing between the first positioning fixture and the first input/output opening.
    Type: Application
    Filed: June 7, 2022
    Publication date: September 14, 2023
    Inventors: Chia-Chen Chen, Yin-Chang Cheng, Tang-An Liu, Yung-Hung Chu, Chi-Zen Peng
  • Publication number: 20220377444
    Abstract: A speaker includes a rubber cabinet, a driver, and a plastic connection ring. The rubber cabinet is fixed to a case of an electronic device. The rubber cabinet accommodates the driver, and the plastic connection ring is connected between the rubber cabinet and the driver. Moreover, the plastic connection ring surrounds the driver, and the rubber cabinet surrounds the plastic connection ring.
    Type: Application
    Filed: June 4, 2021
    Publication date: November 24, 2022
    Inventors: Mu-Heng TSAI, Yin-Chang CHENG, Chia-Chen CHEN, Chi-Zen PENG
  • Publication number: 20220377934
    Abstract: A heat dissipation device includes a case, a first board, a second board, a curved supporting structure, and a fan. The first board is disposed in the case. The curved supporting structure has a curved slot which is located on an inner surface of the curved supporting structure, and the curved slot extends radially with respect to a center of the curved supporting structure. The second board is inserted in the curved slot, and the first board, the second board, and the curved supporting structure collectively form an accommodating space. The fan is fixed to the second board and disposed within the accommodating space.
    Type: Application
    Filed: June 10, 2021
    Publication date: November 24, 2022
    Inventors: Yin-Chang CHENG, Chi-Zen PENG, Chia-Chen CHEN
  • Patent number: 11463805
    Abstract: A speaker includes a rubber cabinet, a driver, and a metal connection ring. The rubber cabinet is fixed to a case of an electronic device. The rubber cabinet accommodates the driver, and the metal connection ring is connected between the rubber cabinet and the driver. Moreover, the metal connection ring surrounds the driver, and the rubber cabinet surrounds the metal connection ring.
    Type: Grant
    Filed: June 4, 2021
    Date of Patent: October 4, 2022
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Yin-Chang Cheng, Mu-Heng Tsai, Chia-Chen Chen, Chi-Zen Peng