Abstract: In a SRAM cell, a Si pillar, which is a selection SGT in upper row of Si pillars, is located on the left end in X direction. A Si pillar, which is a selection SGT in lower row of Si pillars, is located on the right end. The Si pillar of the lower row is present in a width of an area extended from a contact hole in Y direction in planar view. Then, the Si pillar of the upper row is present in a width of an area extended from a contact hole in Y direction in planar view. In each of the upper row and the lower row, a TiN layer, which is a gate electrode for a loading SGT and a driving SGT, is formed to contact at side surface of entire gate region in a vertical direction between the corresponding Si pillars.

Abstract: A method for producing a pillar-shaped semiconductor device having both a CSGT mainly used in a memory cell and an ESGT used in a peripheral circuit is proposed. For a highly integrated CSGT, patterning is used 2 times in total in the X-direction and the Y-direction perpendicular to each other to form the CSGT in an overlap of band-shaped sidewalls each formed in each patterning. For an ESGT, two rectangular frame-shaped sidewalls are formed at desired positions, and the ESGT is formed in an overlap of the sidewalls. This enables formation of both the CSGT and the ESGT in the same production process under the same production conditions.

Abstract: A second band-like mask material layer having a first band-like mask material layer of a same planar shape on its top is formed on a mask material layer on a semiconductor layer. Then, fourth band-like mask material layers having third band-like mask material layers of same planar shape on their top are formed on both side surfaces of the first and second band-like mask material layers. Sixth band-like mask material layers having fifth band-like mask material layers of same planar shape on their top are formed on the outside thereof. Then, an orthogonal band-like mask material layer is formed on the first band-like mask material layer, in a direction orthogonal to a direction in which the first band-like mask material layer extends. Semiconductor pillars are formed on overlapping areas of this orthogonal band-like mask material layer and the second and sixth band-like mask material layers by etching the semiconductor layer.

Abstract: A method for forming a first impurity region 3 connected to lower portions of first semiconductor pillars and second impurity regions 4a and 4b connected to lower portions of second semiconductor pillars includes forming a semiconductor layer 100 having an impurity concentration lower than an impurity concentration of each of the first impurity region 3 and the second impurity regions 4a and 4b in impurity boundary regions of the first impurity region 3 and the second impurity regions 4a and 4b in a vertical direction and a horizontal direction.

Abstract: In a SRAM cell, a Si pillar, which is a selection SGT in upper row of Si pillars, is located on the left end in X direction. A Si pillar, which is a selection SGT in lower row of Si pillars, is located on the right end. The Si pillar of the lower row is present in a width of an area extended from a contact hole in Y direction in planar view. Then, the Si pillar of the upper row is present in a width of an area extended from a contact hole in Y direction in planar view. In each of the upper row and the lower row, a TiN layer, which is a gate electrode for a loading SGT and a driving SGT, is formed to contact at side surface of entire gate region in a vertical direction between the corresponding Si pillars.

Abstract: A second band-like mask material layer having a first band-like mask material layer of a same planar shape on its top is formed on a mask material layer on a semiconductor layer. Then, fourth band-like mask material layers having third band-like mask material layers of same planar shape on their top are formed on both side surfaces of the first and second band-like mask material layers. Sixth band-like mask material layers having fifth band-like mask material layers of same planar shape on their top are formed on the outside thereof. Then, an orthogonal band-like mask material layer is formed on the first band-like mask material layer, in a direction orthogonal to a direction in which the first band-like mask material layer extends. Semiconductor pillars are formed on overlapping areas of this orthogonal band-like mask material layer and the second and sixth band-like mask material layers by etching the semiconductor layer.

Abstract: A semiconductor device production method includes a first step of forming a planar silicon layer on a silicon substrate and forming first and second pillar-shaped silicon layers on the planar silicon layer; a second step of forming a gate insulating film around the first and second pillar-shaped silicon layers, forming a metal film and a polysilicon film around the gate insulating film, controlling a thickness of the polysilicon film to be smaller than a half of a distance between the first and second pillar-shaped silicon layers, depositing a resist, exposing the polysilicon film on side walls of upper portions of the first and second pillar-shaped semiconductor layers, etching-away the exposed polysilicon film, stripping the third resist, and etching-away the metal film; and a third step of forming a resist for forming a gate line and performing anisotropic etching to form a gate line and first and second gate electrodes.

Abstract: A semiconductor device production method includes a first step of forming a planar silicon layer on a silicon substrate and forming first and second pillar-shaped silicon layers on the planar silicon layer; a second step of forming a gate insulating film around the first and second pillar-shaped silicon layers, forming a metal film and a polysilicon film around the gate insulating film, controlling a thickness of the polysilicon film to be smaller than a half of a distance between the first and second pillar-shaped silicon layers, depositing a resist, exposing the polysilicon film on side walls of upper portions of the first and second pillar-shaped semiconductor layers, etching-away the exposed polysilicon film, stripping the third resist, and etching-away the metal film; and a third step of forming a resist for forming a gate line and performing anisotropic etching to form a gate line and first and second gate electrodes.

Abstract: A semiconductor device production method includes a first step of forming a planar silicon layer on a silicon substrate and forming first and second pillar-shaped silicon layers on the planar silicon layer; a second step of forming a gate insulating film around the first and second pillar-shaped silicon layers, forming a metal film and a polysilicon film around the gate insulating film, controlling a thickness of the polysilicon film to be smaller than a half of a distance between the first and second pillar-shaped silicon layers, depositing a resist, exposing the polysilicon film on side walls of upper portions of the first and second pillar-shaped semiconductor layers, etching-away the exposed polysilicon film, stripping the third resist, and etching-away the metal film; and a third step of forming a resist for forming a gate line and performing anisotropic etching to form a gate line and first and second gate electrodes.

Abstract: A semiconductor device production method includes preparing a first structure having a first planar semiconductor layer, and a first columnar semiconductor layer on the first planar semiconductor layer. A first high concentration semiconductor layer is formed in a lower region of the first columnar semiconductor layer and in a region of the first planar semiconductor layer below the first columnar semiconductor layer. An insulating layer, a metal film, and a semiconductor film are sequentially formed on the first structure, and the semiconductor film, the metal film, and the insulating layer are sequentially etched with each leaving a sidewall shape on the sidewall on the first columnar semiconductor layer following etching. Another semiconductor film is then formed on the sidewall shape after etching the insulating film.

Abstract: An integrated circuit system includes a substrate, forming a gate over the substrate, forming a first drift region having a first counter diffused region and a source diffused region, the first drift region in the substrate adjacent a first side of the gate, and forming a second drift region having a second counter diffused region and a drain diffused region, the second drift region in the substrate adjacent a second side of the gate opposite the first side of the gate.

Abstract: The semiconductor device according to the present invention is an nMOS SGT and is composed of a first n+ type silicon layer, a first gate electrode containing metal and a second n+ type silicon layer arranged on the surface of a first columnar silicon layer positioned vertically on a first planar silicon layer. Furthermore, a first insulating film is positioned between the first gate electrode and the first planar silicon layer, and a second insulating film is positioned on the top surface of the first gate electrode. In addition, the first gate electrode containing metal is surrounded by the first n+ type silicon layer, the second n+ type silicon layer, the first insulating film and the second insulating film.

Abstract: A semiconductor device production method includes a first step of forming a planar silicon layer on a silicon substrate and forming first and second pillar-shaped silicon layers on the planar silicon layer; a second step of forming a gate insulating film around the first and second pillar-shaped silicon layers, forming a metal film and a polysilicon film around the gate insulating film, controlling a thickness of the polysilicon film to be smaller than a half of a distance between the first and second pillar-shaped silicon layers, depositing a resist, exposing the polysilicon film on side walls of upper portions of the first and second pillar-shaped semiconductor layers, etching-away the exposed polysilicon film, stripping the third resist, and etching-away the metal film; and a third step of forming a resist for forming a gate line and performing anisotropic etching to form a gate line and first and second gate electrodes.

Abstract: The semiconductor device according to the present invention is an nMOS SGT and is composed of a first n+ type silicon layer, a first gate electrode containing metal and a second n+ type silicon layer arranged on the surface of a first columnar silicon layer positioned vertically on a first planar silicon layer. Furthermore, a first insulating film is positioned between the first gate electrode and the first planar silicon layer, and a second insulating film is positioned on the top surface of the first gate electrode. In addition, the first gate electrode containing metal is surrounded by the first n+ type silicon layer, the second n+ type silicon layer, the first insulating film and the second insulating film.

Abstract: The semiconductor device includes: a columnar silicon layer on the planar silicon layer; a first n+ type silicon layer formed in a bottom area of the columnar silicon layer; a second n+ type silicon layer formed in an upper region of the columnar silicon layer; a gate insulating film formed in a perimeter of a channel region between the first and second n+ type silicon layers; a gate electrode formed in a perimeter of the gate insulating film, and having a first metal-silicon compound layer; an insulating film formed between the gate electrode and the planar silicon layer, an insulating film sidewall formed in an upper sidewall of the columnar silicon layer; a second metal-silicon compound layer formed in the planar silicon layer; and an electric contact formed on the second n+ type silicon layer.

Abstract: The semiconductor device includes: a columnar silicon layer on the planar silicon layer; a first n+ type silicon layer formed in a bottom area of the columnar silicon layer; a second n+ type silicon layer formed in an upper region of the columnar silicon layer; a gate insulating film formed in a perimeter of a channel region between the first and second n+ type silicon layers; a gate electrode formed in a perimeter of the gate insulating film, and having a first metal-silicon compound layer; an insulating film formed between the gate electrode and the planar silicon layer, an insulating film sidewall formed in an upper sidewall of the columnar silicon layer; a second metal-silicon compound layer formed in the planar silicon layer; and an electric contact formed on the second n+ type silicon layer.

Abstract: The semiconductor device includes: a columnar silicon layer on the planar silicon layer; a first n+ type silicon layer formed in a bottom area of the columnar silicon layer; a second n+ type silicon layer formed in an upper region of the columnar silicon layer; a gate insulating film formed in a perimeter of a channel region between the first and second n+ type silicon layers; a gate electrode formed in a perimeter of the gate insulating film, and having a first metal-silicon compound layer; an insulating film formed between the gate electrode and the planar silicon layer, an insulating film sidewall formed in an upper sidewall of the columnar silicon layer; a second metal-silicon compound layer formed in the planar silicon layer; and an electric contact formed on the second n+ type silicon layer.

Abstract: A high voltage device includes a substrate with a device region defined thereon. A gate stack is disposed on the substrate in the device region. A channel region is located in the substrate beneath the gate stack, while a first diffusion region is located in the substrate on a first side of the gate stack. A first isolation structure in the substrate, located on the first side of the gate stack, separates the channel and the first diffusion region. The high voltage device also includes a first drift region in the substrate coupling the channel to the first diffusion region, wherein the first drift region comprises a non-uniform depth profile conforming to a profile of the first isolation structure.

Abstract: First example embodiments comprise forming a stress layer over a MOS transistor (such as a LDMOS Tx) comprised of a channel and first, second and third junction regions. The stress layer creates a stress in the channel and the second junction region of the Tx. Second example embodiments comprise forming a MOS FET and at least a dummy gate over a substrate. The MOS is comprised of a gate, channel, source, drain and offset drain. At least one dummy gate is over the offset drain. A stress layer is formed over the MOS and the dummy gate. The stress layer and the dummy gate improve the stress in the channel and offset drain region.

Abstract: An LDMOS device includes a substrate having a surface and a gate electrode overlying the surface and defining a channel region in the substrate below the gate electrode. A drain region is spaced apart from the channel region by an isolation region. The isolation region includes a region of high tensile stress and is configured to induce localized stress in the substrate in close proximity to the drain region. The region of high tensile stress in the isolation region can be formed by high-stress silicon oxide or high-stress silicon nitride. In a preferred embodiment, the isolation region is a shallow trench isolation region formed in the substrate intermediate to the gate electrode and the drain region.