Abstract: A ceramic electronic component includes a multilayer structure of a substantially rectangular parallelepiped shape constituted by alternately stacking dielectric layers mainly composed of ceramic and internal electrode layers alternately exposed to two edge faces opposite to each other of the multilayer structure, and cover layers mainly composed of ceramic and respectively disposed on top and bottom faces of the multilayer structure in a stack direction, wherein a Sn concentration with respect to a main component ceramic in the cover layer is higher than a Sn concentration with respect to a main component ceramic in a capacity section, the main component ceramic of each cover layer has a perovskite structure, and an atomic concentration ratio of Sn to B site elements in each cover layer is 0.005 or greater.

Abstract: A communication device for communicating with wireless communication devices is provided that includes a shield device defining a plurality of shield spaces arranged along a transport path transporting a sheet on which a plurality of wireless communication devices are arrayed; and a plurality of reader/writer antennas arranged in each of the plurality of shield spaces. Moreover, the plurality of shield spaces are juxtaposed corresponding to an array pitch between the wireless communication devices on the sheet, a part of the shield device is arranged between the plurality of reader/writer antennas, and the plurality of reader/writer antennas are arranged at a side facing a transport surface of the transport path.

Abstract: Provided is a surface treatment method of a metallic material having a protective layer formed thereon. A surface of the protective layer is scanned while irradiating the surface and the surface is scanned while moving an irradiation spot along the surface, in a state in which a side layer of the protective layer along the metallic material remains covering the metallic material, and a side layer of the protective layer opposite to the metallic material side is removed by irradiation with the laser beam.

Abstract: An electronic component module includes a first substrate, a coupling electrode and a second substrate. The coupling electrode is provided on a first surface of the first substrate, the coupling electrode is configured to be electromagnetically coupled with a conductor pattern on an antenna member. The second substrate is provided on the first surface of the first substrate, the second substrate covers the coupling electrode. A first thermal resistance between the coupling electrode and the second substrate is smaller than a second thermal resistance between the coupling electrode and the first substrate.

Abstract: A ceramic electronic component includes a multilayer structure having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, the dielectric layers being mainly composed of ceramic, the internal electrode layers being formed so as to be alternately exposed to two edge faces opposite to each other of the multilayer structure, and cover layers respectively disposed on top and bottom faces of the multilayer structure in a stack direction, the cover layers being mainly composed of ceramic, wherein at least one of a Sn concentration with respect to a main component ceramic in the cover layer or a Sn concentration with respect to a main component ceramic in a side margin section is higher than a Sn concentration with respect to a main component ceramic in a capacity section.

Abstract: A multilayer ceramic capacitor includes a multilayer body including ceramic layers, internal electrodes and a pair of side surfaces, and side margin portions, wherein each of ceramic layers and the side margin portions is composed of a polycrystalline body having a perovskite structure, wherein the side margin portions contain at least one of calcium and strontium, when the side margin portions contain calcium, an atomic ratio of the calcium to titanium in the side margin portions is greater than that in the ceramic layers, and when the side margin portions contains strontium, the atomic ratio of the strontium to titanium in the side margin portions is greater than that in the ceramic layers, wherein glass particles composed of silicon as a main component are dispersed in the polycrystalline body, and an atomic ratio of silicon to titanium is 1 at % or more and 10 at % or less.

Abstract: A ceramic electronic device includes a multilayer structure having a parallelepiped shape in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately stacked in a vertical direction, the plurality of internal electrode layers being alternately exposed to two end faces of the parallelepiped shape. A side margin section is a section covering edges of the plurality of internal electrode layers in an extension direction toward two side faces of the parallelepiped shape. The side margin section has a structure in which a plurality of dielectric layers, each containing a ceramic as a main component, and a plurality of conductive layers, each containing a metal as a main component, are alternately stacked in the vertical direction. The plurality of conductive layers are respectively spaced and separated from the plurality of internal electrode layers.

Abstract: A multilayer ceramic electronic device includes an element body and external electrodes. At least one of the pair of external electrodes includes a first metal layer and a second metal layer. The first metal layer covers a part of internal electrodes and a first portion of cover dielectric layers and side margin sections which is located on a side of the internal electrodes, does not cover a second portion of the cover dielectric layers and the side margin section which is other than the first portion, contacts a part of the internal electrodes, and has a main component of nickel or copper, at a corresponding end face of the element body. The second metal layer covers the first metal layer, contacts at least a part of the second portion on a side of the first metal layer, and has a main component of tin.

Abstract: A multi-layer ceramic capacitor includes a first region, a second region, a multi-layer unit, and a side margin. In the first region, crystal grains including intragranular pores are dispersed. In the second region, crystal grains including intragranular pores are not dispersed. The multi-layer unit includes ceramic layers that are laminated in a first direction and include the second region, and internal electrodes disposed between the ceramic layers. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction and includes a region, the region being adjacent to the multi-layer unit and including the first region.

Abstract: A wearable key device is to be used while being worn on a predetermined position of a body and includes a ring communication module, an imaging device, and a ring controller. The ring communication module is configured to wirelessly communicate with an authentication device provided to a predetermined protection object. The imaging device is configured to capture an image of the predetermined position of the body. The ring controller is configured to acquire wearer information that is biometric information of a wearer who wears the wearable key device based on the image captured by the imaging device. The wearer information is used for determining whether the wearer is an authorized user.

Abstract: A manufacturing method of a multilayer ceramic electronic device includes: forming each of stack units by forming each of internal electrode patterns on each of dielectric green sheets, the each of internal electrode patterns including Ni, Sn and Au; forming a multilayer structure by stacking the each of stack units; and firing the multilayer structure, whereby each internal electrode layer is formed from the each of internal electrode patterns and each dielectric layer is formed from the each of the dielectric green sheets wherein, in the each internal electrode layer, an Au concentration near each interface between the each internal electrode layer and the each dielectric layer is larger than an Au concentration in each center portion in a thickness direction.

Abstract: A ceramic electronic device includes a multilayer chip in which internal electrode layers are alternately stacked with dielectric layers, respectively, and are exposed alternately at a first surface and a second surface of the multilayer chip, wherein, in a capacity section in which the internal electrode layers exposed at the first and second surface overlap each other as viewed in the stacking direction, the dielectric layers are at least three dielectric layers, each dielectric layer including Sn, wherein a dielectric layer having a smaller Sn concentration is closer to an outermost end in the stacking direction than is a dielectric layer having a larger Sn concentration which is located at a center area in the stacking direction, in a relationship of at least two of the at least three dielectric layers in the capacity section.

Abstract: A ceramic electronic device includes a multilayer structure having a parallelepiped shape in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately stacked in a vertical direction, the plurality of internal electrode layers being alternately exposed to two end faces of the parallelepiped shape. A side margin section is a section covering edges of the plurality of internal electrode layers in an extension direction toward two side faces of the parallelepiped shape. The side margin section has a structure in which a plurality of dielectric layers, each containing a ceramic as a main component, and a plurality of conductive layers, each containing a metal as a main component, are alternately stacked in the vertical direction. The plurality of conductive layers are respectively spaced and separated from the plurality of internal electrode layers.

Abstract: A ceramic electronic device includes a multilayer structure in which each of a plurality of internal electrode layers and each of three or more of dielectric layers of which a main component is ceramic are alternately stacked. The three or more of dielectric layers include Sn. A dielectric layer having a smaller Sn concentration is closer to an outermost end in a stacking direction than a dielectric layer having a larger Sn concentration and being located on a center side of the stacking direction, in a relationship of at least two of the three or more of dielectric layers.

Abstract: A multi-layer ceramic electronic component, including: a capacitance forming unit that includes internal electrodes and ceramic layers, the internal electrodes being laminated in a first direction via the ceramic layers; and a circumferential unit that is provided on a circumference of the capacitance forming unit and formed of insulating ceramics. The circumferential unit includes a cover that is provided to the capacitance forming unit outward in the first direction, a side margin that is provided to the capacitance forming unit outward in a second direction orthogonal to the first direction, and a grain growth region that is formed at a boundary between the cover and the side margin and includes crystal grains of the insulating ceramics, the crystal grains having a mean grain size larger than a mean grain size of the crystal grains at a center portion of the cover.

Abstract: A manufacturing method of a multilayer ceramic electronic device includes: forming each of stack units by forming each of internal electrode patterns on each of dielectric green sheets, the each of internal electrode patterns including Ni, Sn and Au; forming a multilayer structure by stacking the each of stack units; and firing the multilayer structure, whereby each internal electrode layer is formed from the each of internal electrode patterns and each dielectric layer is formed from the each of the dielectric green sheets wherein, in the each internal electrode layer, an Au concentration near each interface between the each internal electrode layer and the each dielectric layer is larger than an Au concentration in each center portion in a thickness direction.

Abstract: A power control apparatus for an in-vehicle camera includes a temperature sensor which measures the temperature in a camera unit; a temperature data acquisition section which acquires periodically measured temperature data; a predicted temperature calculation section which calculates a temperature gradient from the acquired temperature data group and, based on the temperature gradient, calculates a future predicted camera unit temperature; a power supply section which supplies power to an image processing section; a temperature determination section which determines whether predicted temperature is within an operation guarantee temperature of camera unit component parts; and a power supply control section which, based on a determination result, issues a control command to start or stop power supply to the component parts from the power supply section, the power supply being started or stopped with appropriate timing using the predicted temperature, thereby enabling expeditious protection of the component part

Abstract: In a video image recording device, when a scene outside of a vehicle is recorded through a wind shield, a scene on the inside of a vehicle room is reflected by the wind shield and reflection glare is produced. In order to reduce the influence of this reflection glare, the video image recording device is provided with a video image capture device which obtains a first data on a general video image and a second data on a predetermined part in a vehicle room, wherein the general video image is with a reflection video image, of the predetermined part and also with a transmission video image, a graphical image conversion device which converts the second data into a third data, the third data corresponding to a reflection video image by the wind shield, and a graphical image correction device which corrects the first data based on the third data.

Abstract: A ceramic electronic device includes a multilayer chip in which a plurality of dielectric layers of which a main component is ceramic and a plurality of internal electrode layers are stacked. The plurality of internal electrode layers include Ni, Sn and Au.

Abstract: A multilayer ceramic capacitor includes a multilayer body including ceramic layers, internal electrodes and a pair of side surfaces, and side margin portions, wherein each of ceramic layers and the side margin portions is composed of a polycrystalline body having a perovskite structure, wherein the side margin portions contain at least one of calcium and strontium, when the side margin portions contain calcium, an atomic ratio of the calcium to titanium in the side margin portions is greater than that in the ceramic layers, and when the side margin portions contains strontium, the atomic ratio of the strontium to titanium in the side margin portions is greater than that in the ceramic layers, wherein glass particles composed of silicon as a main component are dispersed in the polycrystalline body, and an atomic ratio of silicon to titanium is 1 at % or more and 10 at % or less.