Abstract: A display apparatus includes: a display; a user input interface; a communicating device; a memory, configured to store computer instructions and data associated with the display and the communicating device; and one or more processor, connected with the display, the user input interface, the communicating device and the memory, and configured to execute the computer instructions to cause the display apparatus to: in response to a target input command received from the user input interface, obtain transmission information of a target audio stream indicated by a target identifier; and send the transmission information to a target playback apparatus, so that the target playback apparatus receives target broadcast isochronous stream, BIS, data broadcasted by the display apparatus from the target transmission channel according to the transmission information.

Abstract: A power module, having: a transformer pack; a top substrate mounted on the transformer pack; and two power device chips mounted on the top substrate, wherein each one of the power device chips has at least one pin connected to the transformer pack via the top substrate; wherein the transformer pack has a magnetic core, a first primary winding and a second primary winding, a first secondary winding and a second secondary winding, a first magnetic core part and a second magnetic core part, and wherein each one of the primary windings passes through the magnetic core, the first secondary winding is close to the first primary winding with the first magnetic core part in between, and the second secondary winding is close to the second primary winding with the second magnetic core part in between.

Abstract: A power module includes a substrate and an integrated circuit (IC) die. The IC die is disposed on the substrate. A driver and a pair of switches are integrated in the IC die. A power converter of the power module includes the driver, the pair of switches, an inductor, and a capacitor. The inductor and the capacitor are embedded within the substrate.

Abstract: A power module has a printed circuit board (PCB) having an output inductor substrate layer and an output capacitor substrate layer. Power converters of the power module are implemented using monolithic integrated circuit (IC) switch blocks that are mounted on a surface of the power module. Output voltages of the power converters are provided at output voltage nodes. The power converters include output inductors that are embedded within the output inductor substrate layer and output capacitors that are embedded within the output capacitor substrate layer. Embedded output inductors and capacitors are connected to corresponding output voltage nodes.

Abstract: A power supply module comprises an inductor pack, a top PCB (Printed Circuit Board) on top of the inductor pack, a bottom PCB disposed below the inductor pack, a connector connected between the bottom PCB and the top PCB, two power device chips on top of the top PCB, an output capacitor substrate layer disposed below the bottom PCB, and an interposer substrate layer disposed below the output capacitor substrate layer. The inductor pack comprises two inductors, each inductor having a first end and a second end. The two power device chips are respectively connected to the first ends of the two inductors via the top PCB. A first output capacitor and a second output capacitor are embedded within the output capacitor substrate layer, and are respectively connected to the second ends of the two inductors to provide a first output voltage and a second output voltage.

Abstract: A power module has a printed circuit board (PCB) having an output inductor substrate layer and an output capacitor substrate layer. Power converters of the power module are implemented using monolithic integrated circuit (IC) switch blocks that are mounted on a surface of the power module. Output voltages of the power converters are provided at output voltage nodes. The power converters include output inductors that are embedded within the output inductor substrate layer and output capacitors that are embedded within the output capacitor substrate layer. Embedded output inductors and capacitors are connected to corresponding output voltage nodes.

Abstract: A power supply module having at least one inductor modules, a top PCB mounted on top of the at least one inductor modules, and at least one pair of power device chips mounted on top of the top PCB, wherein power pins and signal pins for connecting the top PCB and a board that the at least one inductor modules are attached to, are implemented by metal layers wrapping each of the at least one inductor modules.

Abstract: The present invention provides a method for protecting a soil slope from rain erosion by improving with phosphogypsum and a microbe. The method includes: (1) placing Bacillus pasteurii in a culture medium to prepare a microbial solution, and mixing urea, calcium chloride and water to prepare a cementing solution; (2) mixing a mixture, the microbial solution and water well, and adding the cementing solution and water to prepare an improving mixture slurry; and (3) spraying the improving mixture slurry to a face of the slope twice by wet spraying, mixing the improving mixture slurry with grass seeds well, spraying to the face of the slope once, covering with a non-woven fabric by tying and fixing to the slope, and watering every day.

Abstract: The present invention provides a method for protecting a soil slope from rain erosion by improving with phosphogypsum and a microbe. The method includes: (1) placing Bacillus pasteurii in a culture medium to prepare a microbial solution, and mixing urea, calcium chloride and water to prepare a cementing solution; (2) mixing a mixture, the microbial solution and water well, and adding the cementing solution and water to prepare an improving mixture slurry; and (3) spraying the improving mixture slurry to a face of the slope twice by wet spraying, mixing the improving mixture slurry with grass seeds well, spraying to the face of the slope once, covering with a non-woven fabric by tying and fixing to the slope, and watering every day.

Abstract: Design and construction method for improving an expansive soil embankment using phosphogypsum and microbes, including the following steps: (1) placing Bacillus pasteurii into a culture medium to prepare a microbial solution, and mixing urea and calcium chloride with water to prepare a cementing fluid; (2) mixing and stirring a mixture, the microbial solution and water, adding the cementing solution well, and mixing the cementing fluid with water to prepare an improved mixture; and (3) leveling and compacting original ground, laying geomembranes, the improved mixture, and geogrids, laying a last layer of geomembrane on the top surface of the embankment after pavement of the embankment, and paving a roadbed. The design and construction method can meet construction requirements of highway embankment projects and roadbed projects of first-grade and other grades of roads, and consume solid waste phosphogypsum.